SJ/T 10456-1993 混合集成电路用被釉钢基片
本标准适用于以低碳钢、不锈钢等金属为芯板、表面被覆一层瓷釉的混合集成电路用被釉钢基片
Porcelain enameled steel substrate for hybrid integrated circuits
DLA SMD-5962-94667-1995 1750芯片集硅辐射多片状微电路数字微电路
This drawing forms a part of a one part -one part number documentation system (see 6.6 herein
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
GB 50809-2012 硅集成电路芯片工厂设计规范
本规范适用于新建、改建和扩建的硅集成电路芯片工厂的工程设计
Code for design of silicon integrated circuits wafer fab
GB/T 12842-1991 膜集成电路和混合膜集成电路术语
本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
GB/T 8976-1996 膜集成电路和混合膜集成电路总规范
本总规范适用于膜集成电路和混合膜集成电路（F＆HFICs），包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F＆HFICs。 本规范适用于供用户继续加工的半成品F＆HFICs，也适用于装有一个以上芯片的片式载体电路，而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
SJ 52438/7-2000 混合集成电路.HRV013型多路基准电压源详细规范
Hybrid integrated circuits.Detail specification for type HRV013 voltage reference,multichannel
JEDEC JEP133B-2005 辐射多芯片模块和混合微电路的生产指南
The development of radiation-hardened multichip modules and hybrid microcircuits can take place in one of three ways
Guide for the Production and Acquisition of Radiation-Hardness- Assured Multichip Modules and Hybrid Microcircuits
IEC 60748-20:1988 半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范
Also covers partly-completed film integrated circuits and hybrid film integrated circuits, both active and passive, supplied to customers
Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
GB/T 15138-1994 膜集成电路和混合集成电路外形尺寸
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸，适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
EN 163100:1991 分规范.薄膜集成电路和混合集成电路
Sectional specification: film and hybrid integrated circuits
DLA SMD-5962-92061 REV G-2008 微电路、混合、数字、多芯片、双通道、驱动器-接收器
MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
KS C IEC 60748-20:2021 半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范
Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2021 半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范
Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
BS IEC 60748-11:2000 半导体器件.集成电路.半导体集成电路(混合电路除外)的分规范
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS IEC 60748-11:1991 半导体器件 集成电路 半导体集成电路（混合电路除外）的分规范
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
SJ/T 10456-1993 混合集成电路用被釉钢基片
本标准适用于以低碳钢、不锈钢等金属为芯板、表面被覆一层瓷釉的混合集成电路用被釉钢基片
Porcelain enameled steel substrate for hybrid integrated circuits
DLA SMD-5962-94667-1995 1750芯片集硅辐射多片状微电路数字微电路
This drawing forms a part of a one part -one part number documentation system (see 6.6 herein
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
GB 50809-2012 硅集成电路芯片工厂设计规范
本规范适用于新建、改建和扩建的硅集成电路芯片工厂的工程设计
Code for design of silicon integrated circuits wafer fab
GB/T 12842-1991 膜集成电路和混合膜集成电路术语
本标准规定了膜集成电路和混合膜集成电路的术语。 本标准适用于膜集成电路和混合膜集成电路的生产、使用、科研、教学和贸易
Terminology for film integrated circuits and hybrid film integrated circuits
GB/T 8976-1996 膜集成电路和混合膜集成电路总规范
本总规范适用于膜集成电路和混合膜集成电路（F＆HFICs），包括GB/T16464-1996第Ⅳ章第2.4条中的源和有源的F＆HFICs。 本规范适用于供用户继续加工的半成品F＆HFICs，也适用于装有一个以上芯片的片式载体电路，而且这些芯片应作为分立的单元用膜互连技术互连起来
Generic specification for film integrated circuits and hybrid film integrated circuits
SJ 52438/7-2000 混合集成电路.HRV013型多路基准电压源详细规范
Hybrid integrated circuits.Detail specification for type HRV013 voltage reference,multichannel
JEDEC JEP133B-2005 辐射多芯片模块和混合微电路的生产指南
The development of radiation-hardened multichip modules and hybrid microcircuits can take place in one of three ways
Guide for the Production and Acquisition of Radiation-Hardness- Assured Multichip Modules and Hybrid Microcircuits
IEC 60748-20:1988 半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范
Also covers partly-completed film integrated circuits and hybrid film integrated circuits, both active and passive, supplied to customers
Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
GB/T 15138-1994 膜集成电路和混合集成电路外形尺寸
本标准规定了膜集成电路和混合集成电路的封装形式及外形尺寸，适用于膜集成电路和混合集成电路成品尺寸检验和封装设计
Case outlines for film integrated circuits and hybrid integrated circuits
EN 163100:1991 分规范.薄膜集成电路和混合集成电路
Sectional specification: film and hybrid integrated circuits
DLA SMD-5962-92061 REV G-2008 微电路、混合、数字、多芯片、双通道、驱动器-接收器
MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
KS C IEC 60748-20:2021 半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范
Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2021 半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范
Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
BS IEC 60748-11:2000 半导体器件.集成电路.半导体集成电路(混合电路除外)的分规范
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS IEC 60748-11:1991 半导体器件 集成电路 半导体集成电路（混合电路除外）的分规范
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
编辑：北检院编辑部
