TS 2092-1975 电子器件和电子设备测试基本环境测试规程 J：霉菌的生长
BASIC ENVIRONMENTAL TESTING PROCEDURES FOR ELECTRONIC COMPONENTS AND ELECTRONIC EQUIPMENT TEST J : MOULD GROWTH
GJB 4.10-1983 舰船电子设备环境试验 霉菌试验
HB 5830.13-1986 机载设备环境条件及试验方法 霉菌
本标准是HB5830《机载设备环境条件及试验方法》系列标准的组成部分，必须与HB5830.1-84《机载设备环境条件及试验方法 总则》一起使用
NF C93-171:1985 电子设备元件.微调电容器
Components for electronic equipment. Trimmer capacitors.
NF C90-512:1983 电子设备元件.电子元件尺寸的测量
Components for electronic equipment. Measurement of the dimensions of electronic components.
JIS C0801-1964 电子设备用元器件的颜色码
Color code for electronic parts
IEEE 200-1957 电气及电子元件和设备的基准名称
Reference designations for electrical and electronics parts and equipment
IEEE 200-1975 电气及电子元件和设备的基准名称
Reference designations for electrical and electronics parts and equipment
GOST 26080-1984 线电电子设备和电子工业产品.对防霉菌的一般要求
Mould fungi protection of radioelectronic equipment and electronic technique articles. General requirements
BS EN 60512-11-5:2002 电子设备连接器.试验和测量.气候试验.试验11e.霉菌生长
This part of IEC 60512, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical
Connectors for electronic equipment - Tests and measurements - Climatic tests - Test 11e - Mould growth
NF C93-611:1975 电子设备元件.压电器件.振荡器用石英晶体器件
Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
ECA CB8-1981 美国及其他国家和电子元器件及电子设备相关的批准机构清单
This EIA Engineering Bulletin was developed by the Association staff personnel from information supplied by member companies.We appreciate the efforts
List of Approval Agencies, U.S. and Other Countries, Impacting Electronic Components and Equipment
NF C93-110:1971 电子设备元件.铝固定电子电容器.一般要求
Components for electronic equipment. Fixed aluminium electronic capacitors. General requirements.
BS EN 2591:6306:2001 电气和光学连接元件.试验方法.光学元件.霉菌生长
To be read in conjunction with EN 2591-100
Elements of electrical and optical connection - Test methods - Optical elements - Mould growth
GB/T 13947-1992 电子元器件塑料封装设备通用技术条件
本标准规定了电子元器件塑料封装设备（以下简称塑封设备）的术语、产品分类、技术要求、试验方法、检验规则及标志、包装、运输、贮存等。 本标准适用于塑料封装集成电路、半导体分立器件、电阻、电容等电子元器件的四柱立式塑料封装设备
General specification for electronic components plastic packaging equipments
TS 2092-1975 电子器件和电子设备测试基本环境测试规程 J：霉菌的生长
BASIC ENVIRONMENTAL TESTING PROCEDURES FOR ELECTRONIC COMPONENTS AND ELECTRONIC EQUIPMENT TEST J : MOULD GROWTH
GJB 4.10-1983 舰船电子设备环境试验 霉菌试验
HB 5830.13-1986 机载设备环境条件及试验方法 霉菌
本标准是HB5830《机载设备环境条件及试验方法》系列标准的组成部分，必须与HB5830.1-84《机载设备环境条件及试验方法 总则》一起使用
NF C93-171:1985 电子设备元件.微调电容器
Components for electronic equipment. Trimmer capacitors.
NF C90-512:1983 电子设备元件.电子元件尺寸的测量
Components for electronic equipment. Measurement of the dimensions of electronic components.
JIS C0801-1964 电子设备用元器件的颜色码
Color code for electronic parts
IEEE 200-1957 电气及电子元件和设备的基准名称
Reference designations for electrical and electronics parts and equipment
IEEE 200-1975 电气及电子元件和设备的基准名称
Reference designations for electrical and electronics parts and equipment
GOST 26080-1984 线电电子设备和电子工业产品.对防霉菌的一般要求
Mould fungi protection of radioelectronic equipment and electronic technique articles. General requirements
BS EN 60512-11-5:2002 电子设备连接器.试验和测量.气候试验.试验11e.霉菌生长
This part of IEC 60512, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical
Connectors for electronic equipment - Tests and measurements - Climatic tests - Test 11e - Mould growth
NF C93-611:1975 电子设备元件.压电器件.振荡器用石英晶体器件
Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
ECA CB8-1981 美国及其他国家和电子元器件及电子设备相关的批准机构清单
This EIA Engineering Bulletin was developed by the Association staff personnel from information supplied by member companies.We appreciate the efforts
List of Approval Agencies, U.S. and Other Countries, Impacting Electronic Components and Equipment
NF C93-110:1971 电子设备元件.铝固定电子电容器.一般要求
Components for electronic equipment. Fixed aluminium electronic capacitors. General requirements.
BS EN 2591:6306:2001 电气和光学连接元件.试验方法.光学元件.霉菌生长
To be read in conjunction with EN 2591-100
Elements of electrical and optical connection - Test methods - Optical elements - Mould growth
GB/T 13947-1992 电子元器件塑料封装设备通用技术条件
本标准规定了电子元器件塑料封装设备（以下简称塑封设备）的术语、产品分类、技术要求、试验方法、检验规则及标志、包装、运输、贮存等。 本标准适用于塑料封装集成电路、半导体分立器件、电阻、电容等电子元器件的四柱立式塑料封装设备
General specification for electronic components plastic packaging equipments
编辑：北检院编辑部
