波峰焊/回流焊/烘隧设备检测

T/GDCKCJH 053-2021 回流焊、波峰焊隧道炉温度性能要求与检测方法

本文件规定了回流焊、波峰焊隧道炉的术语和定义、温度性能要求及检测方法

Temperature performance requirements and test method for tunnel furnace of reflow soldering & wave soldering

IPC 7530A CHINESE-2017 大批量焊接工艺（回流焊和波峰焊）的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

IPC 7530 CHINESE-2001 大批量焊接工艺（回流焊和波峰焊）的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC 7530 HUNGARIAN-2001 大批量焊接工艺（回流焊和波峰焊）工艺的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) Processes

IPC TA-722 SECTION 5 波峰焊

This section deals with selecting the appropriate subassembly

Wave Soldering

MSZ MI 2178-1975 波峰焊接

wave soldering

SAE ARP1332A-1988 波峰焊程序

Wave Soldering Procedure

SAE ARP1332B-1997 波峰焊程序

Wave Soldering Procedure

SAE ARP1332C-2007 波峰焊程序

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations

Wave Soldering Procedure

SAE ARP1332-1974 波峰焊实践

WAVE SOLDERING PRACTICE

SAE ARP1332D-2013 波峰焊程序

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations

Wave Soldering Procedure

IPC TM-650 2.4.14.1-1979 焊接,波峰焊方法(提案)

IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing

Solderability, Wave Solder Method; (Proposal)

DS/EN IEC 60974-13:2021 弧焊设备第13部分：焊接电流回流钳

Arc welding equipment – Part 13: Welding current return clamp

JB/T 7488-1994 波峰焊工艺规范

本规范规定了波峰焊工艺的工艺条件、操作方法及工艺管理。 本规范适用于仪器仪表印制电路板的波峰焊。其它行业印制电路板的波峰焊亦可参照执行

Wave Soldering Process Specification

IEC 60974-4:2016 弧焊设备第13部分:焊接回流夹

This part of IEC 60974 specifies test procedures for periodic inspection and@ after repair@ to ensure electrical safety. These test procedures

Arc welding equipment - Part 13: Welding current return clamp

T/GDCKCJH 053-2021 回流焊、波峰焊隧道炉温度性能要求与检测方法

本文件规定了回流焊、波峰焊隧道炉的术语和定义、温度性能要求及检测方法

Temperature performance requirements and test method for tunnel furnace of reflow soldering & wave soldering

IPC 7530A CHINESE-2017 大批量焊接工艺（回流焊和波峰焊）的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

IPC 7530 CHINESE-2001 大批量焊接工艺（回流焊和波峰焊）的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC 7530 HUNGARIAN-2001 大批量焊接工艺（回流焊和波峰焊）工艺的温度曲线指南

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) Processes

IPC TA-722 SECTION 5 波峰焊

This section deals with selecting the appropriate subassembly

Wave Soldering

MSZ MI 2178-1975 波峰焊接

wave soldering

SAE ARP1332A-1988 波峰焊程序

Wave Soldering Procedure

SAE ARP1332B-1997 波峰焊程序

Wave Soldering Procedure

SAE ARP1332C-2007 波峰焊程序

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations

Wave Soldering Procedure

SAE ARP1332-1974 波峰焊实践

WAVE SOLDERING PRACTICE

SAE ARP1332D-2013 波峰焊程序

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations

Wave Soldering Procedure

IPC TM-650 2.4.14.1-1979 焊接,波峰焊方法(提案)

IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing

Solderability, Wave Solder Method; (Proposal)

DS/EN IEC 60974-13:2021 弧焊设备第13部分：焊接电流回流钳

Arc welding equipment – Part 13: Welding current return clamp

JB/T 7488-1994 波峰焊工艺规范

本规范规定了波峰焊工艺的工艺条件、操作方法及工艺管理。 本规范适用于仪器仪表印制电路板的波峰焊。其它行业印制电路板的波峰焊亦可参照执行

Wave Soldering Process Specification

IEC 60974-4:2016 弧焊设备第13部分:焊接回流夹

This part of IEC 60974 specifies test procedures for periodic inspection and@ after repair@ to ensure electrical safety. These test procedures

Arc welding equipment - Part 13: Welding current return clamp