T/ZZB 1651-2020 有金属化孔单双面印制板
本标准规定了有金属化孔单双面印制板（下述简称印制板）的术语和定义、基本要求、技术要求、试验方法、检验规则、标志、包装、运输和贮存及质量承诺。 本标准适用于有金属化孔单双面印制板
Single and double sided printed boards with plated-through holes
GB/T 4588.2-1996 有金属化孔单双面印制板分规范
本文件是有金属化孔单双面印制板分规范（SS），当它们准备安装元器件时，不必考虑其制造方法，本规范规定了能力批准试验和质量一致性检验（逐批和周期）所评定的性能及其试验方法
Sectional specification:Single and double sided printed boards with plated-through holes
SJ/T 10716-1996 有金属化孔单双面印制板能力详细规范
本能力详细规范(CapDS)是根据IEC/PQC90制定的，它涉及到用第2章规定的材料和表面镀涂覆层制作的有金属化孔单双面印制板
Capability detail specification:single and double sided printed boards with plated-through holes
TCVN 6611-5-2000 印制板.第5部分:有金属化孔单双面印制板规范
Printed boards.Part 5.Specification for single and double sided rigid printed boards with plated-through holes
SJ/T 9545-1993 有金属化孔的单、双面印制板的质量分等标准
本标准适用于环氧玻璃布基材制作的，有金属化孔的单、双面印制板的质量等级评定。 本标准只规定了主要性能指标的分等要求，它不是一个独立的标准，必需与GB 4588.2和有关的详细规范一起使用
Grading standard of quality for single and double sided printed boards with plated-through holes
NF C93-705/A1*NF EN 123200/A1:2013 分规格：有金属化孔的单面和双面印制板
Sectional specification : single and double sided printed boards with plated-through holes
SIS SS CECC 23200-1986 分规范．有金属化孔的单双面印制电路板
Sectional specification: Single and double sided printed boards with plated-through holes
KS C IEC 60326-5:2003 印制板.第5部分:具有金属化孔的单面和双面印制板规范
이 규격은 제조 방법에 관계 없이, 도금 관통 홀이 있는 단면 및 양면 인쇄 회로기판에
Printed boards-Part 5:Specification for single anddouble sided printed boards with plated-through holes
DS/IEC 326-5:1990 印制板.第5部分:具有金属化孔的单面和双面印制板规范
Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes
KS C IEC 60326-5:2015 印制板 第5部分：具有金属化孔的单面和双面印制板规范
Printed boards－Part 5：Specification for single anddouble sided printed boards with plated-through holes
IEC 60326-5:1980 印制电路板 第5部分:具有金属化孔的单面和双面印制板规范
Contains fundamental information on characteristics to be assessed and requirements for single and double sided printed boards with plated-through
Printed boards. Part 5 : Specification for single and double sided printed boards with plated-through holes
IEC 60326-5/AMD1:1989 印制电路板 第5部分:具有金属化孔的单面和双面印制板规范 修改1
Amends the title of Part 5 as follows: "Part 5: Specification for single and double sided rigid printed boards with plated-through holes". Adds
Printed boards; part 5: specification for single and double sided printed boards with plated-through holes; amendment No. 1 to IEC 60326-5:1980
DS/IEC 326-4:1990 印制板.第4部分:具有非金属化孔的单面和双面印制板规范
Printed boards. Part 4: Specification for single and double sided printed boards with plain holes
KS C IEC 60326-4:2003 印制板.第4部分:具有非金属化孔的单面和双面印制板规范
이 규격은 제조법과 관계 없이, 평면 홀이 있는 단면 및 양면 인쇄기판에 적용 가능하며
Printed boards-Part 4:Specification for single and doublesided printed boards with plain holes
KS C IEC 60326-4:2013 印制板 第4部分：具有非金属化孔的单面和双面印制板规范
Printed boards－Part 4：Specification for single and doublesided printed boards with plain holes
