SJ/T 10147-1991 集成电路防静电包装管
本标准规定了集成电路防静电包装管的技术要求、试验方法及检验规则等内容。 本标准适用于集成电路的包装，亦适用于其它半导体器件的包装
Detail specification for electronic components--Semiconductor integrated circuits--CT54LS195/CT74LS195 4-bit parallel-access shift register
QJ 2775-1995 集成电路包装规范
Integrated Circuit Packaging Specification
ARMY MIL-HDBK-773 A-2005 防静电包装
This appendix provides information on how to obtain training for the correct procedures and practices to receive, handle, pack, mark, store, and ship
ELECTROSTATIC DISCHARGE PROTECTIVE PACKAGING
GJB/Z 86-1997 防静电包装手册
Anti-static Packaging Manual
JUS N.R1.800-1980 静电感应装置．MOS集成回路预警处理
Static sensitive devices. Handling preeautions for MOS integrated circuits
KS C IEC 60748-2-8:2002 半导体器件.集成电路.第2部分:数字集成电路.第8节:集成电路静态读、写存储器
서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07
Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
SJ/T 11587-2016 电子产品防静电包装技术要求
Technical requirements for anti-static packaging of electronic products
GOST R IEC 60748-11-1-2001 半导体装置集成电路.第11部分.第1节.半导体集成电路(不包括混合电路)内部目检
Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
DS/IEC 748-2:1993 半导体装置．集成电路．第2部分：数字集成电路
Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DS/IEC 748-3:1993 半导体装置．集成电路．第3部分：模拟集成电路
Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
DS/IEC 748-4:1993 半导体装置．集成电路．第4部分：接口集成电路
Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits
JEITA ED-7301A-2007 集成电路包装个别规格的制备用手册
This standard stipulates the requirements for drafting individual standards of integrated circuit packages (hereafter referred to as individual
Manual for preparation of individual standards of integrated circuits packages
JEITA ED-7302A-2007 集成电路包装设计指南的制备用手册
This standard stipulates the general requirements for drafting design guides of integrated circuit packages (hereafter referred to as design guide
Manual for preparation of design guides of integrated circuits packages
JEDEC JEP130A-2006 多元容器包装中的集成电路包装与标签指南(导管,实验托盘,带,和盘)
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
WJ 2567-2002 防静电复合薄膜包装袋规范
Specification for antistatic composite film packaging bags
SJ/T 10147-1991 集成电路防静电包装管
本标准规定了集成电路防静电包装管的技术要求、试验方法及检验规则等内容。 本标准适用于集成电路的包装，亦适用于其它半导体器件的包装
Detail specification for electronic components--Semiconductor integrated circuits--CT54LS195/CT74LS195 4-bit parallel-access shift register
QJ 2775-1995 集成电路包装规范
Integrated Circuit Packaging Specification
ARMY MIL-HDBK-773 A-2005 防静电包装
This appendix provides information on how to obtain training for the correct procedures and practices to receive, handle, pack, mark, store, and ship
ELECTROSTATIC DISCHARGE PROTECTIVE PACKAGING
GJB/Z 86-1997 防静电包装手册
Anti-static Packaging Manual
JUS N.R1.800-1980 静电感应装置．MOS集成回路预警处理
Static sensitive devices. Handling preeautions for MOS integrated circuits
KS C IEC 60748-2-8:2002 半导体器件.集成电路.第2部分:数字集成电路.第8节:集成电路静态读、写存储器
서 문 이 규격은 1993년 초판으로 발행된 IEC 60748-2-8(1993-07
Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
SJ/T 11587-2016 电子产品防静电包装技术要求
Technical requirements for anti-static packaging of electronic products
GOST R IEC 60748-11-1-2001 半导体装置集成电路.第11部分.第1节.半导体集成电路(不包括混合电路)内部目检
Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
DS/IEC 748-2:1993 半导体装置．集成电路．第2部分：数字集成电路
Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DS/IEC 748-3:1993 半导体装置．集成电路．第3部分：模拟集成电路
Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
DS/IEC 748-4:1993 半导体装置．集成电路．第4部分：接口集成电路
Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits
JEITA ED-7301A-2007 集成电路包装个别规格的制备用手册
This standard stipulates the requirements for drafting individual standards of integrated circuit packages (hereafter referred to as individual
Manual for preparation of individual standards of integrated circuits packages
JEITA ED-7302A-2007 集成电路包装设计指南的制备用手册
This standard stipulates the general requirements for drafting design guides of integrated circuit packages (hereafter referred to as design guide
Manual for preparation of design guides of integrated circuits packages
JEDEC JEP130A-2006 多元容器包装中的集成电路包装与标签指南(导管,实验托盘,带,和盘)
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
WJ 2567-2002 防静电复合薄膜包装袋规范
Specification for antistatic composite film packaging bags
编辑：北检院编辑部
