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润湿秤量法可焊性测试仪检测

发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22

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SJ/T 10145-1991 湿.技术条件

本标准适用于按GB 2423.32 电工电子产品基本环境试验规程 润湿秤量法可焊性试验方法和GB 2424.21电工电子产品基本环境试验规程润湿秤量法可焊性试验导则中规定的原理制造的可焊性测试仪,它是制订产品标准、进行产品测试和验收的依据

Specification for solderability tester by wetting balance method

SJ/Z 9001.32-1987 基本环境验规程 第2部分:各种验Ta:湿

Basic environmental testing procedures--Part 2: Tests--Test Ta: Solderability testing by the wetting balance method

STAS 12127-1982 锡金属湿湿

Prezentul standard stabile?te metoda pentru determinarea capacit??ii de umectare a aliajelor pentru lipire

SOLDERING METALS Determination of moistening wettability

DVS 2603-1-1977 软;软湿

Testing of the soft solderability; testings of wetting for soft soldering

NF A89-400:1991 软钎.湿平衡

Soldering - Measurement of Solderability Wetting balance tests method

Soldering - Measurement of Solderability Wetting balance tests method

DS/EN 60512-12-1:2006 电子设备连接器 第 12-1 部分: 12a:湿

This part of IEC 60512, when required by the detail specification, is used for testingconnectors within the scope of technical committee 48. They may

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

DIN 32506-4:1981 软钎检验;湿;检验.评价

Testing of solderability; wetting balance method, test, evaluationDiese Norm wurde in Zusammenarbeit mit dem Deutschen Verband für Schwei?technik (DVS

Testing of solderability for soft soldering; Measurement of wetting force; Testing, Assessment

DS/EN 60512-12-2/Corr. 1:2007 电子设备用连接器“”第 12-2 部分: 12b:湿、烙铁

This part of 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may

Connectors for electronic equipment – Tests and measurements – Part 12-2: Soldering tests – Test 12b: Solderability, wetting, soldering iron method

DS/EN 60512-12-2:2006 电子设备用连接器“”第 12-2 部分: 12b:湿、烙铁

This part of 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may

Connectors for electronic equipment – Tests and measurements – Part 12-2: Soldering tests – Test 12b: Solderability, wetting, soldering iron method

UNE-EN 60512-12-7:2002 电子设备连接器 第 12-7 部分: 12g:湿平衡

Connectors for electronic equipment - Tests and measurements -- Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method.

DS/EN 60512-12-7:2002 电子设备连接器 第 12-7 部分: 12g:湿平衡

This part of 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

IEC 60068-2-54:1985 环境验 第2-54部分:验Ta:锡 湿

The test described determines the solderability of component terminations of any shape. It is specially suitable for reference testing

Environmental testing. Part 2: Tests. Test TA: Soldering. Solderability testing by the wetting balance method

GB/T 2423.32-1985 电工电子产品基本环境验规程 湿验方

确定元、器件任何形状的引出端锡焊的可焊性。特别适用于作仲裁试验和不能用其他方法作定量试验的元、器件引出端锡焊的可焊性评定

Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method

LST EN 60512-12-1-2006 电子设备连接器 第 12-1 部分: 12a:湿(IEC 60512-12-1:2006)

Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006)

UNE-EN 60512-12-1:2007 电子设备连接器 第 12-1 部分: 12a:湿(IEC 60512-12-1:2006)

Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006).

SJ/T 10145-1991 湿.技术条件

本标准适用于按GB 2423.32 电工电子产品基本环境试验规程 润湿秤量法可焊性试验方法和GB 2424.21电工电子产品基本环境试验规程润湿秤量法可焊性试验导则中规定的原理制造的可焊性测试仪,它是制订产品标准、进行产品测试和验收的依据

Specification for solderability tester by wetting balance method

SJ/Z 9001.32-1987 基本环境验规程 第2部分:各种验Ta:湿

Basic environmental testing procedures--Part 2: Tests--Test Ta: Solderability testing by the wetting balance method

STAS 12127-1982 锡金属湿湿

Prezentul standard stabile?te metoda pentru determinarea capacit??ii de umectare a aliajelor pentru lipire

SOLDERING METALS Determination of moistening wettability

DVS 2603-1-1977 软;软湿

Testing of the soft solderability; testings of wetting for soft soldering

NF A89-400:1991 软钎.湿平衡

Soldering - Measurement of Solderability Wetting balance tests method

Soldering - Measurement of Solderability Wetting balance tests method

DS/EN 60512-12-1:2006 电子设备连接器 第 12-1 部分: 12a:湿

This part of IEC 60512, when required by the detail specification, is used for testingconnectors within the scope of technical committee 48. They may

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

DIN 32506-4:1981 软钎检验;湿;检验.评价

Testing of solderability; wetting balance method, test, evaluationDiese Norm wurde in Zusammenarbeit mit dem Deutschen Verband für Schwei?technik (DVS

Testing of solderability for soft soldering; Measurement of wetting force; Testing, Assessment

DS/EN 60512-12-2/Corr. 1:2007 电子设备用连接器“”第 12-2 部分: 12b:湿、烙铁

This part of 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may

Connectors for electronic equipment – Tests and measurements – Part 12-2: Soldering tests – Test 12b: Solderability, wetting, soldering iron method

DS/EN 60512-12-2:2006 电子设备用连接器“”第 12-2 部分: 12b:湿、烙铁

This part of 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may

Connectors for electronic equipment – Tests and measurements – Part 12-2: Soldering tests – Test 12b: Solderability, wetting, soldering iron method

UNE-EN 60512-12-7:2002 电子设备连接器 第 12-7 部分: 12g:湿平衡

Connectors for electronic equipment - Tests and measurements -- Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method.

DS/EN 60512-12-7:2002 电子设备连接器 第 12-7 部分: 12g:湿平衡

This part of 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

IEC 60068-2-54:1985 环境验 第2-54部分:验Ta:锡 湿

The test described determines the solderability of component terminations of any shape. It is specially suitable for reference testing

Environmental testing. Part 2: Tests. Test TA: Soldering. Solderability testing by the wetting balance method

GB/T 2423.32-1985 电工电子产品基本环境验规程 湿验方

确定元、器件任何形状的引出端锡焊的可焊性。特别适用于作仲裁试验和不能用其他方法作定量试验的元、器件引出端锡焊的可焊性评定

Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method

LST EN 60512-12-1-2006 电子设备连接器 第 12-1 部分: 12a:湿(IEC 60512-12-1:2006)

Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006)

UNE-EN 60512-12-1:2007 电子设备连接器 第 12-1 部分: 12a:湿(IEC 60512-12-1:2006)

Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006).

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