非密封表面贴装器件检测

JEDEC JESD22-A113F-2008 可靠性测试前非密封表面贴装器件的预处理

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

JEDEC JESD22-A113G-2015 可靠性测试前非密封表面贴装器件的预处理

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

JEDEC J-STD-020E-2014 非密封表面贴装器件的湿气/回流敏感度分类

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

PAS 62182-2000 可靠性测试前非密封表面贴装器件的预处理（1.0 版）

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (Edition 1.0)

KS C IEC PAS 62182-2003(2008 在进行可靠性测试之前对非密封表面贴装器件进行预处理

Preconditioning of nonhermetic surface mount devices prior to reliability testing

UNE-EN IEC 60749-30:2020 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)

DIN EN IEC 60749-30:2023-02 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...

BS EN IEC 60749-30:2020 半导体器件 机械和气候测试方法 在可靠性测试之前对非密封表面贴装器件进行预处理

What is BS EN IEC 60749 ‑ 30 about?    BS EN IEC 60749 ‑ 30 is the 30th part of the multimerise Internation standard

Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing

LST EN 60749-30-2005 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2005）

Semiconductor devices. Mechanical and climatic test methods. Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005)

PN-EN IEC 60749-30-2021-05 E 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2020）

Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)

LST EN 60749-30-2005/A1-2011 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2005/A1:2011）

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005/A1:2011)

19/30394481 DC BS EN IEC 60749-30 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

BS EN IEC 60749-30. Semiconductor devices. Mechanical and climatic test methods. Part 30. Preconditioning of non-hermetic surface mount devices prior to reliability testing

JEDEC J-STD-020C-2004 非密封固态表面贴装器件湿度／再流焊敏感度分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC/JEDEC J-STD-020A-1999 非密封固态表面贴装器件的湿气/回流敏感度分类

Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices

IPC IPC/JEDEC J-STD-020B-2002 非密封固态表面贴装器件的湿气/回流敏感度分类取代了 IPC/JEDEC J-STD-020A

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Supersedes IPC/JEDEC J-STD-020A

JEDEC JESD22-A113F-2008 可靠性测试前非密封表面贴装器件的预处理

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

JEDEC JESD22-A113G-2015 可靠性测试前非密封表面贴装器件的预处理

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

JEDEC J-STD-020E-2014 非密封表面贴装器件的湿气/回流敏感度分类

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

PAS 62182-2000 可靠性测试前非密封表面贴装器件的预处理（1.0 版）

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (Edition 1.0)

KS C IEC PAS 62182-2003(2008 在进行可靠性测试之前对非密封表面贴装器件进行预处理

Preconditioning of nonhermetic surface mount devices prior to reliability testing

UNE-EN IEC 60749-30:2020 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)

DIN EN IEC 60749-30:2023-02 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...

BS EN IEC 60749-30:2020 半导体器件 机械和气候测试方法 在可靠性测试之前对非密封表面贴装器件进行预处理

What is BS EN IEC 60749 ‑ 30 about?    BS EN IEC 60749 ‑ 30 is the 30th part of the multimerise Internation standard

Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing

LST EN 60749-30-2005 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2005）

Semiconductor devices. Mechanical and climatic test methods. Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005)

PN-EN IEC 60749-30-2021-05 E 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2020）

Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)

LST EN 60749-30-2005/A1-2011 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理（IEC 60749-30:2005/A1:2011）

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005/A1:2011)

19/30394481 DC BS EN IEC 60749-30 半导体器件 机械和气候测试方法 第30部分：可靠性测试前非密封表面贴装器件的预处理

BS EN IEC 60749-30. Semiconductor devices. Mechanical and climatic test methods. Part 30. Preconditioning of non-hermetic surface mount devices prior to reliability testing

JEDEC J-STD-020C-2004 非密封固态表面贴装器件湿度／再流焊敏感度分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC/JEDEC J-STD-020A-1999 非密封固态表面贴装器件的湿气/回流敏感度分类

Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices

IPC IPC/JEDEC J-STD-020B-2002 非密封固态表面贴装器件的湿气/回流敏感度分类取代了 IPC/JEDEC J-STD-020A

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Supersedes IPC/JEDEC J-STD-020A