发布时间：2024-05-27 17:49:26 - 更新时间：2024年06月29日 15:22
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Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
本总规范适用于膜集成电路和混合膜集成电路（F＆HFICs），包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F＆HFICs。 本规范适用于供用户继续加工的半成品F＆HFICs，也适用于装有一个以上芯片的片式载体电路，而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
Gives the requirements for certain categories or subcategories of interface integrated circuits. To be read in conjunction with BS 6493-1.1:1984, BS
Semiconductor devices. Integrated circuits. Interface integrated circuits
This part of IEC 60748 is applicable for the following categories or subcategories of devices: - combinatorial and sequential digital circuits
Semiconductor devices - Integrated circuits - Digital integrated circuits
Semiconductor devices. Integrated circuits. Digital integrated circuits
Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
This part of IEC 63011 provides definitions pertaining to multichip integrated circuits@ as vertically stacked dies using through-silicon vias (TSVs
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
本规范的目的是给出低压集成电路不同分组的接口规范，包括电源电压值、容差和最坏情况下的输入、输出电压极限值。 同时给出每类标称电源电压的两种接口规范：正常范围和宽范围。正常范围是依据工业标准制定的，典型容差大约是10%。宽范围是扩展到一个较宽的范围，可以使电池继续工作的实际值
Semiconductor devices Integrated circuits Part 2-20: Digital integrated circuits Family specification Low voltage integrated circuits
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸，适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
Sectional specification: film and hybrid integrated circuits
Also covers partly-completed film integrated circuits and hybrid film integrated circuits, both active and passive, supplied to customers
Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
本标准给出了下列模拟集成电路分类型的标准： ----运算放大器（双输入和单输入）； ----用于线电通讯的音频放大器、视频放大器和多路放大器； ----射频放大器和中频放大器； ----电压调整器和电流调整器； ----模拟信号开关电路； ----开关电源控制电路
Semiconductor devices Integrated circuits Part 3:Analogue integrated circuits
本标准给出了下列各类或各分类器件的标准： --组合和时序数字电路； --存储器集成电路； --微处理器集成电路； --电荷转移器件
Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
本标准规定了额定电压8.7/15kV及以下电力系统用铜芯船用电缆的一般结构和试验要求
Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
本总规范适用于膜集成电路和混合膜集成电路（F＆HFICs），包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F＆HFICs。 本规范适用于供用户继续加工的半成品F＆HFICs，也适用于装有一个以上芯片的片式载体电路，而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
Gives the requirements for certain categories or subcategories of interface integrated circuits. To be read in conjunction with BS 6493-1.1:1984, BS
Semiconductor devices. Integrated circuits. Interface integrated circuits
This part of IEC 60748 is applicable for the following categories or subcategories of devices: - combinatorial and sequential digital circuits
Semiconductor devices - Integrated circuits - Digital integrated circuits
Semiconductor devices. Integrated circuits. Digital integrated circuits
Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
This part of IEC 63011 provides definitions pertaining to multichip integrated circuits@ as vertically stacked dies using through-silicon vias (TSVs
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
本规范的目的是给出低压集成电路不同分组的接口规范，包括电源电压值、容差和最坏情况下的输入、输出电压极限值。 同时给出每类标称电源电压的两种接口规范：正常范围和宽范围。正常范围是依据工业标准制定的，典型容差大约是10%。宽范围是扩展到一个较宽的范围，可以使电池继续工作的实际值
Semiconductor devices Integrated circuits Part 2-20: Digital integrated circuits Family specification Low voltage integrated circuits
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸，适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
Sectional specification: film and hybrid integrated circuits
Also covers partly-completed film integrated circuits and hybrid film integrated circuits, both active and passive, supplied to customers
Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
本标准给出了下列模拟集成电路分类型的标准： ----运算放大器（双输入和单输入）； ----用于线电通讯的音频放大器、视频放大器和多路放大器； ----射频放大器和中频放大器； ----电压调整器和电流调整器； ----模拟信号开关电路； ----开关电源控制电路
Semiconductor devices Integrated circuits Part 3:Analogue integrated circuits
本标准给出了下列各类或各分类器件的标准： --组合和时序数字电路； --存储器集成电路； --微处理器集成电路； --电荷转移器件
Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
本标准规定了额定电压8.7/15kV及以下电力系统用铜芯船用电缆的一般结构和试验要求
Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
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