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MIL-HDBK-175, dated 1 May 1968, has been reviewed and determined to be valid for use in acquistion
MICROELECTRONIC DEVICE DATA HANDBOOK
This document provides guidance for the selection and application of microetectronic devices in Military systems. Emphasis is placed upon
MICROELECTRONIC DEVICE DATA HANDBOOK
本标准规定了军用微电子器件的环境、机械、电气试验方法和试验程序，以及为保证微电子器件满足预定用途所要求的质量和可靠性而必须的控制和限制措施。 本标准适用于军用及空间应用的微电子器件。 如果承制方标明或声称其半导体集成电路符合本标准的规定，则必须满足方法5004、5005或
Test methods and procedures for microelectronic device
Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
color codes for lead wires of microwave devices
Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
These test methods provide a field technique for the bacteriological analysis of electronic process waters. The sampling
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
1.1 These test methods cover sampling and analysis of high purity water from water purification systems and water transmission systems
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
MIL-HDBK-175, dated 1 May 1968, has been reviewed and determined to be valid for use in acquistion
MICROELECTRONIC DEVICE DATA HANDBOOK
This document provides guidance for the selection and application of microetectronic devices in Military systems. Emphasis is placed upon
MICROELECTRONIC DEVICE DATA HANDBOOK
本标准规定了军用微电子器件的环境、机械、电气试验方法和试验程序，以及为保证微电子器件满足预定用途所要求的质量和可靠性而必须的控制和限制措施。 本标准适用于军用及空间应用的微电子器件。 如果承制方标明或声称其半导体集成电路符合本标准的规定，则必须满足方法5004、5005或
Test methods and procedures for microelectronic device
Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
color codes for lead wires of microwave devices
Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
These test methods provide a field technique for the bacteriological analysis of electronic process waters. The sampling
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
1.1 These test methods cover sampling and analysis of high purity water from water purification systems and water transmission systems
Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
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