表面安装和外引线同向引出晶体管、二极管检测

SJ/T 960-2000 电子束管侧引出线取向图示法

本标准规定了静电偏转类电子束管侧引出线的相对位置和取向图的表示方法。 本标准适用于有侧引出线的电子束管

Graphic representation for arrangement of side output of electron beam tubes

BS IEC 60747-4:2008 半导体装置.分立装置.微波二极管和晶体管

This part of IEC 60747 gives requirements for the following categories of discrete devices: – variable capacitance diodes and snap-off diodes

Semiconductor devices - Discrete devices - Microwave diodes and transistors

JEDEC JEP84A-2004 晶体管引线温度测量的推荐实践

It is often required to measure the lead temperature of a packaged transistor under various load conditions

Recommend Practice for Measurement of Transistor Lead Temperature

SJ/T 10585-1994 半导体分立器件表面安装器件外形尺寸及其引线框架尺寸

本标准适用于半导体分立器件中表面安装器件的外形及其引线框架

Semiconductor discrete device Dimensions of outline and lead-frame for the surface mounting device

STAS SR CEI 747-4-1995 半导体装置．分离装置．第4部分：微波二极管和晶体管

Semiconductor devices Discrete devices Part 4: Microwave diodes and transistors

IEC 60747-4:2007 半导体装置.分立装置.第4部分:微波二极管和晶体管

This part of IEC 60747 gives requirements for the following categories of discrete devices: – variable capacitance diodes and snap-off diodes

Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors

IPC 7711 5.6.4-1998 引线安装 多引线法

J-Lead Installation Multi-Lead Method

HG 20519.14-1992 管道轴测图索引和管段表索引

Pipe Isometric Drawing Index and Segment Table Index

DIN 14462 Berichtigung 1:2007 灭火用引水管.灭火软管系统和引水管道的规划和安装.DIN 14462-2007勘误表

Water conduit for fire extinguishing - Planning and installation of fire hose systems and water conduit for fire extinguishing, Corrigenda to DIN 14462:2007-01

535ABAE-1987 带非固体电解质和多孔阳极银外壳的固定钽电容器 轴向引线 弹性密封 极化 镍正极 铜负极引线 绝缘

Fixed Tantalum Capacitors with Non-Solid Electrolyte and Porous Anode Silver Case@ Axial Lead@ Elastomeric Seal@ Polarized@ Nickel Positive@ Copper Negative Leads@ Insulated

DLA DSCC-DWG-93027 REV D-2013 电感器，表面贴装，引线

INDUCTOR, SURFACE MOUNT, LEADLESS

AIA/NAS NAS 3429-1971 (Rev. 2)个体包装轴/径向引线

This standard provides a method for the packaging of axial/radid components, (diodes, transistors, resistors capacitors, etc.) in blister packages

Axial/Radial Lead Components, Individual Packaging of (Rev. 2)

ECA IS-34-1987 有引线的表面安装电阻网络固定膜

This industry standard covers *e general requirements for cermet or metal film type resistor networks, prhrily intended for incorporation

Leaded Surface Mount Resistor Networks Fixed Film

TIS 2125-2002 表面安装工艺.分立器件.第9部分:绝缘栅双极型晶体管(IGBT)

Surface mounting technology.discrete devices.part 9: insulated.gate bipolar transistors (igbts)

SJ/T 2214-2015 半导体光电二极管和光电晶体管测试方法

本标准规定了半导体光电二极管和光电晶体管(以下简称“器件”)光电参数的测试方法。本标准适用于半导体光电二极管和光电晶体管光电参数的测试。本标准不适用PIN、雪崩光电二极管的测试

Measuring methods for semiconductor photodiode and phototransistor

SJ/T 960-2000 电子束管侧引出线取向图示法

本标准规定了静电偏转类电子束管侧引出线的相对位置和取向图的表示方法。 本标准适用于有侧引出线的电子束管

Graphic representation for arrangement of side output of electron beam tubes

BS IEC 60747-4:2008 半导体装置.分立装置.微波二极管和晶体管

This part of IEC 60747 gives requirements for the following categories of discrete devices: – variable capacitance diodes and snap-off diodes

Semiconductor devices - Discrete devices - Microwave diodes and transistors

JEDEC JEP84A-2004 晶体管引线温度测量的推荐实践

It is often required to measure the lead temperature of a packaged transistor under various load conditions

Recommend Practice for Measurement of Transistor Lead Temperature

SJ/T 10585-1994 半导体分立器件表面安装器件外形尺寸及其引线框架尺寸

本标准适用于半导体分立器件中表面安装器件的外形及其引线框架

Semiconductor discrete device Dimensions of outline and lead-frame for the surface mounting device

STAS SR CEI 747-4-1995 半导体装置．分离装置．第4部分：微波二极管和晶体管

Semiconductor devices Discrete devices Part 4: Microwave diodes and transistors

IEC 60747-4:2007 半导体装置.分立装置.第4部分:微波二极管和晶体管

This part of IEC 60747 gives requirements for the following categories of discrete devices: – variable capacitance diodes and snap-off diodes

Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors

IPC 7711 5.6.4-1998 引线安装 多引线法

J-Lead Installation Multi-Lead Method

HG 20519.14-1992 管道轴测图索引和管段表索引

Pipe Isometric Drawing Index and Segment Table Index

DIN 14462 Berichtigung 1:2007 灭火用引水管.灭火软管系统和引水管道的规划和安装.DIN 14462-2007勘误表

Water conduit for fire extinguishing - Planning and installation of fire hose systems and water conduit for fire extinguishing, Corrigenda to DIN 14462:2007-01

535ABAE-1987 带非固体电解质和多孔阳极银外壳的固定钽电容器 轴向引线 弹性密封 极化 镍正极 铜负极引线 绝缘

Fixed Tantalum Capacitors with Non-Solid Electrolyte and Porous Anode Silver Case@ Axial Lead@ Elastomeric Seal@ Polarized@ Nickel Positive@ Copper Negative Leads@ Insulated

DLA DSCC-DWG-93027 REV D-2013 电感器，表面贴装，引线

INDUCTOR, SURFACE MOUNT, LEADLESS

AIA/NAS NAS 3429-1971 (Rev. 2)个体包装轴/径向引线

This standard provides a method for the packaging of axial/radid components, (diodes, transistors, resistors capacitors, etc.) in blister packages

Axial/Radial Lead Components, Individual Packaging of (Rev. 2)

ECA IS-34-1987 有引线的表面安装电阻网络固定膜

This industry standard covers *e general requirements for cermet or metal film type resistor networks, prhrily intended for incorporation

Leaded Surface Mount Resistor Networks Fixed Film

TIS 2125-2002 表面安装工艺.分立器件.第9部分:绝缘栅双极型晶体管(IGBT)

Surface mounting technology.discrete devices.part 9: insulated.gate bipolar transistors (igbts)

SJ/T 2214-2015 半导体光电二极管和光电晶体管测试方法

本标准规定了半导体光电二极管和光电晶体管(以下简称“器件”)光电参数的测试方法。本标准适用于半导体光电二极管和光电晶体管光电参数的测试。本标准不适用PIN、雪崩光电二极管的测试

Measuring methods for semiconductor photodiode and phototransistor