球栅阵列（BGA）器件检测

GJB 7677-2012 球栅阵列(BGA)试验方法

Ball Grid Array (BGA) Test Method

JEITA EDR7315B-2006 半导体包装件球栅阵列(BGA)用设计指南

This Design guide for semiconductor packages defines the general outline drawings, dimensions and tolerances for square-body packages of Plastic Ball

Design guide for semiconductor packages ball grid array(BGA)

IS-701-1996 生产球栅阵列（BGA）插座测试规范

This specification defines a qualification test sequence for production ball grid array (BGA) socket assemblies

Production Ball Grid Array (BGA) Socket Test Specification

IPC 7095D-2018 球栅阵列（BGA）的设计和装配过程实施

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology@ focusing on inspection

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

BS EN 60191-6-16:2007 半导体器件的机械标准化 球栅阵列封装(BGA),栅格阵列(LGA),栅阵列(FBGA)和距基板栅格阵列(FLGA)用老化插座和半导体测试的术语表

This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions

Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

GB/T 19247.6-2024 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法

Printed Board Assembly Part 6: Ball Grid Array (BGA) and Land Grid Array (LGA) Solder Joint Void Evaluation Requirements and Test Methods

GJB 4907-2003 球栅阵列封装器件组装通用要求

General requirements for assembly of ball grid array packaged devices

IPC J-STD-032 CD-2002 球栅阵列球性能标准

Performance Standard for Ball Grid Array Balls

BS EN 61191-6:2010 印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准

This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

IPC J-STD-032-2002 球栅阵列球的绩效标准

IPC J-STD-032-2002

Performance Standard for Ball Grid Array Balls

DLA A-A-59769 VALID NOTICE 1-2011 电阻网络、球栅阵列终结器的一般要求

Resistor Networks, Ball Grid Array Terminators General Requirements for

DLA A-A-59769 A-2013 电阻网络、球栅阵列终端器的一般要求

RESISTOR NETWORKS, BALL GRID ARRAY TERMINATORS GENERAL REQUIREMENTS FOR

OS GSO IEC 60191-6-18:2015 半导体器件机械标准化 第6-18部分：表面安装半导体器件封装外形图编制的一般规则球栅阵列（BGA）设计指南

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

T/JSSIA 0001-2017 倒装芯片球栅阵列封装（FCBGA）系列型谱

本标准规定了倒装芯片球栅阵列封装（FCBGA）的标准封装系列，以及选择和应用的导则，适用于倒装芯片球栅阵列封装（FCBGA

Series Programmes for Flip Chip Ball Grid Array Package

540B0AA-1998 用于电子设备的间距为 1.27 毫米（0.050 英寸）的生产球栅阵列（BGA）插座的详细规范

Detail Specification for Production Ball Grid Array (BGA) Sockets with 1.27 mm (0.050 in) Spacing for Use in Electronic Equipment

GJB 7677-2012 球栅阵列(BGA)试验方法

Ball Grid Array (BGA) Test Method

JEITA EDR7315B-2006 半导体包装件球栅阵列(BGA)用设计指南

This Design guide for semiconductor packages defines the general outline drawings, dimensions and tolerances for square-body packages of Plastic Ball

Design guide for semiconductor packages ball grid array(BGA)

IS-701-1996 生产球栅阵列（BGA）插座测试规范

This specification defines a qualification test sequence for production ball grid array (BGA) socket assemblies

Production Ball Grid Array (BGA) Socket Test Specification

IPC 7095D-2018 球栅阵列（BGA）的设计和装配过程实施

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology@ focusing on inspection

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

BS EN 60191-6-16:2007 半导体器件的机械标准化 球栅阵列封装(BGA),栅格阵列(LGA),栅阵列(FBGA)和距基板栅格阵列(FLGA)用老化插座和半导体测试的术语表

This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions

Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

GB/T 19247.6-2024 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法

Printed Board Assembly Part 6: Ball Grid Array (BGA) and Land Grid Array (LGA) Solder Joint Void Evaluation Requirements and Test Methods

GJB 4907-2003 球栅阵列封装器件组装通用要求

General requirements for assembly of ball grid array packaged devices

IPC J-STD-032 CD-2002 球栅阵列球性能标准

Performance Standard for Ball Grid Array Balls

BS EN 61191-6:2010 印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准

This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

IPC J-STD-032-2002 球栅阵列球的绩效标准

IPC J-STD-032-2002

Performance Standard for Ball Grid Array Balls

DLA A-A-59769 VALID NOTICE 1-2011 电阻网络、球栅阵列终结器的一般要求

Resistor Networks, Ball Grid Array Terminators General Requirements for

DLA A-A-59769 A-2013 电阻网络、球栅阵列终端器的一般要求

RESISTOR NETWORKS, BALL GRID ARRAY TERMINATORS GENERAL REQUIREMENTS FOR

OS GSO IEC 60191-6-18:2015 半导体器件机械标准化 第6-18部分：表面安装半导体器件封装外形图编制的一般规则球栅阵列（BGA）设计指南

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

T/JSSIA 0001-2017 倒装芯片球栅阵列封装（FCBGA）系列型谱

本标准规定了倒装芯片球栅阵列封装（FCBGA）的标准封装系列，以及选择和应用的导则，适用于倒装芯片球栅阵列封装（FCBGA

Series Programmes for Flip Chip Ball Grid Array Package

540B0AA-1998 用于电子设备的间距为 1.27 毫米（0.050 英寸）的生产球栅阵列（BGA）插座的详细规范

Detail Specification for Production Ball Grid Array (BGA) Sockets with 1.27 mm (0.050 in) Spacing for Use in Electronic Equipment