有贯穿连接的刚挠多层印制板检测

GB/T 18335-2001 有贯穿连接的刚挠多层印制板规范

本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的刚挠多层印制板，与其制造方法关，目的是作为供需双方签定协议的基础。本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆

Specification for flex-rigid multilayer printed boards with through connections

TCVN 6611-11-2000 印制板.第11部分:有贯穿连接的刚挠多层印制板规范

Printed boards.Part 11.Specification for flexrigid multilayer printed boards with through connections

TIS 2104-2001 印制板.第11部分:有贯穿连接的刚挠多层印制板规范

Printed boards.part 11: specification for flex-rigid multilayer printed boards with through connections

IEC 60326-11:1991 印制电路板 第11部分:有贯穿连接的刚-挠多层印制电路板规范

Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions

Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections

GB/T 18334-2001 有贯穿连接的挠性多层印制板规范

本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的挠性多层印制板规范，与其制造方法关，目的是作为供需求双方签定协议的基础。 本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆

Specification for flexible multilayer printed boards with through conections

TCVN 6611-9-2000 印制板.第9部分:有贯穿连接的挠性多层印制板规范

Printed boards.Part 9.Specification for flexible multilayer printed boards with through connections

TIS 2075-2001 印制板.第9部分:有贯穿连接的挠性多层印制板规范

Printed boards.part 9: specification for fiexible multilayer printed boards with through connections

GB/T 4588.10-1995 印制板 第10部分;有贯穿连接的刚挠双面印制板规范

本标准涉及有贯穿连接的刚挠双面印制板，而与它的制造方法关。本标准将作为供需双方签订合同的基础。本标准规定了应评定的性能和试验方法，并建立了鉴定性能和尺寸的统一要求。本标准所用的“有关规范”术语即指这些协议。本标准不适用于扁平电缆

Printed boards. Part 10: Specification for flex-rigid double-sided printed boards with through connections

IEC 60326-9:1991 印制电路板 第9部分:有贯穿连接的挠性多层印制板规范

Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions

Printed boards; part 9: specification for flexible multilayer printed boards with through connections

TCVN 6611-10-2000 印制板.第10部分:有贯穿连接的刚挠双面印制板规范

Printed boards.Part 10.Specification for flexrigid double sided printed boards with through connections

TIS 2103-2001 印制板.第10部分:有贯穿连接的刚挠双面印制板规范

Printed boards.part 10: specification for flex-rigid double-sided printed boards with through connections

KS C IEC 60326-9:2003 印制电路板.第9部分:有贯穿连接的挠性多层印制板规范

이 규격은 제조 방법에 관계 없이, 관통 접속하는 연성 다층 인쇄 회로기판에 적용 가능

Printed boards-Part 9:Specification for flexible multilayer printedboards with through connections

DS/IEC 326-11:1992 印制电路板．第11部分：有贯穿连接的挠性多层印制板规范

Printed boards. Part 11: Specification for flex rigid multilayer printed boards with through connections

KS C IEC 60326-9:2013 印制电路板 第9部分：有贯穿连接的挠性多层印制板规范

Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections

BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范

Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods

Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections

GB/T 18335-2001 有贯穿连接的刚挠多层印制板规范

本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的刚挠多层印制板，与其制造方法关，目的是作为供需双方签定协议的基础。本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆

Specification for flex-rigid multilayer printed boards with through connections

TCVN 6611-11-2000 印制板.第11部分:有贯穿连接的刚挠多层印制板规范

Printed boards.Part 11.Specification for flexrigid multilayer printed boards with through connections

TIS 2104-2001 印制板.第11部分:有贯穿连接的刚挠多层印制板规范

Printed boards.part 11: specification for flex-rigid multilayer printed boards with through connections

IEC 60326-11:1991 印制电路板 第11部分:有贯穿连接的刚-挠多层印制电路板规范

Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions

Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections

GB/T 18334-2001 有贯穿连接的挠性多层印制板规范

本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的挠性多层印制板规范，与其制造方法关，目的是作为供需求双方签定协议的基础。 本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆

Specification for flexible multilayer printed boards with through conections

TCVN 6611-9-2000 印制板.第9部分:有贯穿连接的挠性多层印制板规范

Printed boards.Part 9.Specification for flexible multilayer printed boards with through connections

TIS 2075-2001 印制板.第9部分:有贯穿连接的挠性多层印制板规范

Printed boards.part 9: specification for fiexible multilayer printed boards with through connections

GB/T 4588.10-1995 印制板 第10部分;有贯穿连接的刚挠双面印制板规范

本标准涉及有贯穿连接的刚挠双面印制板，而与它的制造方法关。本标准将作为供需双方签订合同的基础。本标准规定了应评定的性能和试验方法，并建立了鉴定性能和尺寸的统一要求。本标准所用的“有关规范”术语即指这些协议。本标准不适用于扁平电缆

Printed boards. Part 10: Specification for flex-rigid double-sided printed boards with through connections

IEC 60326-9:1991 印制电路板 第9部分:有贯穿连接的挠性多层印制板规范

Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions

Printed boards; part 9: specification for flexible multilayer printed boards with through connections

TCVN 6611-10-2000 印制板.第10部分:有贯穿连接的刚挠双面印制板规范

Printed boards.Part 10.Specification for flexrigid double sided printed boards with through connections

TIS 2103-2001 印制板.第10部分:有贯穿连接的刚挠双面印制板规范

Printed boards.part 10: specification for flex-rigid double-sided printed boards with through connections

KS C IEC 60326-9:2003 印制电路板.第9部分:有贯穿连接的挠性多层印制板规范

이 규격은 제조 방법에 관계 없이, 관통 접속하는 연성 다층 인쇄 회로기판에 적용 가능

Printed boards-Part 9:Specification for flexible multilayer printedboards with through connections

DS/IEC 326-11:1992 印制电路板．第11部分：有贯穿连接的挠性多层印制板规范

Printed boards. Part 11: Specification for flex rigid multilayer printed boards with through connections

KS C IEC 60326-9:2013 印制电路板 第9部分：有贯穿连接的挠性多层印制板规范

Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections

BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范

Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods

Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections