电子器件用银铜钎焊料检测

SJ/T 11020-1996 电子器件用银铜钎焊料的分析方法 碘量法测定铜

Methods of analysis for silver-copper brazing for electronic components - Determination of copper (iodimetric method)

SJ/T 11027-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定镁

Methods of analysis for silver brazing for electronic components - Determination of magnesium (spectrophotometric-atomic absorption method)

SJ/T 11025-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铅

Methods of analysis for silver brazing for electronic components - Determination of lead (spectrophotometric-atomic absorption method)

SJ/T 11023-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋

Methods of analysis for silver brazing for electronic components - Determination of bismuth (spectrophotometric-atomic absorption method)

SJ/T 11024-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定锑

Methods of analysis for silver brazing for electronic components - Determination of antimony (spectrophotometric-atomic absorption method)

SJ/T 11026-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铁、镉、锌

Methods of analysis for pure silver brazing for electronic components - Determination of iron, cadmium and zinc (spectrophotometric-atomic absorption method)

SJ/T 11021-1996 电子器件用银铜钎焊料的分析方法 铅、铋、锌、镉、铁、镁、铝、锡及锑的化学光谱测定

Methods of analysis for silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb with spectrochemical method

SJ/T 11022-1996 电子器件用银铜钎焊料的分析方法 邻基二酚紫-溴化十六烷基吡啶分光光度法测定锡

Methods of analysis for silver-copper brazing for electronic components - Determination of tin (spectrophotometric C21H38BrN absorption method)

SJ/T 10753-1996 电子器件用金、银及其合金钎焊料

Gold, silver and their alloy brazing for electronic devices

SJ/T 11018-1996 电子器件用纯银钎焊料的分析方法 燃烧碘量法测定硫

Methods of analysis for pure silver brazing for electronic components - Determination of sulfur (iodimetric combustion method)

SAE AMS2667G-2013 小型加压配件用铜焊银钎料

This specification covers the engineering requirements for producing brazed joints in parts fabricated from austenitic corrosion and heat resistant

Brazing, Silver For Small Pressurized Fittings

SJ/T 11028-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定铜

Methods of analysis for gold-copper brazing for electronic components - Determination of copper (Volumetric-EDTA method)

SJ/T 11013-1996 电子器件用纯银钎焊料的分析方法 原子吸收分光光度法测定镉

Methods of analysis for pure silver brazing for electronic components - Determination of cadmium (spectrophotometric-atomic absorption method)

SJ/T 11029-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定镍

Methods of analysis for gold-copper brazing for electronic components - Determination of nickel (Volumetric-EDTA method)

SJ/T 10753-2015 电子器件用金、银及其合金焊料

本标准规定了电子器件用金、银及其合金钎料的要求、质量保证、试验方法和检验规则等。 本标准适用于非氧化气氛中钎焊电子器件用金、银及其合金钎料

Gold, silver and their alloy brazing for electron device

SJ/T 11020-1996 电子器件用银铜钎焊料的分析方法 碘量法测定铜

Methods of analysis for silver-copper brazing for electronic components - Determination of copper (iodimetric method)

SJ/T 11027-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定镁

Methods of analysis for silver brazing for electronic components - Determination of magnesium (spectrophotometric-atomic absorption method)

SJ/T 11025-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铅

Methods of analysis for silver brazing for electronic components - Determination of lead (spectrophotometric-atomic absorption method)

SJ/T 11023-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋

Methods of analysis for silver brazing for electronic components - Determination of bismuth (spectrophotometric-atomic absorption method)

SJ/T 11024-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定锑

Methods of analysis for silver brazing for electronic components - Determination of antimony (spectrophotometric-atomic absorption method)

SJ/T 11026-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铁、镉、锌

Methods of analysis for pure silver brazing for electronic components - Determination of iron, cadmium and zinc (spectrophotometric-atomic absorption method)

SJ/T 11021-1996 电子器件用银铜钎焊料的分析方法 铅、铋、锌、镉、铁、镁、铝、锡及锑的化学光谱测定

Methods of analysis for silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb with spectrochemical method

SJ/T 11022-1996 电子器件用银铜钎焊料的分析方法 邻基二酚紫-溴化十六烷基吡啶分光光度法测定锡

Methods of analysis for silver-copper brazing for electronic components - Determination of tin (spectrophotometric C21H38BrN absorption method)

SJ/T 10753-1996 电子器件用金、银及其合金钎焊料

Gold, silver and their alloy brazing for electronic devices

SJ/T 11018-1996 电子器件用纯银钎焊料的分析方法 燃烧碘量法测定硫

Methods of analysis for pure silver brazing for electronic components - Determination of sulfur (iodimetric combustion method)

SAE AMS2667G-2013 小型加压配件用铜焊银钎料

This specification covers the engineering requirements for producing brazed joints in parts fabricated from austenitic corrosion and heat resistant

Brazing, Silver For Small Pressurized Fittings

SJ/T 11028-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定铜

Methods of analysis for gold-copper brazing for electronic components - Determination of copper (Volumetric-EDTA method)

SJ/T 11013-1996 电子器件用纯银钎焊料的分析方法 原子吸收分光光度法测定镉

Methods of analysis for pure silver brazing for electronic components - Determination of cadmium (spectrophotometric-atomic absorption method)

SJ/T 11029-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定镍

Methods of analysis for gold-copper brazing for electronic components - Determination of nickel (Volumetric-EDTA method)

SJ/T 10753-2015 电子器件用金、银及其合金焊料

本标准规定了电子器件用金、银及其合金钎料的要求、质量保证、试验方法和检验规则等。 本标准适用于非氧化气氛中钎焊电子器件用金、银及其合金钎料

Gold, silver and their alloy brazing for electron device