微电子器件检测网

ARMY MIL-HDBK-175 VALID NOTICE 1-2000 微电子器件的数据手册

MIL-HDBK-175, dated 1 May 1968, has been reviewed and determined to be valid for use in acquistion

MICROELECTRONIC DEVICE DATA HANDBOOK

ARMY MIL-HDBK-175-1968 微电子器件的数据手册

This document provides guidance for the selection and application of microetectronic devices in Military systems. Emphasis is placed upon

MICROELECTRONIC DEVICE DATA HANDBOOK

SAE AS1142-2002 1992 微电子器件气密性测试

1992 Hermeticity Testing of Microelectronic Devices

GJB 548-1988 微电子器件试验方法和程序

GJB 548A-1996 微电子器件试验方法和程序

GJB 548C-2021 微电子器件试验方法和程序

GJB 548B-2005 微电子器件试验方法和程序

本标准规定了军用微电子器件的环境、机械、电气试验方法和试验程序，以及为保证微电子器件满足预定用途所要求的质量和可靠性而必须的控制和限制措施。 本标准适用于军用及空间应用的微电子器件。 如果承制方标明或声称其半导体集成电路符合本标准的规定，则必须满足方法5004、5005或

Test methods and procedures for microelectronic device

DI-MGMT-81763 A-2009 定制化微电子器件源头保护计划

Customized Microelectronics Devices Source Protection Plan

SJ/T 11705-2018 微电子器件封装的地和电源阻抗测试方法

SJ/T 11703-2018 数字微电子器件封装的串扰特性测试方法

ASTM F459-06 微电子器件金属丝连接抗拉强度测量的标准试验方法

Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

SJ/T 10747-1996 微波电子器件引线颜色标志

color codes for lead wires of microwave devices

IEC PAS 62162:2000 微电子器件抗静电放电阈值的场诱导放电装置模型的试验方法

Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components

GB/T 42709.5-2023 半导体器件 微电子机械器件 第5部分：射频MEMS开关

Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches

ASTM F1094-87(2005 用直接加压分接抽样阀和用预先消毒塑料包法对电子和微电子器件加工用水微生物监测的测试方法

These test methods provide a field technique for the bacteriological analysis of electronic process waters. The sampling

Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method

ARMY MIL-HDBK-175 VALID NOTICE 1-2000 微电子器件的数据手册

MIL-HDBK-175, dated 1 May 1968, has been reviewed and determined to be valid for use in acquistion

MICROELECTRONIC DEVICE DATA HANDBOOK

ARMY MIL-HDBK-175-1968 微电子器件的数据手册

This document provides guidance for the selection and application of microetectronic devices in Military systems. Emphasis is placed upon

MICROELECTRONIC DEVICE DATA HANDBOOK

SAE AS1142-2002 1992 微电子器件气密性测试

1992 Hermeticity Testing of Microelectronic Devices

GJB 548-1988 微电子器件试验方法和程序

GJB 548A-1996 微电子器件试验方法和程序

GJB 548C-2021 微电子器件试验方法和程序

GJB 548B-2005 微电子器件试验方法和程序

本标准规定了军用微电子器件的环境、机械、电气试验方法和试验程序，以及为保证微电子器件满足预定用途所要求的质量和可靠性而必须的控制和限制措施。 本标准适用于军用及空间应用的微电子器件。 如果承制方标明或声称其半导体集成电路符合本标准的规定，则必须满足方法5004、5005或

Test methods and procedures for microelectronic device

DI-MGMT-81763 A-2009 定制化微电子器件源头保护计划

Customized Microelectronics Devices Source Protection Plan

SJ/T 11705-2018 微电子器件封装的地和电源阻抗测试方法

SJ/T 11703-2018 数字微电子器件封装的串扰特性测试方法

ASTM F459-06 微电子器件金属丝连接抗拉强度测量的标准试验方法

Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

SJ/T 10747-1996 微波电子器件引线颜色标志

color codes for lead wires of microwave devices

IEC PAS 62162:2000 微电子器件抗静电放电阈值的场诱导放电装置模型的试验方法

Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components

GB/T 42709.5-2023 半导体器件 微电子机械器件 第5部分：射频MEMS开关

Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches

ASTM F1094-87(2005 用直接加压分接抽样阀和用预先消毒塑料包法对电子和微电子器件加工用水微生物监测的测试方法

These test methods provide a field technique for the bacteriological analysis of electronic process waters. The sampling

Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method