T/ZZB 1651-2020 有金属化孔单双面印制板
本标准规定了有金属化孔单双面印制板（下述简称印制板）的术语和定义、基本要求、技术要求、试验方法、检验规则、标志、包装、运输和贮存及质量承诺。 本标准适用于有金属化孔单双面印制板
Single and double sided printed boards with plated-through holes
GB/T 4588.2-1996 有金属化孔单双面印制板分规范
本文件是有金属化孔单双面印制板分规范（SS），当它们准备安装元器件时，不必考虑其制造方法，本规范规定了能力批准试验和质量一致性检验（逐批和周期）所评定的性能及其试验方法
Sectional specification:Single and double sided printed boards with plated-through holes
SJ/T 10716-1996 有金属化孔单双面印制板能力详细规范
本能力详细规范(CapDS)是根据IEC/PQC90制定的，它涉及到用第2章规定的材料和表面镀涂覆层制作的有金属化孔单双面印制板
Capability detail specification:single and double sided printed boards with plated-through holes
TCVN 6611-5-2000 印制板.第5部分:有金属化孔单双面印制板规范
Printed boards.Part 5.Specification for single and double sided rigid printed boards with plated-through holes
SJ/T 9545-1993 有金属化孔的单、双面印制板的质量分等标准
本标准适用于环氧玻璃布基材制作的，有金属化孔的单、双面印制板的质量等级评定。 本标准只规定了主要性能指标的分等要求，它不是一个独立的标准，必需与GB 4588.2和有关的详细规范一起使用
Grading standard of quality for single and double sided printed boards with plated-through holes
NF C93-705/A1*NF EN 123200/A1:2013 分规格：有金属化孔的单面和双面印制板
Sectional specification : single and double sided printed boards with plated-through holes
SIS SS CECC 23200-1986 分规范．有金属化孔的单双面印制电路板
Sectional specification: Single and double sided printed boards with plated-through holes
KS C IEC 60326-5:2003 印制板.第5部分:具有金属化孔的单面和双面印制板规范
이 규격은 제조 방법에 관계 없이, 도금 관통 홀이 있는 단면 및 양면 인쇄 회로기판에
Printed boards-Part 5:Specification for single anddouble sided printed boards with plated-through holes
DS/IEC 326-5:1990 印制板.第5部分:具有金属化孔的单面和双面印制板规范
Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes
KS C IEC 60326-5:2015 印制板 第5部分：具有金属化孔的单面和双面印制板规范
Printed boards－Part 5：Specification for single anddouble sided printed boards with plated-through holes
IEC 60326-5:1980 印制电路板 第5部分:具有金属化孔的单面和双面印制板规范
Contains fundamental information on characteristics to be assessed and requirements for single and double sided printed boards with plated-through
Printed boards. Part 5 : Specification for single and double sided printed boards with plated-through holes
IEC 60326-5/AMD1:1989 印制电路板 第5部分:具有金属化孔的单面和双面印制板规范 修改1
Amends the title of Part 5 as follows: "Part 5: Specification for single and double sided rigid printed boards with plated-through holes". Adds
Printed boards; part 5: specification for single and double sided printed boards with plated-through holes; amendment No. 1 to IEC 60326-5:1980
DS/IEC 326-4:1990 印制板.第4部分:具有非金属化孔的单面和双面印制板规范
Printed boards. Part 4: Specification for single and double sided printed boards with plain holes
KS C IEC 60326-4:2003 印制板.第4部分:具有非金属化孔的单面和双面印制板规范
이 규격은 제조법과 관계 없이, 평면 홀이 있는 단면 및 양면 인쇄기판에 적용 가능하며
Printed boards-Part 4:Specification for single and doublesided printed boards with plain holes
KS C IEC 60326-4:2013 印制板 第4部分：具有非金属化孔的单面和双面印制板规范
Printed boards－Part 4：Specification for single and doublesided printed boards with plain holes
编辑：北检院编辑部
