发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22
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This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under
Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials
This standard shows a survey of properties of plastic films being used in the packaging industry
Films for packaging; plastic films; properties, testing
The General Services Administration has authorized the use of this Commercial Item Description in preference to Federal Specification GG-M-125
MARKER SET, X-RAY FILM IDENTIFICATION
Film couplers
この規格は,主に包装用途に使用するナイロン6からなる誘明な2軸延伸ナィロンフィルムて(以下,フィルムという。)について規定する
Biaxially oriented nylon films for packaging
This Standard specifies biaxially oriented transparent polyamide (nylon )films, which are composed of PA6, mainly used packaging (hereafter referred
Biaxially oriented nylon films for packaging
Films for packaging - Plastic films - Properties, testing
Films for packaging - Plastic films - Properties, testing
Packaging test - Test methods for packaging films - Part 4: Determination of the shrinkage of polyethylene films
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 2 : tensile testing methods of thin film materials.
This test method covers the determination of yield (area per unit mass) of plastic film. Also described in this test method is the means
Test Method for Package Yield of Plastic Film (08.02)
This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under
Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials
This standard shows a survey of properties of plastic films being used in the packaging industry
Films for packaging; plastic films; properties, testing
The General Services Administration has authorized the use of this Commercial Item Description in preference to Federal Specification GG-M-125
MARKER SET, X-RAY FILM IDENTIFICATION
Film couplers
この規格は,主に包装用途に使用するナイロン6からなる誘明な2軸延伸ナィロンフィルムて(以下,フィルムという。)について規定する
Biaxially oriented nylon films for packaging
This Standard specifies biaxially oriented transparent polyamide (nylon )films, which are composed of PA6, mainly used packaging (hereafter referred
Biaxially oriented nylon films for packaging
Films for packaging - Plastic films - Properties, testing
Films for packaging - Plastic films - Properties, testing
Packaging test - Test methods for packaging films - Part 4: Determination of the shrinkage of polyethylene films
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 2 : tensile testing methods of thin film materials.
This test method covers the determination of yield (area per unit mass) of plastic film. Also described in this test method is the means
Test Method for Package Yield of Plastic Film (08.02)