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记忆环抱内固定器检测

发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22

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军工检测 其他检测

GJB 8518-2015 形状合金紧规范

KS D 0303-2004 形状合金螺簧的应变热循试验方法

이 규격은 형상 기억 합금 압축 코일 스프링 및 인장 코일 스프링(이하 코일 스프링이라

Method of fixed strain thermal cycling test for coil spring of shape memory alloys

JIS H 7106:1993 形状合金螺旋弹簧的应变热循试验方法

Method of fixed strain thermal cycling test for coil springs of shape memory alloys

JIS H 7106:2002 形状合金螺旋弹簧的应变热循试验方法

この規格は,形状記憶合金の合金の压縮コイルばね及び引張コィルばね(以下,コィルばねといぅ,を一定ひずみに固定して行ぅ熱サイクル試験方法について规定する

Method of fixed strain thermal cycling test for coil springs of shape memory alloys

STAS 12326/1-1985 示波术语

Prezentul standard stabile?te terminologia specific? osciloscoapelor cu memorie, cuprin-z?nd denumirea, defini?ia ?i enumerarea caracteristicilor

STORAGE OSCILLOSCOPES Terminology

DLA SMD-5962-02517 REV A-2004 数字CMOS微电路128M X 8 BIT堆栈模具(1GBIT)同步存(体)模块

This drawing documents three product assurance class levels consisting of space application (device Class V), high reliability (device class Q

MICROCIRCUIT MEMORY CMOS, DIGITAL, 128M X 8 BIT STACKED DIE(1GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE

DLA SMD-5962-02518-2003 数字CMOS微电路256M X 8 BIT堆栈模具(2GBIT)同步存(体)模块

This drawing documents three product assurance class levels consisting of space application (device Class V), high reliability (device class Q

MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE

KS D 0304-2004 形状合金螺簧的应变试验方法

이 규격은 형상 기억 합금의 압축 코일 스프링 및 인장 코일 스프링(이하 코일 스프링이

Method for fixed strain test for coil springs of shape memory alloys

KS D 0072-2002 Ti-Ni形合金的温度张力试验方法

이 규격은 Ti-Ni계 형상 기억 합금선의 정온 인장 시험 방법에 대하여 규정한다

Method of fixed temperature tensile test for wires of Ti-Ni shape memory alloys

KS D 0304-2004(2019 形状合金螺旋弹簧应变试验方法

Method for fixed strain test for coil springs of shape memory alloys

GB/T 24729-2009 客运索道通用技术条件

本标准规定了客运索道固定抱索器型式、型号、基本参数、技术要求、检验规则、标志、包装及运输。 本标准适用于循环式客运索道及拖牵索道

General technical conditions for fixed grip of passenger ropeway

JEDEC JESD21-C-1998 释放集合 直接查看JEDEC, 703.907.7559

EWJEDEC Standards and Pubiicatim contaia materiai that has been prepared, progressively reviewed, and approved through the JEDEC Council levei

Configurations for Solid State Memories Release 8 ***MUST GO DIRECT TO JEDEC, 703.907.7559***

JIS H 7105:2012 形状合金螺旋弹簧的应变试验方法

Method of constant strain tests for coil springs of Ti-Ni shape memory alloys

BS ISO/IEC 11694-6:2006 识别卡.光学卡.线性录法.光学卡中生物测学的使用

This part of ISO/IEC 11694 specifies the use of biometric data on optical memory cards using the logical data structure defined in ISO/IEC 11694-5

Identification cards - Optical memory cards - Linear recording method - Use of biometrics on an optical memory card

BS ISO/IEC 11694-6:2014 识别卡.光学卡.线性录法.光学卡中生物测学的使用

Identification cards. Optical memory cards. Linear recording method. Use of biometrics on an optical memory card

GJB 8518-2015 形状合金紧规范

KS D 0303-2004 形状合金螺簧的应变热循试验方法

이 규격은 형상 기억 합금 압축 코일 스프링 및 인장 코일 스프링(이하 코일 스프링이라

Method of fixed strain thermal cycling test for coil spring of shape memory alloys

JIS H 7106:1993 形状合金螺旋弹簧的应变热循试验方法

Method of fixed strain thermal cycling test for coil springs of shape memory alloys

JIS H 7106:2002 形状合金螺旋弹簧的应变热循试验方法

この規格は,形状記憶合金の合金の压縮コイルばね及び引張コィルばね(以下,コィルばねといぅ,を一定ひずみに固定して行ぅ熱サイクル試験方法について规定する

Method of fixed strain thermal cycling test for coil springs of shape memory alloys

STAS 12326/1-1985 示波术语

Prezentul standard stabile?te terminologia specific? osciloscoapelor cu memorie, cuprin-z?nd denumirea, defini?ia ?i enumerarea caracteristicilor

STORAGE OSCILLOSCOPES Terminology

DLA SMD-5962-02517 REV A-2004 数字CMOS微电路128M X 8 BIT堆栈模具(1GBIT)同步存(体)模块

This drawing documents three product assurance class levels consisting of space application (device Class V), high reliability (device class Q

MICROCIRCUIT MEMORY CMOS, DIGITAL, 128M X 8 BIT STACKED DIE(1GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE

DLA SMD-5962-02518-2003 数字CMOS微电路256M X 8 BIT堆栈模具(2GBIT)同步存(体)模块

This drawing documents three product assurance class levels consisting of space application (device Class V), high reliability (device class Q

MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE

KS D 0304-2004 形状合金螺簧的应变试验方法

이 규격은 형상 기억 합금의 압축 코일 스프링 및 인장 코일 스프링(이하 코일 스프링이

Method for fixed strain test for coil springs of shape memory alloys

KS D 0072-2002 Ti-Ni形合金的温度张力试验方法

이 규격은 Ti-Ni계 형상 기억 합금선의 정온 인장 시험 방법에 대하여 규정한다

Method of fixed temperature tensile test for wires of Ti-Ni shape memory alloys

KS D 0304-2004(2019 形状合金螺旋弹簧应变试验方法

Method for fixed strain test for coil springs of shape memory alloys

GB/T 24729-2009 客运索道通用技术条件

本标准规定了客运索道固定抱索器型式、型号、基本参数、技术要求、检验规则、标志、包装及运输。 本标准适用于循环式客运索道及拖牵索道

General technical conditions for fixed grip of passenger ropeway

JEDEC JESD21-C-1998 释放集合 直接查看JEDEC, 703.907.7559

EWJEDEC Standards and Pubiicatim contaia materiai that has been prepared, progressively reviewed, and approved through the JEDEC Council levei

Configurations for Solid State Memories Release 8 ***MUST GO DIRECT TO JEDEC, 703.907.7559***

JIS H 7105:2012 形状合金螺旋弹簧的应变试验方法

Method of constant strain tests for coil springs of Ti-Ni shape memory alloys

BS ISO/IEC 11694-6:2006 识别卡.光学卡.线性录法.光学卡中生物测学的使用

This part of ISO/IEC 11694 specifies the use of biometric data on optical memory cards using the logical data structure defined in ISO/IEC 11694-5

Identification cards - Optical memory cards - Linear recording method - Use of biometrics on an optical memory card

BS ISO/IEC 11694-6:2014 识别卡.光学卡.线性录法.光学卡中生物测学的使用

Identification cards. Optical memory cards. Linear recording method. Use of biometrics on an optical memory card

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