发布时间：2024-05-27 17:49:26 - 更新时间：2024年06月29日 15:22
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This European Standard specifies equipment and procedures for determiningThe tensile bond strength of theadhesive and of the base coat toTheThermal
Thermal insulation products for building applications - Determination of the tensile bond strength of the adhesive and of the base coat to the thermal insulation material
This International Standard relates to grid systems for printed circuits to ensure compatibility between the printed circuits and parts
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
The durability of laminations on extruded particle boards is particularly determined by the strength of the bond between base board and lamination
Particle boards - Determination of internal bond of layers of extruded boards
Wall masonry constructions. Test method for bond strength of facing tiles with the base
Schválení normy ST SEV 5384-88 doporu?ilo ministerstvo pr?myslu ?SR Zpracovatel: IRAPA, Praha - Bla?ena Heroutová Oborové normaliza?ní st?edisko
Corrugated board. Pin adhesion test
本标准规定了测定绝热材料与粘结剂和基底涂层的拉伸粘结强度的设备和步骤
Thermal insulation products for building applications.Determination of the tensile bond strength of the adhesive and of the base coat to the thermal insulation material
Wall masonry constructions. Test methods for bond strength of facing tiles with the base
This part of ISO 13765 describes a method of determination of the flexural bonding strength of the bonded face between refractory bricks laid
Refractory mortars -- Part 4: Determination of flexural bonding strength
Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond
Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
Specifies a method for the determination of the bond strength in the surface layers of woodbased panels. The failing stress is determined by applying
Surface bond strength of particle boards
Materials for interlinings with thermoplastic coating. Method for determination of bonding strength
本标准规定了一种测量管道防腐层与金属粘结的剪切强度的试验方法。本标准适用于在规定的制备和试验条件下，通过对标准的单面搭接试件的试验，测定管道防腐层与金属粘结的剪切强度
Test method for apparent shear strength of pipeline coatings to metal
This standard establishes the requiremenftos r the design of printed boards for PC card form factors. The organic materials may be homogeneous
High Temperature Mechanical Strength Retention of Adhesives
Testing methods for bonding strength of wall boards adhesives
Testing methods for bonding strength of wall boards adhesives
This European Standard specifies equipment and procedures for determiningThe tensile bond strength of theadhesive and of the base coat toTheThermal
Thermal insulation products for building applications - Determination of the tensile bond strength of the adhesive and of the base coat to the thermal insulation material
This International Standard relates to grid systems for printed circuits to ensure compatibility between the printed circuits and parts
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
The durability of laminations on extruded particle boards is particularly determined by the strength of the bond between base board and lamination
Particle boards - Determination of internal bond of layers of extruded boards
Wall masonry constructions. Test method for bond strength of facing tiles with the base
Schválení normy ST SEV 5384-88 doporu?ilo ministerstvo pr?myslu ?SR Zpracovatel: IRAPA, Praha - Bla?ena Heroutová Oborové normaliza?ní st?edisko
Corrugated board. Pin adhesion test
本标准规定了测定绝热材料与粘结剂和基底涂层的拉伸粘结强度的设备和步骤
Thermal insulation products for building applications.Determination of the tensile bond strength of the adhesive and of the base coat to the thermal insulation material
Wall masonry constructions. Test methods for bond strength of facing tiles with the base
This part of ISO 13765 describes a method of determination of the flexural bonding strength of the bonded face between refractory bricks laid
Refractory mortars -- Part 4: Determination of flexural bonding strength
Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond
Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
Specifies a method for the determination of the bond strength in the surface layers of woodbased panels. The failing stress is determined by applying
Surface bond strength of particle boards
Materials for interlinings with thermoplastic coating. Method for determination of bonding strength
本标准规定了一种测量管道防腐层与金属粘结的剪切强度的试验方法。本标准适用于在规定的制备和试验条件下，通过对标准的单面搭接试件的试验，测定管道防腐层与金属粘结的剪切强度
Test method for apparent shear strength of pipeline coatings to metal
This standard establishes the requiremenftos r the design of printed boards for PC card form factors. The organic materials may be homogeneous
High Temperature Mechanical Strength Retention of Adhesives
Testing methods for bonding strength of wall boards adhesives
Testing methods for bonding strength of wall boards adhesives
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