芯片检测

IPC J-STD-012 CD-1996 倒装芯片和芯片规模技术的实施

Implementation of Flip Chip and Chip Scale Technology

IPC J-STD-012-1996 倒装芯片和芯片规模技术的实施

This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include

Implementation of Flip Chip and Chip Scale Technology

IPC J-STD-013 CD-1996 倒装芯片和芯片规模技术的实施

Implementation of Flip Chip and Chip Scale Technology

SNI 01-4304-1996 凤梨芯片

Pineapples chips

SNI 01-4306-1996 红薯芯片

Sweet potatoes chips

IPC/EIA J-STD-028-1999 倒装芯片和芯片级凸块构造性能标准

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

IPC/EIA J-STD-028 CD-1999 倒装芯片和芯片级凸块构造性能标准

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

ES 59008-5-1-2001 半导体芯片的数据要求第 5-1 部分：芯片类型的特殊要求和建议 裸芯片

Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die

DS/ES 59008-5-1:2001 半导体芯片的数据要求 第 5-1 部分：芯片类型的特殊要求和建议 裸芯片

The European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures

Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

IPC J-STD-027-2003 倒装芯片和芯片尺寸配置的机械大纲标准

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC J-STD-027 CD-2003 倒装芯片和芯片尺寸配置的机械外形标准

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

JEDEC JESD22-B109-2002 倒装芯片张力

This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other

Flip Chip Tensile Pull

JEDEC JESD22-B109A-2009 倒装芯片拉力

Flip Chip Tensile Pull

JEDEC JESD22-B109B-2014 倒装芯片拉力

Flip Chip Tensile Pull

PAS 62084-1998 倒装芯片和芯片级技术的实施（1.0 版；替代品）

Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

IPC J-STD-012 CD-1996 倒装芯片和芯片规模技术的实施

Implementation of Flip Chip and Chip Scale Technology

IPC J-STD-012-1996 倒装芯片和芯片规模技术的实施

This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include

Implementation of Flip Chip and Chip Scale Technology

IPC J-STD-013 CD-1996 倒装芯片和芯片规模技术的实施

Implementation of Flip Chip and Chip Scale Technology

SNI 01-4304-1996 凤梨芯片

Pineapples chips

SNI 01-4306-1996 红薯芯片

Sweet potatoes chips

IPC/EIA J-STD-028-1999 倒装芯片和芯片级凸块构造性能标准

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

IPC/EIA J-STD-028 CD-1999 倒装芯片和芯片级凸块构造性能标准

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

ES 59008-5-1-2001 半导体芯片的数据要求第 5-1 部分：芯片类型的特殊要求和建议 裸芯片

Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die

DS/ES 59008-5-1:2001 半导体芯片的数据要求 第 5-1 部分：芯片类型的特殊要求和建议 裸芯片

The European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures

Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

IPC J-STD-027-2003 倒装芯片和芯片尺寸配置的机械大纲标准

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC J-STD-027 CD-2003 倒装芯片和芯片尺寸配置的机械外形标准

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

JEDEC JESD22-B109-2002 倒装芯片张力

This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other

Flip Chip Tensile Pull

JEDEC JESD22-B109A-2009 倒装芯片拉力

Flip Chip Tensile Pull

JEDEC JESD22-B109B-2014 倒装芯片拉力

Flip Chip Tensile Pull

PAS 62084-1998 倒装芯片和芯片级技术的实施（1.0 版；替代品）

Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)