
发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22
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本部分规定了缓冲调距块的技术要求、检验方法、检验规则及标志、包装和储存运输。本部分适用于高速铁路道岔扣件用缓冲调距块
Technical specification for manufacturing of high speed turnouts.Part 6: Buffer gauge blocks
本标准规定了摩托车和轻便摩托车车轮缓冲块的术语和定义、要求、试验方法、检验规则及标志、包装、运输、储存。本标准适用于摩托车和轻便摩托车车轮使用的橡胶缓冲块(以下简称缓冲块
Buffering chunk of motorcycles and mopeds wheels
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class
MICROCIRCUIT, LINEAR, HIGH SPEED BUFFER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class
MICROCIRCUIT, LINEAR, HIGH SPEED BUFFER, MONOLITHIC SILICON
This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUFFERS, MONOLITHIC SILICON
This drawing describes device requirements for class 0 microcircuits in accordance w i t h 1.2.1 o re MIL-STO-883, "Provisions for the use
MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUFFER, MONOLITHIC SILICON
Buffers and buffers holders for sheet stamping dies. Specifications
No scope available
AS4886 Bumper Pad
4 要求 4.1 防撞缓冲车工作状态结构型式(见图1) 图1 4.2 整车 4.2.1 防撞缓冲车应按符合本文件的要求,并按规定程序批准的产品图样和技术文件制造。 4.2.2 外购件、外协件
Refractory cushion mortar
本文件规定了防撞缓冲车的术语和定义、型号、参数及结构组成、技术要求、试验方法、碰撞测试方法、检验规则、标志、运输和贮存。 本文件适用于在道路作业防护中,针对一般小型乘用车辆失控时的碰撞安全缓冲而设置的防撞缓冲车。本文件不适用于轻型货车及以上重型车辆的碰撞缓冲
shadow vehicle
本部分规定了缓冲调距块的技术要求、检验方法、检验规则及标志、包装和储存运输。本部分适用于高速铁路道岔扣件用缓冲调距块
Technical specification for manufacturing of high speed turnouts.Part 6: Buffer gauge blocks
本标准规定了摩托车和轻便摩托车车轮缓冲块的术语和定义、要求、试验方法、检验规则及标志、包装、运输、储存。本标准适用于摩托车和轻便摩托车车轮使用的橡胶缓冲块(以下简称缓冲块
Buffering chunk of motorcycles and mopeds wheels
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class
MICROCIRCUIT, LINEAR, HIGH SPEED BUFFER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class
MICROCIRCUIT, LINEAR, HIGH SPEED BUFFER, MONOLITHIC SILICON
This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUFFERS, MONOLITHIC SILICON
This drawing describes device requirements for class 0 microcircuits in accordance w i t h 1.2.1 o re MIL-STO-883, "Provisions for the use
MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUFFER, MONOLITHIC SILICON
Buffers and buffers holders for sheet stamping dies. Specifications
No scope available
AS4886 Bumper Pad
4 要求 4.1 防撞缓冲车工作状态结构型式(见图1) 图1 4.2 整车 4.2.1 防撞缓冲车应按符合本文件的要求,并按规定程序批准的产品图样和技术文件制造。 4.2.2 外购件、外协件
Refractory cushion mortar
本文件规定了防撞缓冲车的术语和定义、型号、参数及结构组成、技术要求、试验方法、碰撞测试方法、检验规则、标志、运输和贮存。 本文件适用于在道路作业防护中,针对一般小型乘用车辆失控时的碰撞安全缓冲而设置的防撞缓冲车。本文件不适用于轻型货车及以上重型车辆的碰撞缓冲
shadow vehicle








