发布时间：2024-05-27 17:49:26 - 更新时间：2024年06月29日 15:22
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单相器具额定电压不超过250 V、其他器具额定电压不超过480 V，以及由电池供电，直流电压不超过24 V的下述器具： ——家用和类似用途的酒柜； ——用于野营、旅游车和休闲船上的酒柜。 这些器具可由电网、单独的电池供电，或电网和电池一起供电。 不作为一般家用，但对公众仍可能引起危险的酒柜，例如商店
Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
Semiconductor devices. Discrete devices. Semiconductor accelerometers
Terminology of semiconductors and semiconductor devices
机械标准化的系列标准第1部分给出半导体器件图形绘制的推荐实例。 机械标准化的系列标准的第2部分给出半导体器件尺寸标准
Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
Semiconductor devices. Discrete devices. Thyristors
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
Gives recommended practice for the preparation of drawings, specifying general rules for all drawings and additional rules for device and case outline
Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
This part of IEC 60747 provides standards for packaged semiconductor Hall elements which utilize the Hall effect
Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
This part of IEC 60747 provides standards for packaged semiconductor Hall elements which utilize the Hall effect
Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
This standard is applicable to semiconductor PN-junction temperature sensors and defines terms@ definitions@ symbols@ essential ratings
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
Semiconductor devices - Semiconductor sensors - Pressure sensors
本部分规定了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中采用的2.5Gbit/s制冷型直接调制半导体激光器组件
Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Cooled Direct Modulation Semiconductor Laser Assembiy
单相器具额定电压不超过250 V、其他器具额定电压不超过480 V，以及由电池供电，直流电压不超过24 V的下述器具： ——家用和类似用途的酒柜； ——用于野营、旅游车和休闲船上的酒柜。 这些器具可由电网、单独的电池供电，或电网和电池一起供电。 不作为一般家用，但对公众仍可能引起危险的酒柜，例如商店
Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
Semiconductor devices. Discrete devices. Semiconductor accelerometers
Terminology of semiconductors and semiconductor devices
机械标准化的系列标准第1部分给出半导体器件图形绘制的推荐实例。 机械标准化的系列标准的第2部分给出半导体器件尺寸标准
Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
Semiconductor devices. Discrete devices. Thyristors
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
Gives recommended practice for the preparation of drawings, specifying general rules for all drawings and additional rules for device and case outline
Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
This part of IEC 60747 provides standards for packaged semiconductor Hall elements which utilize the Hall effect
Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
This part of IEC 60747 provides standards for packaged semiconductor Hall elements which utilize the Hall effect
Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
This standard is applicable to semiconductor PN-junction temperature sensors and defines terms@ definitions@ symbols@ essential ratings
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
Semiconductor devices - Semiconductor sensors - Pressure sensors
本部分规定了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中采用的2.5Gbit/s制冷型直接调制半导体激光器组件
Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Cooled Direct Modulation Semiconductor Laser Assembiy
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