塑封微电子器件检测

BS EN 60749-35:2006 半导体器件.机械和气候试验方法.塑封电子器件的声学显微方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components

EN 60749-35:2006 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的声学显微检测方法

Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components

DIN EN 60749-35:2007 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的声学显微检测方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006

IEC 60749-35:2006 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的超声显微检测方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IPC TM-650 2.6.22-1995 塑封电子元器件用的声学显微镜

Whether a printed circuit is to be a prototype, or a high-volume

Acoustic Microscopy for Plastic Encapsulated Electronic Components

GB/T 13947-1992 电子元器件塑料封装设备通用技术条件

本标准规定了电子元器件塑料封装设备（以下简称塑封设备）的术语、产品分类、技术要求、试验方法、检验规则及标志、包装、运输、贮存等。 本标准适用于塑料封装集成电路、半导体分立器件、电阻、电容等电子元器件的四柱立式塑料封装设备

General specification for electronic components plastic packaging equipments

ASTM F542-07 电子元件和微电子元件封装用电器外封胶的放热温度用标准试验方法

Heat generated by a reacting liquid encapsulating compound has the potential to cause damage to heat-sensitive electronic components

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

SJ/T 11705-2018 微电子器件封装的地和电源阻抗测试方法

Ground and power supply impedance test methods for microelectronic device packages

SJ/T 11703-2018 数字微电子器件封装的串扰特性测试方法

Test method for crosstalk characteristics of digital microelectronic device packaging

SJ/T 10256-1991 电子器件封装用ＢＨＣ－１～３型改性环氧模塑料

本标准规定了电子器件用改性环氧模塑料的技术要求，试验方法和检验规则。 本标准适用于制造各种半导体二极管。大、中、小功率晶体管及各类集成电路等封装用的环氧模塑料

BHC-1-3 type epoxy-improved molding plastics for electronic device

DS/EN 60749-35:2007 半导体器件 机械和气候试验方法 第35部分：塑料封装电子元件的声学显微镜

This part of 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

NF EN 60749-35:2006 半导体器件 - 气候和机械测试方法 - 第 35 部分：塑料封装电子元件的声学显微镜

Dispositifs à semiconducteurs - Méthodes d'essai climatiques et mécaniques - Partie 35 : microscopie acoustique pour composants électroniques à boîtier plastique

UNE-EN 60749-35:2006 半导体器件 机械和气候测试方法 第35部分：塑料封装电子元件的声学显微镜

Semiconductor devices - Mechanical and climatic test methods -- Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006) (Endorsed by AENOR in January of 2007.)

DIN EN 60749-35:2007-03 半导体器件-机械和气候测试方法-第35部分：塑料封装电子元件的声学显微镜

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006

ASTM F542-98 电子元件及微电子元件封装用密封化合物发热温度的试验方法

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

BS EN 60749-35:2006 半导体器件.机械和气候试验方法.塑封电子器件的声学显微方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components

EN 60749-35:2006 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的声学显微检测方法

Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components

DIN EN 60749-35:2007 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的声学显微检测方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006

IEC 60749-35:2006 半导体器件.机械和气候试验方法.第35部分:塑封电子器件的超声显微检测方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IPC TM-650 2.6.22-1995 塑封电子元器件用的声学显微镜

Whether a printed circuit is to be a prototype, or a high-volume

Acoustic Microscopy for Plastic Encapsulated Electronic Components

GB/T 13947-1992 电子元器件塑料封装设备通用技术条件

本标准规定了电子元器件塑料封装设备（以下简称塑封设备）的术语、产品分类、技术要求、试验方法、检验规则及标志、包装、运输、贮存等。 本标准适用于塑料封装集成电路、半导体分立器件、电阻、电容等电子元器件的四柱立式塑料封装设备

General specification for electronic components plastic packaging equipments

ASTM F542-07 电子元件和微电子元件封装用电器外封胶的放热温度用标准试验方法

Heat generated by a reacting liquid encapsulating compound has the potential to cause damage to heat-sensitive electronic components

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

SJ/T 11705-2018 微电子器件封装的地和电源阻抗测试方法

Ground and power supply impedance test methods for microelectronic device packages

SJ/T 11703-2018 数字微电子器件封装的串扰特性测试方法

Test method for crosstalk characteristics of digital microelectronic device packaging

SJ/T 10256-1991 电子器件封装用ＢＨＣ－１～３型改性环氧模塑料

本标准规定了电子器件用改性环氧模塑料的技术要求，试验方法和检验规则。 本标准适用于制造各种半导体二极管。大、中、小功率晶体管及各类集成电路等封装用的环氧模塑料

BHC-1-3 type epoxy-improved molding plastics for electronic device

DS/EN 60749-35:2007 半导体器件 机械和气候试验方法 第35部分：塑料封装电子元件的声学显微镜

This part of 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

NF EN 60749-35:2006 半导体器件 - 气候和机械测试方法 - 第 35 部分：塑料封装电子元件的声学显微镜

Dispositifs à semiconducteurs - Méthodes d'essai climatiques et mécaniques - Partie 35 : microscopie acoustique pour composants électroniques à boîtier plastique

UNE-EN 60749-35:2006 半导体器件 机械和气候测试方法 第35部分：塑料封装电子元件的声学显微镜

Semiconductor devices - Mechanical and climatic test methods -- Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006) (Endorsed by AENOR in January of 2007.)

DIN EN 60749-35:2007-03 半导体器件-机械和气候测试方法-第35部分：塑料封装电子元件的声学显微镜

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006

ASTM F542-98 电子元件及微电子元件封装用密封化合物发热温度的试验方法

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation