T/CSTM 00919-2023 热界面材料接触热阻 光热辐射法
本文件规定了热界面材料接触热阻测试方法为光热辐射法的原理，材料和试样，仪器设备，试验条件，试验步骤，试验数据处理，仪器较准，试验报告的内容。 本文件适用于导热硅脂、导热凝胶以及导热垫片类热界面材料与其贴合表面材料之间的接触热阻测量，其他类型的热界面材料可以参考本文件使用
Thermal contact resistance of thermal interface materials - Photothermal radiation technique
T/ZAS 2007-2022 有机硅基导热界面材料通用技术规范
本文件规定了有机硅基导热界面材料（以下简称“导热界面材料”）的分类、技术要求、试验方法、标志、包装、运输与贮存。 本文件适用于以有机硅为主体成分的导热界面材料。 本文件不适用于航空航天领域的导热界面材料
General technical requirements for silicone-based thermal interface materials
LST EN 14233-2003 与食品接触的材料和制品 塑料 微波和常规烤箱加热过程中塑料/食品界面塑料材料和制品温度的测定，以便选择合适的温度
Materials and articles in contact with foodstuffs - Plastics - Determination of temperature of plastics materials and articles at the plastics/food interface during microwave and conventional oven heating in order to select the appropriate temperature for
UNE-EN 14233:2003 与食品接触的材料和制品 塑料 微波和常规烤箱加热过程中塑料/食品界面塑料材料和制品温度的测定，以便选择合适的温度
Materials and articles in contact with foodstuffs - Plastics - Determination of temperature of plastics materials and articles at the plastics/food interface during microwave and conventional oven heating in order to select the appropriate temperature for
DS/EN 14233:2003 与食品接触的材料和制品 塑料 塑料/食品界面处的温度 微波和传统烤箱加热过程中塑料和塑料/食品界面处的材料和制品温度的测定 i
This standard specifies methods to measure the temperature reached by plastics materials and articles in contact with foodstuffs during microwave
Materials and articles in contact with foodstuffs - Plastics - Temperature at the plastics/food interface - Determination of temperature of plastics and materials and articles at the plastics/food interface during microwave and conventional oven heating i
NF ISO 17095:2013 技术陶瓷 陶瓷材料高温界面强度的试验方法
Céramiques techniques - Méthode d'essai pour la résistance de l'interface des matériaux céramiques à des températures élevées
NF S54-205:2008 游乐场铺面吸震材料.临界跌落高度的测定
Impact attenuating playground surfacing - Determination of critical fall height.
ISO 13124:2011 精细陶瓷(高级陶瓷,高级工业陶瓷).陶瓷材料界面粘结试验方法
This International Standard specifies a test method for determining the interfacial tensile and shear bond strength of ceramic-ceramic, ceramic-metal
Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for interfacial bond strength of ceramic materials
BS ISO 13124:2011 精细陶瓷(高级陶瓷,高级工业陶瓷).陶瓷材料界面粘合强度试验方法
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for interfacial bond strength of ceramic materials
BS IEC 62047-31:2019 半导体器件 微机电器件 层状MEMS材料界面粘附能的四点弯曲测试方法
What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part
Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
ASTM D7499/D7499M-09(2023 测量土工合成材料弹性界面剪切刚度的标准试验方法
1.1 This test method details how cyclic loading is applied to geosynthetics embedded in soil to determine the apparent stiffness of the soil
Standard Test Method for Measuring Geosynthetic-Soil Resilient Interface Shear Stiffness
NF EN ISO 18830:2017 塑料 浸没在海水/沙质沉积物界面的塑料材料需氧生物降解的测定 在封闭呼吸计中测量需氧量的方法
Plastiques - Détermination de la biodégradation aérobie des matières plastiques immergées à l'interface eau de mer/sédiments sableux - Méthode par mesurage de la demande en oxygène dans un respiromètre fermé
ISO 17095:2013 精细陶瓷(高级陶瓷,高级工艺陶瓷).高温条件下陶瓷材料界面粘结强度试验方法
This International Standard specifies the method of test for determining the interfacial tensile and shear bond strength of ceramic-ceramic
Fine ceramics (advanced ceramics, advanced technical ceramics).Test method for interfacial bond strength of ceramic materials at elevated temperatures
BS ISO 17095:2013 精细陶瓷(高级陶瓷,高级工艺陶瓷).高温条件下陶瓷材料界面粘结强度试验方法
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for interfacial bond strength of ceramic materials at elevated temperatures
IEC 62047-31:2019 半导体器件微机电器件第31部分:层状MEMS材料界面结合能的四点弯曲试验方法
This part of IEC 62047 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
T/CSTM 00919-2023 热界面材料接触热阻 光热辐射法
