刚性多层印制板检测

GB/T 4588.4-2017 刚性多层印制板分规范

Sectional specification for rigid multilayer printed boards

IPC ML-950C-1986 刚性多层印制板性能规范

This specification covers qualification and performance of rigid multilayer printed boards with platedthrough holes. Circuitry may be bare copper

Performance Specification for Rigid Multilayer Printed Boards

DB34/T 3366-2019 刚性多层印制板吸水率的测试方法

本标准规定了刚性多层印制电路板吸水率的仪器及设备、测试步骤、结果计算和报告。 本标准适用于测试刚性多层印制电路板的吸水率

Test method for water absorption of rigid multilayer printed boards

BS 123300:2001 质量评估体系.分规范.刚性多层印制板

To be read in conjunction with BS 123000:2001

System of quality assessment - Sectional specification - Rigid multilayer printed boards

BS 123300-003:2001 质量评估体系.性能详细规范.刚性多层印制板

To be read in conjunction with BS 123000:2001, BS 123300:2001

System of quality assessment - Capability detail specification - Rigid multilayer printed boards

KS C IEC 62326-4-2011(2021 印制板第4部分:层间连接刚性多层印制板分规范

Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification

KS C IEC 62326-4-2011(2016 印制板第4部分:层间连接刚性多层印制板分规范

Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification

BS EN 62326-4:1997 印刷板 具有层间连接的刚性多层印制板 截面规格

This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which

Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification

EN 62326-4:1997 印制板.第4部分:层间连接的刚性多层印制板分规范 IEC 23264-1996

Printed Boards; Part 4: Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specifications

NF EN 62326-4:1998 印制板 第4部分：具有层间连接的刚性多层印制板 中间规范

Cartes imprimées - Partie 4 : cartes imprimées multicouches rigides avec connexions intercouches - Spécification intermédiaire.

DB34/T 1439-2011 刚性及多层印制板用基材

本标准适用于刚性及多层印制板用基材

Base Materials for Rigid and Multilayer Printed Boards

IPC 4101E CHINESE-2017 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE CD-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101-1997 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C-2009 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

GB/T 4588.4-2017 刚性多层印制板分规范

Sectional specification for rigid multilayer printed boards

IPC ML-950C-1986 刚性多层印制板性能规范

This specification covers qualification and performance of rigid multilayer printed boards with platedthrough holes. Circuitry may be bare copper

Performance Specification for Rigid Multilayer Printed Boards

DB34/T 3366-2019 刚性多层印制板吸水率的测试方法

本标准规定了刚性多层印制电路板吸水率的仪器及设备、测试步骤、结果计算和报告。 本标准适用于测试刚性多层印制电路板的吸水率

Test method for water absorption of rigid multilayer printed boards

BS 123300:2001 质量评估体系.分规范.刚性多层印制板

To be read in conjunction with BS 123000:2001

System of quality assessment - Sectional specification - Rigid multilayer printed boards

BS 123300-003:2001 质量评估体系.性能详细规范.刚性多层印制板

To be read in conjunction with BS 123000:2001, BS 123300:2001

System of quality assessment - Capability detail specification - Rigid multilayer printed boards

KS C IEC 62326-4-2011(2021 印制板第4部分:层间连接刚性多层印制板分规范

Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification

KS C IEC 62326-4-2011(2016 印制板第4部分:层间连接刚性多层印制板分规范

Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification

BS EN 62326-4:1997 印刷板 具有层间连接的刚性多层印制板 截面规格

This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which

Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification

EN 62326-4:1997 印制板.第4部分:层间连接的刚性多层印制板分规范 IEC 23264-1996

Printed Boards; Part 4: Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specifications

NF EN 62326-4:1998 印制板 第4部分：具有层间连接的刚性多层印制板 中间规范

Cartes imprimées - Partie 4 : cartes imprimées multicouches rigides avec connexions intercouches - Spécification intermédiaire.

DB34/T 1439-2011 刚性及多层印制板用基材

本标准适用于刚性及多层印制板用基材

Base Materials for Rigid and Multilayer Printed Boards

IPC 4101E CHINESE-2017 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C CHINESE CD-2009 刚性和多层印制板基材规范

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101-1997 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC 4101C-2009 刚性和多层印制板基材规范

This specification covers the requirements for base materials@ herein referred to as laminate or prepreg@ to be used primarily for rigid or multilayer

Specification for Base Materials for Rigid and Multilayer Printed Boards