发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22
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本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
本总规范适用于膜集成电路和混合膜集成电路(F&HFICs),包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F&HFICs。 本规范适用于供用户继续加工的半成品F&HFICs,也适用于装有一个以上芯片的片式载体电路,而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
Hybrid integrated circuits.Detail specification for type HRV013 voltage reference,multichannel
本规范规定了交付项及其相关的设计指南和数据格式,以便于已确定工艺的混合信号IP核(Intellectual Property Core, 以下简称为IP)进行测试、交换及集成。这些元件主要以数字系统芯片的应用作为目标。 本规范还提供了一个详细的交付项模型清单,以便于对工艺已确定的
Integrated circuit analog/mixed-signal IP core specification
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸,适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
Sectional specification: film and hybrid integrated circuits
Film and hybrid integrated circuits. Hermetic packages.
Hybrid integrated circuits Detail specification for type HMSF-600 power filters
Film and Hybrid Integrated Circuits Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
To be read in conjunction with BS EN 165000-1:1996, BS EN 165000-2:1996, BS EN 165000-4:1996
Film and hybrid integrated circuits - Procedure for qualification approval
Blank detail specification: film and hybrid integrated circuits
서 문 이 규격은 1991년에 초판으로 발행된 IEC 60748-3-1 Semic
Semiconductor devices-Integrated circuits-Part 3:Analogue integrated circuits-Section 1:Blank detail specification for monolithic integrated operational amplifiers
本分规范适用于按标准产品或定制产品而制造的,其质量是以鉴定批准为基础评定的膜集成电路和混合膜集成电路
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
本总规范适用于膜集成电路和混合膜集成电路(F&HFICs),包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F&HFICs。 本规范适用于供用户继续加工的半成品F&HFICs,也适用于装有一个以上芯片的片式载体电路,而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
Hybrid integrated circuits.Detail specification for type HRV013 voltage reference,multichannel
本规范规定了交付项及其相关的设计指南和数据格式,以便于已确定工艺的混合信号IP核(Intellectual Property Core, 以下简称为IP)进行测试、交换及集成。这些元件主要以数字系统芯片的应用作为目标。 本规范还提供了一个详细的交付项模型清单,以便于对工艺已确定的
Integrated circuit analog/mixed-signal IP core specification
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸,适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
Sectional specification: film and hybrid integrated circuits
Film and hybrid integrated circuits. Hermetic packages.
Hybrid integrated circuits Detail specification for type HMSF-600 power filters
Film and Hybrid Integrated Circuits Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
To be read in conjunction with BS EN 165000-1:1996, BS EN 165000-2:1996, BS EN 165000-4:1996
Film and hybrid integrated circuits - Procedure for qualification approval
Blank detail specification: film and hybrid integrated circuits
서 문 이 규격은 1991년에 초판으로 발행된 IEC 60748-3-1 Semic
Semiconductor devices-Integrated circuits-Part 3:Analogue integrated circuits-Section 1:Blank detail specification for monolithic integrated operational amplifiers
本分规范适用于按标准产品或定制产品而制造的,其质量是以鉴定批准为基础评定的膜集成电路和混合膜集成电路
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure