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半导体集成电路MOS随机存储器检测

发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22

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军工检测 其他检测

SJ/T 10739-1996 MOS测试方法的基本原理

Semiconductor integrated circuits - General principles of measuring methods for MOS random access memories

SJ 50597/38-1995 .JM2148H型NMOS 1024×4位静态详细规范

Semiconductor integrated circuits.Detail specification of type JM2148H NMOS 1024×4 bit static random access memory

SJ/T 10740-1996 双极型测试方法的基本原理

Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories

GB/T 36477-2018 快闪测试方法

本标准规定了半导体集成电路快闪存储器电参数、时间参数和存储单元功能测试的基本方法。 本标准适用于半导体集成电路领域中快闪存储器电参数、时间参数和存储单元功能的测试

Semiconductor integrated circuit.Measuring methods for flash memory

GB/T 17574.9-2006 件..第2-9部分:数字.紫外光擦除可编程MOS只读空白详细规范

IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受

Semiconductor devices.Integrated circuits.Part 2-9:Digital integrated circuits.Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

GJB/Z 42.3-1993 军用微系列型谱 微型计算

GB/T 36474-2018 第三代双倍数据速率同步动态 (DDR3 SDRAM)测试方法

Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)

DLA SMD-5962-87002 REV E-2006 硅单块 2KX8双门静态,氧化物,数字主微型

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 DUAL PORT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON

KS C IEC 60748-2-8:2002 件..第2部分:数字.第8节:静态读、写

서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories

GB/T 17574.10-2003 第2-10部分;数字动态读/写空白详细规范

IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受。 本空白详细规范是半导体器件的一系列空白详细规范之一,并且与下列标准一起使用

Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories

DLA SMD-5962-95595 REV N-2004 静噪声的数字混合互补金属氧化物

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes

MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 128K X 32-BIT

IEC 60748-2-9:1994 第2部分:数字 第9节:MOS紫外线擦除可编程只读空白详细规范

本规范描述了半导体器件 集成电路 第2部分:数字集成电路 第9节:MOS紫外线擦除可编程只读存储器空白详细规范

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

KS C IEC 60748-2-9-2002(2022 第2部分:数字第9节:MOS紫外光可擦除可编程只读空白详细规范

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

KS C IEC 60748-2-9-2002(2017 第2部分:数字第9节:MOS紫外光可擦除可编程只读空白详细规范

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

IEC 60748-2-9-1994 件 - - 第2部分:数字 - 第9节:MOS紫外线可擦除可编程只读的空白详细规范

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memorie

SJ/T 10739-1996 MOS测试方法的基本原理

Semiconductor integrated circuits - General principles of measuring methods for MOS random access memories

SJ 50597/38-1995 .JM2148H型NMOS 1024×4位静态详细规范

Semiconductor integrated circuits.Detail specification of type JM2148H NMOS 1024×4 bit static random access memory

SJ/T 10740-1996 双极型测试方法的基本原理

Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories

GB/T 36477-2018 快闪测试方法

本标准规定了半导体集成电路快闪存储器电参数、时间参数和存储单元功能测试的基本方法。 本标准适用于半导体集成电路领域中快闪存储器电参数、时间参数和存储单元功能的测试

Semiconductor integrated circuit.Measuring methods for flash memory

GB/T 17574.9-2006 件..第2-9部分:数字.紫外光擦除可编程MOS只读空白详细规范

IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受

Semiconductor devices.Integrated circuits.Part 2-9:Digital integrated circuits.Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

GJB/Z 42.3-1993 军用微系列型谱 微型计算

GB/T 36474-2018 第三代双倍数据速率同步动态 (DDR3 SDRAM)测试方法

Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)

DLA SMD-5962-87002 REV E-2006 硅单块 2KX8双门静态,氧化物,数字主微型

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 DUAL PORT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON

KS C IEC 60748-2-8:2002 件..第2部分:数字.第8节:静态读、写

서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories

GB/T 17574.10-2003 第2-10部分;数字动态读/写空白详细规范

IEC电子元器件质量评定体系遵循IEC的章程,并在IEC的授权下进行工作。该体系的目的是确定质量评定程序,以这种方式使一个参加国按有关规范要求放行的电子元器件需进一步试验而为其他所有参加国同样接受。 本空白详细规范是半导体器件的一系列空白详细规范之一,并且与下列标准一起使用

Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories

DLA SMD-5962-95595 REV N-2004 静噪声的数字混合互补金属氧化物

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes

MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 128K X 32-BIT

IEC 60748-2-9:1994 第2部分:数字 第9节:MOS紫外线擦除可编程只读空白详细规范

本规范描述了半导体器件 集成电路 第2部分:数字集成电路 第9节:MOS紫外线擦除可编程只读存储器空白详细规范

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

KS C IEC 60748-2-9-2002(2022 第2部分:数字第9节:MOS紫外光可擦除可编程只读空白详细规范

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

KS C IEC 60748-2-9-2002(2017 第2部分:数字第9节:MOS紫外光可擦除可编程只读空白详细规范

Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

IEC 60748-2-9-1994 件 - - 第2部分:数字 - 第9节:MOS紫外线可擦除可编程只读的空白详细规范

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memorie

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