DB44/T 1138-2013 空调器印刷电路板组件(PCBA)铅焊点可靠性试验方法及质量要求
本标准规定了空调器印刷电路板组件（PCBA）铅焊点可靠性试验方法、质量要求及检验规则。 本标准适用于空调器印刷电路板组件（PCBA）铅焊点可靠性评定。 本标准不适用于特种空调
IPC PE-740A SECTION 18-1997 印制电路板组件清洗
IPC Standards and Publications are designed to serve the public interest through
Cleaning of Printed Board Assemblies
IPC CM-770E-2004 印制电路板组件安装准则
This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria
Guidelines for Printed Board Component Mounting
QJ/Z 159.2-1985 印制电路板组装件灌封工艺细则
IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针
Whether a printed circuit is to be a prototype, or a high-volume
IPC-CM770,Guidelines for Printed Board Component Mounting
KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况
이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여
Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies
IEC TR 61191-8:2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
IEC TR 61191-8-2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
KS C IEC 61188-1-2:2003 印制电路板和印制电路板组件.设计和使用.第1.2部分:总要求.控制阻抗
이 규격은 회로 설계자, 포장 기술자, 인쇄 회로기판 제조자 및 공급 업자들이 사용함으
Printed boards and printed board assemblies－Design and use－Part 1－2：Generic requirements－Controlled impedance
BS EN 61191-4:1999 印制电路板组件.分规范.端点焊接组件要求
Applies to assemblies that are totally terminal/wire interconnecting structures, or to the terminal/wire portions of assemblies that include other
Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies
KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑
T/CSTM 00920-2023 印制电路板组件用敷形涂覆材料
本文件规定了印制电路板组件用敷形涂覆材料（电气绝缘化合物）（以下简称“产品”）的术语和定义、技术要求、试验方法、检验规则和标识、包装、运输储存。 本文件适用于工业控制、通信设备、消费电子、家用电器等设备及印制电路板组件上的敷形涂覆材料在干燥和/或固化前以及干燥和/或固化后的性能试验
Conformal coating for printed circuit board assemblies
NAVY QML-28870-2013 组件、电气背板、印制线路、通用规范
Assemblies, Electrical Backplane, Printed-Wiring, General Specification for
DB44/T 1138-2013 空调器印刷电路板组件(PCBA)铅焊点可靠性试验方法及质量要求
本标准规定了空调器印刷电路板组件（PCBA）铅焊点可靠性试验方法、质量要求及检验规则。 本标准适用于空调器印刷电路板组件（PCBA）铅焊点可靠性评定。 本标准不适用于特种空调
IPC PE-740A SECTION 18-1997 印制电路板组件清洗
IPC Standards and Publications are designed to serve the public interest through
Cleaning of Printed Board Assemblies
IPC CM-770E-2004 印制电路板组件安装准则
This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria
Guidelines for Printed Board Component Mounting
QJ/Z 159.2-1985 印制电路板组装件灌封工艺细则
IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针
Whether a printed circuit is to be a prototype, or a high-volume
IPC-CM770,Guidelines for Printed Board Component Mounting
KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况
이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여
Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies
IEC TR 61191-8:2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
IEC TR 61191-8-2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
KS C IEC 61188-1-2:2003 印制电路板和印制电路板组件.设计和使用.第1.2部分:总要求.控制阻抗
이 규격은 회로 설계자, 포장 기술자, 인쇄 회로기판 제조자 및 공급 업자들이 사용함으
Printed boards and printed board assemblies－Design and use－Part 1－2：Generic requirements－Controlled impedance
BS EN 61191-4:1999 印制电路板组件.分规范.端点焊接组件要求
Applies to assemblies that are totally terminal/wire interconnecting structures, or to the terminal/wire portions of assemblies that include other
Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies
KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑
T/CSTM 00920-2023 印制电路板组件用敷形涂覆材料
本文件规定了印制电路板组件用敷形涂覆材料（电气绝缘化合物）（以下简称“产品”）的术语和定义、技术要求、试验方法、检验规则和标识、包装、运输储存。 本文件适用于工业控制、通信设备、消费电子、家用电器等设备及印制电路板组件上的敷形涂覆材料在干燥和/或固化前以及干燥和/或固化后的性能试验
Conformal coating for printed circuit board assemblies
NAVY QML-28870-2013 组件、电气背板、印制线路、通用规范
Assemblies, Electrical Backplane, Printed-Wiring, General Specification for
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