BS EN 61189-2:2006 印制电路板及其互连结构和组件电气材料的试验方法.互连结构材料的试验方法
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures
IPC PE-740A SECTION 18-1997 印制电路板组件清洗
IPC Standards and Publications are designed to serve the public interest through
Cleaning of Printed Board Assemblies
DLA QPL-55302-105-2006 印刷电路板组件及配件连接器
This list has been prepared for use by or for the Government in the acquisition of products covered by MIL-DTL-55302. Listing of a product
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
IPC CM-770E-2004 印制电路板组件安装准则
This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria
Guidelines for Printed Board Component Mounting
DLA MIL-DTL-55302 F-2003 连接器的印刷电路板组件及配件
DIMENSIONS ARE IN INCHES
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
SJ 20896-2003 印制电路板组件装焊后的洁净度检测及分级
Purity examination and discrimination of the welded PCA assembles
QJ 16-1980 印制板及印制板组装件设计文件编制规则
Rules for preparation of design documents for printed boards and printed board assemblies
QJ/Z 159.2-1985 印制电路板组装件灌封工艺细则
Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies
IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针
Whether a printed circuit is to be a prototype, or a high-volume
IPC-CM770,Guidelines for Printed Board Component Mounting
SJ 20748-1999 刚性印制板及刚性印制板组装件设计标准
本标准规定了刚性印制板和刚性印制板组装件的设计要求及有关注意事项。 本标准规定了各种等级印制板及其组装件的设计要求和设计指南，它既可用于商业用途也可用于军事用途。其中用于军用电子设备中的印制板和印制板组装件的独特设计要求应特别注明。除非合同另有规定，按本标准设计的军用印制板只能由经过鉴定
Design standard for rigid printed boards And rigid printed board assemblies
GB/T 43059-2023 印制板及印制板组装件的平整度控制要求
Flatness control requirements for printed boards and printed board assemblies
KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况
이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여
Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies
IEC TR 61191-8:2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
BS EN 61189-2:2006 印制电路板及其互连结构和组件电气材料的试验方法.互连结构材料的试验方法
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures
IPC PE-740A SECTION 18-1997 印制电路板组件清洗
IPC Standards and Publications are designed to serve the public interest through
Cleaning of Printed Board Assemblies
DLA QPL-55302-105-2006 印刷电路板组件及配件连接器
This list has been prepared for use by or for the Government in the acquisition of products covered by MIL-DTL-55302. Listing of a product
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
IPC CM-770E-2004 印制电路板组件安装准则
This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria
Guidelines for Printed Board Component Mounting
DLA MIL-DTL-55302 F-2003 连接器的印刷电路板组件及配件
DIMENSIONS ARE IN INCHES
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
SJ 20896-2003 印制电路板组件装焊后的洁净度检测及分级
Purity examination and discrimination of the welded PCA assembles
QJ 16-1980 印制板及印制板组装件设计文件编制规则
Rules for preparation of design documents for printed boards and printed board assemblies
QJ/Z 159.2-1985 印制电路板组装件灌封工艺细则
Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies
IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针
Whether a printed circuit is to be a prototype, or a high-volume
IPC-CM770,Guidelines for Printed Board Component Mounting
SJ 20748-1999 刚性印制板及刚性印制板组装件设计标准
本标准规定了刚性印制板和刚性印制板组装件的设计要求及有关注意事项。 本标准规定了各种等级印制板及其组装件的设计要求和设计指南，它既可用于商业用途也可用于军事用途。其中用于军用电子设备中的印制板和印制板组装件的独特设计要求应特别注明。除非合同另有规定，按本标准设计的军用印制板只能由经过鉴定
Design standard for rigid printed boards And rigid printed board assemblies
GB/T 43059-2023 印制板及印制板组装件的平整度控制要求
Flatness control requirements for printed boards and printed board assemblies
KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况
이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여
Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies
IEC TR 61191-8:2021 印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
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