印制电路板组件和电子元器件检测

📅 发布时间:2024-05-27 👤 来源:北检院 👁 阅读:

BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

NF C93-722:1980 电子元件.印刷板配线.印刷电路板组件的返工

Electronic components. Printed wiring. Rework of printed boards assemblies.

NF C93-723:1979 电子元件印制线路修正印制板

Electronic Components Printed wiring Rework of Printed Boards

Electronic Components Printed wiring Rework of Printed Boards

NF C93-401:1985 电子元件.双部件和棱形插座.印制电路板用连接器

Electronic components. Two part and edge socket. Connectors for printed board application.

IPC 9502-1999 电子元件的印制线路板组装焊接工艺指引

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC- 9504 and J-STD-020 would survive

PWB Assembly Soldering Process Guideline for Electronic Components

BS PD IEC TR 61191-8:2021 印制板组件 汽车电子控制单元中使用的印刷电路板组件焊点中的空隙 最佳实践

Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况

이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여

Printed boards and printed board assemblies-Design and use-Part 1-1:Generic requirements-Flatness considerations for electronic assemblies

BS 6943:1988 印制电路板布局用电子元件形状分类

Classifies the shapes of the most commonly used components to assist in the design procedures involved in their location and connection on printed

Classification of shapes of electronic components for placement on printed wiring boards

KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑

NF C93-721:1980 电子元件 印刷板配线 印刷电路板的返工

Electronic components. Printed wiring. Rework of printed boards.

IPC PE-740A SECTION 18-1997 印制电路板组件清洗

IPC Standards and Publications are designed to serve the public interest through

Cleaning of Printed Board Assemblies

KS C IEC 61188-7-2012(2022 印刷电路板和印刷电路板组件-设计和使用-第7部分:CAD库构建用电子元件零方位

Printed boards and printed board assemblies-Design and use-Part 7:Electronic component zero orientation for CAD library construction

NF C93-706:1983 电子元件.经质量评估的印刷电路板.多层印制电路板.分规范

Electronic components. Printed boards of assessed quality. Multilayer printed boards. Sectional specification.

DIN EN 61188-5-2:2004 印制电路板和印制电路板组件.设计和使用.第5-2部分:焊接(焊接区/接缝)条件.分立元件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003

BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

NF C93-722:1980 电子元件.印刷板配线.印刷电路板组件的返工

Electronic components. Printed wiring. Rework of printed boards assemblies.

NF C93-723:1979 电子元件印制线路修正印制板

Electronic Components Printed wiring Rework of Printed Boards

Electronic Components Printed wiring Rework of Printed Boards

NF C93-401:1985 电子元件.双部件和棱形插座.印制电路板用连接器

Electronic components. Two part and edge socket. Connectors for printed board application.

IPC 9502-1999 电子元件的印制线路板组装焊接工艺指引

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC- 9504 and J-STD-020 would survive

PWB Assembly Soldering Process Guideline for Electronic Components

BS PD IEC TR 61191-8:2021 印制板组件 汽车电子控制单元中使用的印刷电路板组件焊点中的空隙 最佳实践

Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况

이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여

Printed boards and printed board assemblies-Design and use-Part 1-1:Generic requirements-Flatness considerations for electronic assemblies

BS 6943:1988 印制电路板布局用电子元件形状分类

Classifies the shapes of the most commonly used components to assist in the design procedures involved in their location and connection on printed

Classification of shapes of electronic components for placement on printed wiring boards

KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑

NF C93-721:1980 电子元件 印刷板配线 印刷电路板的返工

Electronic components. Printed wiring. Rework of printed boards.

IPC PE-740A SECTION 18-1997 印制电路板组件清洗

IPC Standards and Publications are designed to serve the public interest through

Cleaning of Printed Board Assemblies

KS C IEC 61188-7-2012(2022 印刷电路板和印刷电路板组件-设计和使用-第7部分:CAD库构建用电子元件零方位

Printed boards and printed board assemblies-Design and use-Part 7:Electronic component zero orientation for CAD library construction

NF C93-706:1983 电子元件.经质量评估的印刷电路板.多层印制电路板.分规范

Electronic components. Printed boards of assessed quality. Multilayer printed boards. Sectional specification.

DIN EN 61188-5-2:2004 印制电路板和印制电路板组件.设计和使用.第5-2部分:焊接(焊接区/接缝)条件.分立元件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003

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