低温固化型结构胶检测

GJB 10318-2021 中温固化结构胶膜规范

Specification for medium temperature curing structural adhesive films

GJB 6258-2008 J-系列高温固化载体结构胶膜规范

本规范规定了J-系列高温固化载体结构胶膜（简称胶膜）的要求、质量保证、交货准备和说明事项等。 本规范适用于以环氧树脂为主要成分、尼龙纱网为载体的胶膜

Specification for J-series carrier structural adhesive films curing at high temperature

FORD ESB-M2G239-A-2002 半结构用乙烯树脂基低温和高温固化型胶粘剂***与标准FORD WSS-M99P1111-A一起使用***

ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD ESB-M2G347-A-1990 结构用两组分室温固化或感应固化环氧树脂混合型胶粘剂

ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL

GJB 8735-2015 J-系列高温固化载体结构胶膜规范

J-Series High Temperature Curing Carrier Structural Adhesive Film Specification

FORD ESB-M2G239-A-2014 胶粘剂，基于乙烯基 低温和高温固化，半结构 ***与福特 WSS-M99P1111-A 一起使用***

ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL ***TO BE USED WITH FORD WSS-M99P1111-A***

T/SHDSGY 051-2023 低温固化单组分导电胶

本标准规定了低温固化单组分低应力绝缘胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本标准适用于低温固化单组分低应力绝缘胶

Low temperature curing single component conductive adhesive

NAVY MIL-S-85420 (1)-2000 飞机结构低温固化聚硫快速抢修密封化合物

This amendment forms a part of MIL-S-85420(AS), dated 14 October 1980, and is approved for use by the Naval Air Systems Command, Department

SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES

NAVY MIL-S-85420-1980 飞机结构低温固化聚硫快速抢修密封化合物

This specification establishes requirements for two 'types and classes of a two component, low temperature curing, polysulfide, sealing compound

SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES

T/SHDSGY 052-2023 低温固化单组分低应力绝缘胶

本文件规定了低温固化单组分导电胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本文件适用于低温固化单组分导电胶

Low temperature curing single component low stress insulating adhesive

SAE AMS-S-85420A-2011 飞机结构用密封剂 快速修复 低温固化多硫化物

This specification establishes requirements for two types and classes of a two component@ low temperature curing@ polysulfide@ sealing compound

Sealing Compounds@ Quick Repair@ Low Temperature Curing Polysulfide@ for Aircraft Structures

GM 9985524-1989 低温固化芯片耐塑胶涂层

Freigabemuster, für die diese Vorschrift zutrifft, müssen nach dieser Vorschrift geprüft werden und von der Produktentwicklung und Konstruktion

Coating, Chip Resistant Plastisol, Low Temperature Cure

SAE AMS3731/5A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低放热

This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm

SAE AMS3731/7-1981 灌封胶，环氧双酚 A 型填充，室温固化，低收缩

This specification covers an filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage

SAE AMS3731/7A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低收缩

This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage

GJB 10318-2021 中温固化结构胶膜规范

Specification for medium temperature curing structural adhesive films

GJB 6258-2008 J-系列高温固化载体结构胶膜规范

本规范规定了J-系列高温固化载体结构胶膜（简称胶膜）的要求、质量保证、交货准备和说明事项等。 本规范适用于以环氧树脂为主要成分、尼龙纱网为载体的胶膜

Specification for J-series carrier structural adhesive films curing at high temperature

FORD ESB-M2G239-A-2002 半结构用乙烯树脂基低温和高温固化型胶粘剂***与标准FORD WSS-M99P1111-A一起使用***

ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD ESB-M2G347-A-1990 结构用两组分室温固化或感应固化环氧树脂混合型胶粘剂

ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL

GJB 8735-2015 J-系列高温固化载体结构胶膜规范

J-Series High Temperature Curing Carrier Structural Adhesive Film Specification

FORD ESB-M2G239-A-2014 胶粘剂，基于乙烯基 低温和高温固化，半结构 ***与福特 WSS-M99P1111-A 一起使用***

ADHESIVE, VINYL BASED - LOW AND HIGH TEMPERATURE CURE, SEMI-STRUCTURAL ***TO BE USED WITH FORD WSS-M99P1111-A***

T/SHDSGY 051-2023 低温固化单组分导电胶

本标准规定了低温固化单组分低应力绝缘胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本标准适用于低温固化单组分低应力绝缘胶

Low temperature curing single component conductive adhesive

NAVY MIL-S-85420 (1)-2000 飞机结构低温固化聚硫快速抢修密封化合物

This amendment forms a part of MIL-S-85420(AS), dated 14 October 1980, and is approved for use by the Naval Air Systems Command, Department

SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES

NAVY MIL-S-85420-1980 飞机结构低温固化聚硫快速抢修密封化合物

This specification establishes requirements for two 'types and classes of a two component, low temperature curing, polysulfide, sealing compound

SEALING COMPOUNDS, QUICK REPAIR, LOW TEMPERATURE CURING POLYSULFIDE, FOR AIRCRAFT STRUCTURES

T/SHDSGY 052-2023 低温固化单组分低应力绝缘胶

本文件规定了低温固化单组分导电胶的术语和定义、要求、试验方法、检验规则及标志、标签、使用说明书、包装、运输和贮存。 本文件适用于低温固化单组分导电胶

Low temperature curing single component low stress insulating adhesive

SAE AMS-S-85420A-2011 飞机结构用密封剂 快速修复 低温固化多硫化物

This specification establishes requirements for two types and classes of a two component@ low temperature curing@ polysulfide@ sealing compound

Sealing Compounds@ Quick Repair@ Low Temperature Curing Polysulfide@ for Aircraft Structures

GM 9985524-1989 低温固化芯片耐塑胶涂层

Freigabemuster, für die diese Vorschrift zutrifft, müssen nach dieser Vorschrift geprüft werden und von der Produktentwicklung und Konstruktion

Coating, Chip Resistant Plastisol, Low Temperature Cure

SAE AMS3731/5A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低放热

This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm

SAE AMS3731/7-1981 灌封胶，环氧双酚 A 型填充，室温固化，低收缩

This specification covers an filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage

SAE AMS3731/7A-2011 灌封胶，环氧双酚 A 型填充，室温固化，低收缩

This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system

POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage