IEC 60326-3:1991 印制电路板 第3部分:印制电路板的设计和使用
Contains fundamental information on the design and the application of printed boards, their technical limitations and the features and characteristics
Printed boards; part 3: design and use of printed boards
KS C IEC 60326-3:2003 印制电路板.第3部分:印制电路板的设计和应用
이 규격은 제조 방법에 관계 없이, 인쇄 회로기판의 설계 및 사용과 관련되며 인쇄 회로
Printed boards-Part 3:Design and use of printed boards
BS EN 62326-4:1997 印制电路板.层间连接刚性印制电路板.分规范
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which
Printed boards - Rigid multilayer printed boards with interlayer connections - Sectional specification
DB44/T 1179-2013 印制电路板钢网印刷机
本标准规定了印制电路板钢网印刷机的术语和定义、要求、试验方法、检验规则以及标志和使用说明书、包装、运输、贮存。 本标准适用于电子行业中将锡膏印刷在印制电路板上的印制电路板钢网印刷机（以下简称网印机
IPC MI-660 2.0-1984 印制电路板层板
IPC Standards and Publications are designed to serve the public interest throughIPC Standards and Publications are designed to serve the public
Printed Board Laminates
IPC MI-660 SECTION 2 印制电路板层板
Printed Board Laminates
Printed Board Laminates
MI 11457/3-1980 印制电路，印制电路板的设计和使用
BS 6221-6:1982 印制电路板.第6部分:多层印制电路板规定方法
Fundamental information on characteristics to be assessed and requirements for the boards irrespective of their method of manufacture and includes
Printed wiring boards - Specification for multilayer printed wiring boards
JIS C5014-1994 多层印制电路板
この規格は，主に電子機器に用いる多層プリント配線板（以下,プリント板という.）について規定する。ただし.多層フレキシブルプリント配線板.多層フレックスリジッドプリント配線板及びメタルコアプリント配線板には，適用しない
Multilayer printed wiring boards
QJ 201-1981 印制电路板技术条件
QJ 519A-1999 印制电路板试验方法
QJ 3103-1999 印制电路板设计规范
QJ 2830-1996 印制电路板导轨规范
DB34/T 1437-2011 高密度印制电路板
本标准适用于高密度印制电路板
High Density Printed Circuit Board
BS EN 62326-1:2002 印制电路板.总规范
This part of IEC 62326 defines capability approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval
Printed boards - Generic specification
IEC 60326-3:1991 印制电路板 第3部分:印制电路板的设计和使用
Contains fundamental information on the design and the application of printed boards, their technical limitations and the features and characteristics
Printed boards; part 3: design and use of printed boards
KS C IEC 60326-3:2003 印制电路板.第3部分:印制电路板的设计和应用
이 규격은 제조 방법에 관계 없이, 인쇄 회로기판의 설계 및 사용과 관련되며 인쇄 회로
Printed boards-Part 3:Design and use of printed boards
BS EN 62326-4:1997 印制电路板.层间连接刚性印制电路板.分规范
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which
Printed boards - Rigid multilayer printed boards with interlayer connections - Sectional specification
DB44/T 1179-2013 印制电路板钢网印刷机
本标准规定了印制电路板钢网印刷机的术语和定义、要求、试验方法、检验规则以及标志和使用说明书、包装、运输、贮存。 本标准适用于电子行业中将锡膏印刷在印制电路板上的印制电路板钢网印刷机（以下简称网印机
IPC MI-660 2.0-1984 印制电路板层板
IPC Standards and Publications are designed to serve the public interest throughIPC Standards and Publications are designed to serve the public
Printed Board Laminates
IPC MI-660 SECTION 2 印制电路板层板
Printed Board Laminates
Printed Board Laminates
MI 11457/3-1980 印制电路，印制电路板的设计和使用
BS 6221-6:1982 印制电路板.第6部分:多层印制电路板规定方法
Fundamental information on characteristics to be assessed and requirements for the boards irrespective of their method of manufacture and includes
Printed wiring boards - Specification for multilayer printed wiring boards
JIS C5014-1994 多层印制电路板
この規格は，主に電子機器に用いる多層プリント配線板（以下,プリント板という.）について規定する。ただし.多層フレキシブルプリント配線板.多層フレックスリジッドプリント配線板及びメタルコアプリント配線板には，適用しない
Multilayer printed wiring boards
QJ 201-1981 印制电路板技术条件
QJ 519A-1999 印制电路板试验方法
QJ 3103-1999 印制电路板设计规范
QJ 2830-1996 印制电路板导轨规范
DB34/T 1437-2011 高密度印制电路板
本标准适用于高密度印制电路板
High Density Printed Circuit Board
BS EN 62326-1:2002 印制电路板.总规范
This part of IEC 62326 defines capability approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval
Printed boards - Generic specification
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