GJB 10318-2021 中温固化结构胶膜规范
Specification for medium temperature curing structural adhesive films
GJB 6258-2008 J-系列高温固化载体结构胶膜规范
本规范规定了J-系列高温固化载体结构胶膜（简称胶膜）的要求、质量保证、交货准备和说明事项等。 本规范适用于以环氧树脂为主要成分、尼龙纱网为载体的胶膜
Specification for J-series carrier structural adhesive films curing at high temperature
FORD ESB-M2G239-A-2002 半结构用乙烯树脂基低温和高温固化型胶粘剂*与标准FORD WSS-M99P1111-A一起使用*
ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL *TO BE USED WITH FORD WSS-M99P1111-A*
FORD ESB-M2G347-A-1990 结构用两组分室温固化或感应固化环氧树脂混合型胶粘剂
ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL
GJB 8735-2015 J-系列高温固化载体结构胶膜规范
J-Series High Temperature Curing Carrier Structural Adhesive Film Specification
FORD ESB-M2G239-A-2014 胶粘剂，基于乙烯基 低温和高温固化，半结构 *与福特 WSS-M99P1111-A 一起使用*
ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL *TO BE USED WITH FORD WSS-M99P1111-A*
T/SHDSGY 051-2023 低温固化单组分导电胶
本标准规定了低温固化单组分低应力绝缘胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本标准适用于低温固化单组分低应力绝缘胶
Low temperature curing single component conductive adhesive
NAVY MIL-S-85420 (1)-2000 飞机结构低温固化聚硫快速抢修密封化合物
This amendment forms a part of MIL-S-85420(AS), dated 14 October 1980, and is approved for use by the Naval Air Systems Command, Department
SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES
NAVY MIL-S-85420-1980 飞机结构低温固化聚硫快速抢修密封化合物
This specification establishes requirements for two 'types and classes of a two component, low temperature curing, polysulfide, sealing compound
SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES
T/SHDSGY 052-2023 低温固化单组分低应力绝缘胶
本文件规定了低温固化单组分导电胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本文件适用于低温固化单组分导电胶
Low temperature curing single component low stress insulating adhesive
SAE AMS-S-85420A-2011 飞机结构用密封剂 快速修复 低温固化多硫化物
This specification establishes requirements for two types and classes of a two component@ low temperature curing@ polysulfide@ sealing compound
Sealing Compounds@ Quick Repair@ Low Temperature Curing Polysulfide@ for Aircraft Structures
GM 9985524-1989 低温固化芯片耐塑胶涂层
Freigabemuster, für die diese Vorschrift zutrifft, müssen nach dieser Vorschrift geprüft werden und von der Produktentwicklung und Konstruktion
Coating, Chip Resistant Plastisol, Low Temperature Cure
SAE AMS3731/5A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低放热
This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/7-1981 灌封胶，环氧双酚 A 型填充，室温固化，低收缩
This specification covers an filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE AMS3731/7A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低收缩
This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
GJB 10318-2021 中温固化结构胶膜规范
Specification for medium temperature curing structural adhesive films
GJB 6258-2008 J-系列高温固化载体结构胶膜规范
本规范规定了J-系列高温固化载体结构胶膜（简称胶膜）的要求、质量保证、交货准备和说明事项等。 本规范适用于以环氧树脂为主要成分、尼龙纱网为载体的胶膜
Specification for J-series carrier structural adhesive films curing at high temperature
FORD ESB-M2G239-A-2002 半结构用乙烯树脂基低温和高温固化型胶粘剂*与标准FORD WSS-M99P1111-A一起使用*
ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL *TO BE USED WITH FORD WSS-M99P1111-A*
FORD ESB-M2G347-A-1990 结构用两组分室温固化或感应固化环氧树脂混合型胶粘剂
ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL
GJB 8735-2015 J-系列高温固化载体结构胶膜规范
J-Series High Temperature Curing Carrier Structural Adhesive Film Specification
FORD ESB-M2G239-A-2014 胶粘剂，基于乙烯基 低温和高温固化，半结构 *与福特 WSS-M99P1111-A 一起使用*
ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL *TO BE USED WITH FORD WSS-M99P1111-A*
T/SHDSGY 051-2023 低温固化单组分导电胶
本标准规定了低温固化单组分低应力绝缘胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本标准适用于低温固化单组分低应力绝缘胶
Low temperature curing single component conductive adhesive
NAVY MIL-S-85420 (1)-2000 飞机结构低温固化聚硫快速抢修密封化合物
This amendment forms a part of MIL-S-85420(AS), dated 14 October 1980, and is approved for use by the Naval Air Systems Command, Department
SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES
NAVY MIL-S-85420-1980 飞机结构低温固化聚硫快速抢修密封化合物
This specification establishes requirements for two 'types and classes of a two component, low temperature curing, polysulfide, sealing compound
SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES
T/SHDSGY 052-2023 低温固化单组分低应力绝缘胶
本文件规定了低温固化单组分导电胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本文件适用于低温固化单组分导电胶
Low temperature curing single component low stress insulating adhesive
SAE AMS-S-85420A-2011 飞机结构用密封剂 快速修复 低温固化多硫化物
This specification establishes requirements for two types and classes of a two component@ low temperature curing@ polysulfide@ sealing compound
Sealing Compounds@ Quick Repair@ Low Temperature Curing Polysulfide@ for Aircraft Structures
GM 9985524-1989 低温固化芯片耐塑胶涂层
Freigabemuster, für die diese Vorschrift zutrifft, müssen nach dieser Vorschrift geprüft werden und von der Produktentwicklung und Konstruktion
Coating, Chip Resistant Plastisol, Low Temperature Cure
SAE AMS3731/5A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低放热
This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/7-1981 灌封胶，环氧双酚 A 型填充，室温固化，低收缩
This specification covers an filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE AMS3731/7A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低收缩
This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
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