本文件规定了热界面材料接触热阻测试方法为光热辐射法的原理，材料和试样，仪器设备，试验条件，试验步骤，试验数据处理，仪器较准，试验报告的内容。 本文件适用于导热硅脂、导热凝胶以及导热垫片类热界面材料与其贴合表面材料之间的接触热阻测量，其他类型的热界面材料可以参考本文件使用
Thermal contact resistance of thermal interface materials - Photothermal radiation technique
T/ZAS 2007-2022 有机硅基导热界面材料通用技术规范
本文件规定了有机硅基导热界面材料（以下简称“导热界面材料”）的分类、技术要求、试验方法、标志、包装、运输与贮存。 本文件适用于以有机硅为主体成分的导热界面材料。 本文件不适用于航空航天领域的导热界面材料
General technical requirements for silicone-based thermal interface materials
LST EN 14233-2003 与食品接触的材料和制品 塑料 微波和常规烤箱加热过程中塑料/食品界面塑料材料和制品温度的测定，以便选择合适的温度
Materials and articles in contact with foodstuffs - Plastics - Determination of temperature of plastics materials and articles at the plastics/food interface during microwave and conventional oven heating in order to select the appropriate temperature for
UNE-EN 14233:2003 与食品接触的材料和制品 塑料 微波和常规烤箱加热过程中塑料/食品界面塑料材料和制品温度的测定，以便选择合适的温度
Materials and articles in contact with foodstuffs - Plastics - Determination of temperature of plastics materials and articles at the plastics/food interface during microwave and conventional oven heating in order to select the appropriate temperature for
DS/EN 14233:2003 与食品接触的材料和制品 塑料 塑料/食品界面处的温度 微波和传统烤箱加热过程中塑料和塑料/食品界面处的材料和制品温度的测定 i
This standard specifies methods to measure the temperature reached by plastics materials and articles in contact with foodstuffs during microwave
Materials and articles in contact with foodstuffs - Plastics - Temperature at the plastics/food interface - Determination of temperature of plastics and materials and articles at the plastics/food interface during microwave and conventional oven heating i
NF ISO 17095:2013 技术陶瓷 陶瓷材料高温界面强度的试验方法
Céramiques techniques - Méthode d'essai pour la résistance de l'interface des matériaux céramiques à des températures élevées
NF S54-205:2008 游乐场铺面吸震材料.临界跌落高度的测定
Impact attenuating playground surfacing - Determination of critical fall height.
ISO 13124:2011 精细陶瓷(高级陶瓷,高级工业陶瓷).陶瓷材料界面粘结试验方法
This International Standard specifies a test method for determining the interfacial tensile and shear bond strength of ceramic-ceramic, ceramic-metal
Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for interfacial bond strength of ceramic materials
BS ISO 13124:2011 精细陶瓷(高级陶瓷,高级工业陶瓷).陶瓷材料界面粘合强度试验方法
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for interfacial bond strength of ceramic materials
BS IEC 62047-31:2019 半导体器件 微机电器件 层状MEMS材料界面粘附能的四点弯曲测试方法
What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part
Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
ASTM D7499/D7499M-09(2023 测量土工合成材料弹性界面剪切刚度的标准试验方法
1.1 This test method details how cyclic loading is applied to geosynthetics embedded in soil to determine the apparent stiffness of the soil
Standard Test Method for Measuring Geosynthetic-Soil Resilient Interface Shear Stiffness
NF EN ISO 18830:2017 塑料 浸没在海水/沙质沉积物界面的塑料材料需氧生物降解的测定 在封闭呼吸计中测量需氧量的方法
Plastiques - Détermination de la biodégradation aérobie des matières plastiques immergées à l'interface eau de mer/sédiments sableux - Méthode par mesurage de la demande en oxygène dans un respiromètre fermé
ISO 17095:2013 精细陶瓷(高级陶瓷,高级工艺陶瓷).高温条件下陶瓷材料界面粘结强度试验方法
This International Standard specifies the method of test for determining the interfacial tensile and shear bond strength of ceramic-ceramic
Fine ceramics (advanced ceramics, advanced technical ceramics).Test method for interfacial bond strength of ceramic materials at elevated temperatures
BS ISO 17095:2013 精细陶瓷(高级陶瓷,高级工艺陶瓷).高温条件下陶瓷材料界面粘结强度试验方法
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for interfacial bond strength of ceramic materials at elevated temperatures
IEC 62047-31:2019 半导体器件微机电器件第31部分:层状MEMS材料界面结合能的四点弯曲试验方法
This part of IEC 62047 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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