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小功率发光二极管(非空腔器件)检测

发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22

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军工检测 其他检测

SJ/T 11400-2009 半导体电子 白详细规范

Semiconductor optoeletronic devices-Blank detail specification for lower-power light-emitting diodes

GB/T 36359-2018 半导体电子 白详细规范

Semiconductor optoelectronic devices.Blank detail specification for lower power light-emitting diodes

SJ/T 11393-2009 半导体电子 白详细规范

Semiconductor optoelectronic devices-Blank detail specification for power light-emitting diodes

GB/T 36358-2018 半导体电子 白详细规范

Semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes

GB/T 36360-2018 半导体电子白详细规范

Semiconductor optoelectronic devices.Blank detail specification for middle power light-emitting diodes

BS IEC 60747-5-8:2019 半导体 电效的测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes

SJ/T 11867-2022 硅衬底蓝芯片详细规范

Detailed specifications for silicon substrate blue light low-power light-emitting diode chips

DB35/T 1176-2011 道路照明用

本标准规定了LED道路、隧道照明用功率发光二极管的要求、试验方法、检验规则和包装贮存运输 要求。 本标准适用于LED 道路、隧道照明用1W 功率发光二极管(仅适应于蓝光LED 芯片激发荧光粉形 成的白光LED)。其他功率的功率发光二极管可参照执行。 室内照明用功率发光二极管可参照执行

Power LEDs for road lighting

IEC 60747-5-8:2019 半导体第5-8部分:电子电效试验方法

Semiconductor devices - Part 5-8: Optoelectronic devices - Light emitting diodes - Test method of optoelectronic efficiencies of light emitting diodes

BS IEC 60747-5-11:2019 半导体 辐射和辐射电流的测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes

SJ/T 11866-2022 半导体电子 硅衬底白详细规范

Semiconductor optoelectronic devices - Detailed specifications for silicon substrate white light power light emitting diodes

EN 120001:1992 白详细规范.阵列.没有内逻辑部和电阻的显示

Blank detail specification; light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor

SJ/T 11398-2009 半导体芯片技术规范

本规范规定了功率半导体发光二极管芯片产品的技术要求、检验规则和检验方法,芯片的具体规格和性能指标在相关的详细规范中规定

Technical specification for power light-emitting diode chips

DIN EN 120001:1993 白详细规范.阵列和没有内逻辑部和电阻的显示

The document contains the document CECC 20001, which is a blank detail specification within the CECC-quality assessment system for electronic

Blank detail specification: light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor; German version EN 120001:1992

PD IEC TR 60747-5-12:2021 半导体 LED效测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of LED efficiencies

SJ/T 11400-2009 半导体电子 白详细规范

Semiconductor optoeletronic devices-Blank detail specification for lower-power light-emitting diodes

GB/T 36359-2018 半导体电子 白详细规范

Semiconductor optoelectronic devices.Blank detail specification for lower power light-emitting diodes

SJ/T 11393-2009 半导体电子 白详细规范

Semiconductor optoelectronic devices-Blank detail specification for power light-emitting diodes

GB/T 36358-2018 半导体电子 白详细规范

Semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes

GB/T 36360-2018 半导体电子白详细规范

Semiconductor optoelectronic devices.Blank detail specification for middle power light-emitting diodes

BS IEC 60747-5-8:2019 半导体 电效的测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes

SJ/T 11867-2022 硅衬底蓝芯片详细规范

Detailed specifications for silicon substrate blue light low-power light-emitting diode chips

DB35/T 1176-2011 道路照明用

本标准规定了LED道路、隧道照明用功率发光二极管的要求、试验方法、检验规则和包装贮存运输 要求。 本标准适用于LED 道路、隧道照明用1W 功率发光二极管(仅适应于蓝光LED 芯片激发荧光粉形 成的白光LED)。其他功率的功率发光二极管可参照执行。 室内照明用功率发光二极管可参照执行

Power LEDs for road lighting

IEC 60747-5-8:2019 半导体第5-8部分:电子电效试验方法

Semiconductor devices - Part 5-8: Optoelectronic devices - Light emitting diodes - Test method of optoelectronic efficiencies of light emitting diodes

BS IEC 60747-5-11:2019 半导体 辐射和辐射电流的测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes

SJ/T 11866-2022 半导体电子 硅衬底白详细规范

Semiconductor optoelectronic devices - Detailed specifications for silicon substrate white light power light emitting diodes

EN 120001:1992 白详细规范.阵列.没有内逻辑部和电阻的显示

Blank detail specification; light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor

SJ/T 11398-2009 半导体芯片技术规范

本规范规定了功率半导体发光二极管芯片产品的技术要求、检验规则和检验方法,芯片的具体规格和性能指标在相关的详细规范中规定

Technical specification for power light-emitting diode chips

DIN EN 120001:1993 白详细规范.阵列和没有内逻辑部和电阻的显示

The document contains the document CECC 20001, which is a blank detail specification within the CECC-quality assessment system for electronic

Blank detail specification: light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor; German version EN 120001:1992

PD IEC TR 60747-5-12:2021 半导体 LED效测试方法

Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of LED efficiencies

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