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Semiconductor integrated circuits - General principles of measuring methods for MOS random access memories
Semiconductor integrated circuits.Detail specification of type JM2148H NMOS 1024×4 bit static random access memory
Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories
本标准规定了半导体集成电路快闪存储器电参数、时间参数和存储单元功能测试的基本方法。 本标准适用于半导体集成电路领域中快闪存储器电参数、时间参数和存储单元功能的测试
Semiconductor integrated circuit.Measuring methods for flash memory
IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受
Semiconductor devices.Integrated circuits.Part 2-9:Digital integrated circuits.Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 DUAL PORT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON
서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受。 本空白详细规范是半导体器件的一系列空白详细规范之一,并且与下列标准一起使用
Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes
MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 128K X 32-BIT
本规范描述了半导体器件 集成电路 第2部分:数字集成电路 第9节:MOS紫外线擦除可编程只读存储器空白详细规范
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memorie
Semiconductor integrated circuits - General principles of measuring methods for MOS random access memories
Semiconductor integrated circuits.Detail specification of type JM2148H NMOS 1024×4 bit static random access memory
Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories
本标准规定了半导体集成电路快闪存储器电参数、时间参数和存储单元功能测试的基本方法。 本标准适用于半导体集成电路领域中快闪存储器电参数、时间参数和存储单元功能的测试
Semiconductor integrated circuit.Measuring methods for flash memory
IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受
Semiconductor devices.Integrated circuits.Part 2-9:Digital integrated circuits.Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 DUAL PORT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON
서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受。 本空白详细规范是半导体器件的一系列空白详细规范之一,并且与下列标准一起使用
Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes
MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 128K X 32-BIT
本规范描述了半导体器件 集成电路 第2部分:数字集成电路 第9节:MOS紫外线擦除可编程只读存储器空白详细规范
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memorie








