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本标准规定了半导体激光器的通用要求,包括术语和定义、分类、技术要求、测试要求、检验规则、标志、包装、运输和贮存。本标准适用于半导体激光器的研制、生产和交付等。半导体激光器组件可参考执行
General specification for semiconductor lasers
本标准规定了半导体激光器主要光电参数的测试方法。本标准适用于半导体激光器主要光电参数的测试。半导体激光器组件可参考执行
Test methods of semiconductor lasers
本文件规定了全固态半导体激光器的型号与命名、技术要求、安全与防护、试验方法、检验规则及标志、包装、运输与贮存。 本文件适用于全固态半导体激光器的研制、生产和交付
Diode pump solid state laser
The book has 8 chapters that are divided into parts. The first chapter is about semiconductor-diode laser and its design. The second chapter is about
Distributed Feedback Semiconductor Lasers
This part of IEC 60747 deals with the terminology, the essential ratings and characteristics as well as the measuring methods of semiconductor lasers.
Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
本部分规定了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中采用的2.5Gbit/s制冷型直接调制半导体激光器组件
Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Cooled Direct Modulation Semiconductor Laser Assembiy
本部分规范了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中所采用的1 310nm和l 550nm波段(包括CWDM波段)的
Technidal Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 2:2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly
Provides standard measurement techniques for semiconductor lasers
Procedures for Determining Threshold Current of Semiconductor Lasers
本规范规定了光纤通信用半导体激光器芯片的术语和定义、分类、技术要求和可靠性要求、检验规则、测量和试验方法、包装、运输及贮存。 本规范适用于传输速率从155Mb/s至2.5Gb/s的光纤通信系统中法布里-泊罗激光二极管(FP-LD)和分布反馈激光二极管(DFB-LD)芯片的采购、制造和质量控制
Technical specification of semiconductor laser chip used in optical fiber communication
Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
Although light emission can occur as soon as current is applied to the semiconductor laser, it does not emit coherent light until the current exceeds
Procedures for Determining Threshold Current of Semiconductor Lasers
Although light emission can occur as soon as current is applied to the semiconductor laser, it does not emit coherent light until the current exceeds
Procedures for Determining Threshold Current of Semiconductor Lasers
This Technical Specification describes methods of measuring temperature, injected current dependence and lasing spectral line width in relation
Optics and photonics.Measurement method of semiconductor lasers for sensing
本标准规定了半导体激光器的通用要求,包括术语和定义、分类、技术要求、测试要求、检验规则、标志、包装、运输和贮存。本标准适用于半导体激光器的研制、生产和交付等。半导体激光器组件可参考执行
General specification for semiconductor lasers
本标准规定了半导体激光器主要光电参数的测试方法。本标准适用于半导体激光器主要光电参数的测试。半导体激光器组件可参考执行
Test methods of semiconductor lasers
本文件规定了全固态半导体激光器的型号与命名、技术要求、安全与防护、试验方法、检验规则及标志、包装、运输与贮存。 本文件适用于全固态半导体激光器的研制、生产和交付
Diode pump solid state laser
The book has 8 chapters that are divided into parts. The first chapter is about semiconductor-diode laser and its design. The second chapter is about
Distributed Feedback Semiconductor Lasers
This part of IEC 60747 deals with the terminology, the essential ratings and characteristics as well as the measuring methods of semiconductor lasers.
Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
本部分规定了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中采用的2.5Gbit/s制冷型直接调制半导体激光器组件
Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Cooled Direct Modulation Semiconductor Laser Assembiy
本部分规范了2.5Gbit/s致冷型直接调制半导体激光器组件的技术要求和测试方法，包括相关术语、定义、分类、技术要求、测试方法、可靠性试验分类和试验方法、产品检验和产品管理等。 本部分适用于高速光纤通信系统中所采用的1 310nm和l 550nm波段(包括CWDM波段)的
Technidal Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 2:2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly
Provides standard measurement techniques for semiconductor lasers
Procedures for Determining Threshold Current of Semiconductor Lasers
本规范规定了光纤通信用半导体激光器芯片的术语和定义、分类、技术要求和可靠性要求、检验规则、测量和试验方法、包装、运输及贮存。 本规范适用于传输速率从155Mb/s至2.5Gb/s的光纤通信系统中法布里-泊罗激光二极管(FP-LD)和分布反馈激光二极管(DFB-LD)芯片的采购、制造和质量控制
Technical specification of semiconductor laser chip used in optical fiber communication
Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
Although light emission can occur as soon as current is applied to the semiconductor laser, it does not emit coherent light until the current exceeds
Procedures for Determining Threshold Current of Semiconductor Lasers
Although light emission can occur as soon as current is applied to the semiconductor laser, it does not emit coherent light until the current exceeds
Procedures for Determining Threshold Current of Semiconductor Lasers
This Technical Specification describes methods of measuring temperature, injected current dependence and lasing spectral line width in relation
Optics and photonics.Measurement method of semiconductor lasers for sensing
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