刚性基板喷印成形机床检测

JB/T 12460.2-2015 刚性基板喷印成形机床 第2部分：技术条件

Rigid substrate printing and forming machine tools Part 2: Technical conditions

JB/T 12460.1-2015 刚性基板喷印成形机床 第1部分：精度检验

Rigid substrate printing and forming machine tools Part 1: Accuracy inspection

IPC AM-361-1982 加法印刷板用刚性基板规范

Specification for Rigid Substrates for Additive Process Printed Boards

IPC D-330 SECTION 6-1992 第6章有机基刚性印制电路板设计

Rigid printed boards and printed board assemblies are generally subject to classifications by intended end item use. The IPC’s classification

Section Six Organic-Base Rigid Printed Board Design

DB34/T 1439-2011 刚性及多层印制板用基材

本标准适用于刚性及多层印制板用基材

Base Materials for Rigid and Multilayer Printed Boards

SJ 21081-2016 刚性印制板鉴定用测试图形

本标准规定了十四层军用刚性印制板的测试图形和布设总图。 本标准规定的测试图形适用于刚性印制板的产品鉴定和能力鉴定

Test patten for qualification of rigid printed circuit board

SJ 20748-1999 刚性印制板及刚性印制板组装件设计标准

本标准规定了刚性印制板和刚性印制板组装件的设计要求及有关注意事项。 本标准规定了各种等级印制板及其组装件的设计要求和设计指南，它既可用于商业用途也可用于军事用途。其中用于军用电子设备中的印制板和印制板组装件的独特设计要求应特别注明。除非合同另有规定，按本标准设计的军用印制板只能由经过鉴定

Design standard for rigid printed boards And rigid printed board assemblies

IPC 4101E CHINESE-2017 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE CD-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101-1997 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C-2009 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101D CD-2014 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101E-2017 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC M-105 刚性印制板手册

Rigid Printed Board Manual

JB/T 12460.2-2015 刚性基板喷印成形机床 第2部分：技术条件

Rigid substrate printing and forming machine tools Part 2: Technical conditions

JB/T 12460.1-2015 刚性基板喷印成形机床 第1部分：精度检验

Rigid substrate printing and forming machine tools Part 1: Accuracy inspection

IPC AM-361-1982 加法印刷板用刚性基板规范

Specification for Rigid Substrates for Additive Process Printed Boards

IPC D-330 SECTION 6-1992 第6章有机基刚性印制电路板设计

Rigid printed boards and printed board assemblies are generally subject to classifications by intended end item use. The IPC’s classification

Section Six Organic-Base Rigid Printed Board Design

DB34/T 1439-2011 刚性及多层印制板用基材

本标准适用于刚性及多层印制板用基材

Base Materials for Rigid and Multilayer Printed Boards

SJ 21081-2016 刚性印制板鉴定用测试图形

本标准规定了十四层军用刚性印制板的测试图形和布设总图。 本标准规定的测试图形适用于刚性印制板的产品鉴定和能力鉴定

Test patten for qualification of rigid printed circuit board

SJ 20748-1999 刚性印制板及刚性印制板组装件设计标准

本标准规定了刚性印制板和刚性印制板组装件的设计要求及有关注意事项。 本标准规定了各种等级印制板及其组装件的设计要求和设计指南，它既可用于商业用途也可用于军事用途。其中用于军用电子设备中的印制板和印制板组装件的独特设计要求应特别注明。除非合同另有规定，按本标准设计的军用印制板只能由经过鉴定

Design standard for rigid printed boards And rigid printed board assemblies

IPC 4101E CHINESE-2017 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE CD-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101-1997 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C-2009 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101D CD-2014 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101E-2017 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC M-105 刚性印制板手册

Rigid Printed Board Manual