SAE ARP1870A-2012 航空航天系统等电位连接接地电磁兼容性和安全性
This document has been declared "Stabilized" and will no longer be subjected to periodic reviews for currency. Users are responsible for verifying
Aerospace Systems Electrical Bonding and Grounding for Electromagnetic Compatibility and Safety
DIN 15700:2017 娱乐技术. 移动等电位连接系统
Entertainment technology - Mobile equipotential bonding systems
DIN VDE 0618-1:1989 等电位连接设备.第1部分:等电位主连接用等电位套管
Equipment for equipotential bonding; equipotential busher for main equipotential bonding
TIS 2538-2012 信息技术设备的接地布置和等电位连接
Earthing arragngements and equipotential bonding for information technology installations
EN 50310:2010 建筑物内信息技术设备等电位连接和接地应用
Application of equipotential bonding and earthing in buildings with information technology equipment
EN 50310:2000 建筑物内信息技术设备等电位连接和接地应用
Application of Equipotential Bonding and Earthing in Buildings with Information Technology Equipment
EN 50310:2016 建筑物内信息技术设备等电位连接和接地应用
Telecommunications bonding networks for buildings and other structures
NF C90-482:2011 建筑物内信息技术设备等电位连接和接地应用.
Application of equipotential bonding and earthing in buildings with information technology equipment.
IEEE 81-1983 接地系统的接地电阻率,接地阻抗及地表电位的测量指南
Describe and discuss the present state of the technique of measuring ground resistance and impedance, earth resistivity, potential gradients from
Guide for measuring earth resistivity, ground impedance, and earth surface potentials of a ground system
IEEE 81-2012 接地系统的接地电阻率,接地阻抗及地表电位测量的IEEE指南
IEEE Guide for Measuring Earth Resistivity, Ground Impedance, and Earth Surface Potentials of a Grounding System
GB/T 19271.2-2005 雷电电磁脉冲的防护 第2部分;建筑物的屏蔽、内部等电位连接及接地
本部分规定了安装有信息设备（如电子系统）的建筑物，在遭受到雷击以及邻近雷击情况下，其LEMP屏蔽措施有效性的评估方法。并给出与雷电电磁脉冲防护有关的建筑物内各种等电位连接措施及各种接地方法的规则
Protection against lightning electromagnetic impulse(LEMP)-Part 2:Shielding of structures,bonding inside structures and earthing
BS EN 50310:2010 带有信息技术设备的建筑物中等电位连接和接地的应用
This European Standard specifies minimum requirements for earthing networks and connections (bonds) in buildings in which information technology
Application of equipotential bonding and earthing in buildings with information technology equipment
NF C90-482:2006 带有信息技术设备的建筑物中应用等电位连接和接地技术
Application of equipotential bonding and earthing in buildings with information technology equipment.
DLA MIL-T-83454/2 D VALID NOTICE 3-2005 等电位连接接地(非绝缘)抽芯螺柱式终端,138-32UNJC-3A 额定电流:25安培
TERMINALS, STUD, BLIND, FOR ELECTRICAL BONDING AND GROUNDING (NONINSULATED), .138-32 UNJC-3A CURRENT RATING: 25 AMPS
IEC 61557-4:2019 交流1000V和直流1500V以下低压配电系统的电气安全保护措施的试验、测量或监测设备第4部分:接地连接和等电位连接的电阻
Electrical safety in low voltage distribution systems up to 1 000 V AC and 1 500 V DC - Equipment for testing, measuring or monitoring of protective measures - Part 4: Resistance of earth connection a
SAE ARP1870A-2012 航空航天系统等电位连接接地电磁兼容性和安全性
This document has been declared "Stabilized" and will no longer be subjected to periodic reviews for currency. Users are responsible for verifying
Aerospace Systems Electrical Bonding and Grounding for Electromagnetic Compatibility and Safety
DIN 15700:2017 娱乐技术. 移动等电位连接系统
Entertainment technology - Mobile equipotential bonding systems
DIN VDE 0618-1:1989 等电位连接设备.第1部分:等电位主连接用等电位套管
Equipment for equipotential bonding; equipotential busher for main equipotential bonding
TIS 2538-2012 信息技术设备的接地布置和等电位连接
Earthing arragngements and equipotential bonding for information technology installations
EN 50310:2010 建筑物内信息技术设备等电位连接和接地应用
Application of equipotential bonding and earthing in buildings with information technology equipment
EN 50310:2000 建筑物内信息技术设备等电位连接和接地应用
Application of Equipotential Bonding and Earthing in Buildings with Information Technology Equipment
EN 50310:2016 建筑物内信息技术设备等电位连接和接地应用
Telecommunications bonding networks for buildings and other structures
NF C90-482:2011 建筑物内信息技术设备等电位连接和接地应用.
Application of equipotential bonding and earthing in buildings with information technology equipment.
IEEE 81-1983 接地系统的接地电阻率,接地阻抗及地表电位的测量指南
Describe and discuss the present state of the technique of measuring ground resistance and impedance, earth resistivity, potential gradients from
Guide for measuring earth resistivity, ground impedance, and earth surface potentials of a ground system
IEEE 81-2012 接地系统的接地电阻率,接地阻抗及地表电位测量的IEEE指南
IEEE Guide for Measuring Earth Resistivity, Ground Impedance, and Earth Surface Potentials of a Grounding System
GB/T 19271.2-2005 雷电电磁脉冲的防护 第2部分;建筑物的屏蔽、内部等电位连接及接地
本部分规定了安装有信息设备（如电子系统）的建筑物，在遭受到雷击以及邻近雷击情况下，其LEMP屏蔽措施有效性的评估方法。并给出与雷电电磁脉冲防护有关的建筑物内各种等电位连接措施及各种接地方法的规则
Protection against lightning electromagnetic impulse(LEMP)-Part 2:Shielding of structures,bonding inside structures and earthing
BS EN 50310:2010 带有信息技术设备的建筑物中等电位连接和接地的应用
This European Standard specifies minimum requirements for earthing networks and connections (bonds) in buildings in which information technology
Application of equipotential bonding and earthing in buildings with information technology equipment
NF C90-482:2006 带有信息技术设备的建筑物中应用等电位连接和接地技术
Application of equipotential bonding and earthing in buildings with information technology equipment.
DLA MIL-T-83454/2 D VALID NOTICE 3-2005 等电位连接接地(非绝缘)抽芯螺柱式终端,138-32UNJC-3A 额定电流:25安培
TERMINALS, STUD, BLIND, FOR ELECTRICAL BONDING AND GROUNDING (NONINSULATED), .138-32 UNJC-3A CURRENT RATING: 25 AMPS
IEC 61557-4:2019 交流1000V和直流1500V以下低压配电系统的电气安全保护措施的试验、测量或监测设备第4部分:接地连接和等电位连接的电阻
Electrical safety in low voltage distribution systems up to 1 000 V AC and 1 500 V DC - Equipment for testing, measuring or monitoring of protective measures - Part 4: Resistance of earth connection a
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