非密封表面贴装芯片检测

DLA A-A-59532 B-2007 表面安装非密封熔线片 常规

This commercial item description (CID) covers the general requirements for SM inclused link fuses and fuse assemblies

FUSE, INCLOSED LINK, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR

JEDEC J-STD-020C-2004 非密封固态表面贴装器件湿度／再流焊敏感度分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

KS C IEC PAS 62182-2003(2008 在进行可靠性测试之前对非密封表面贴装器件进行预处理

Preconditioning of nonhermetic surface mount devices prior to reliability testing

IPC SMC-WP-003-1993 芯片贴装技术(CMT)

The purpose of this paper is to investigate emerging chip attachment methods and define and classify the attachment methods for electronic systems

Chip Mounting Technology (CMT)

ANSI/EIA-944-2013 表面安装贴片磁珠鉴定规格

Surface Mount Chip Bead Qualification Specification

ECA SP 4984-2005 带聚合物阴极的表面贴装铝电解电容器芯片 发表为ANSI/EIA/ECA-955

This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program

Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode To be published as ANSI/EIA/ECA-955

DLA A-A-59702 A-2006 交流350瓦特 表面安装 非密封的熔断线

This commercial item description (CID) covers the general requirements for 350 volts ac surface mount inclosed link fuses. Fuses covered by this CID

FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 350 V AC

IEC PAS 62190:2000 非密封固态表面安装装置的潮湿敏感分级

Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices

ECA EIA-944-2002 表面贴装铁氧体片磁珠合格规范

This specification defines the qualification program for surface mount ferrite chip beads. The qualification program is defined in Table 1

Surface Mount Ferrite Chip Bead Qualification Specification

INTERN CEMS GT-20-2009 表面密封

Surface Sealing

GB/T 33836-2017 热能装置用平面密封垫片

Plane sealing gaskets for heat energy device

GM 9984834-1991 表面元件非导电密封底漆粉末

Only the latest approved standards are applicable unless otherwise specified

Primer, Powder, Nonconductive Porosity Sealing for SMC

NAVY MIL-C-82594 NOTICE 1-1996 非铁金属的防蚀剂和表面密封剂

This notice should be filed in front of MIL-C-82594, dated 15 September 1971

CORROSION PREVENTIVE COMPOUND AND SURFACE SEALER FOR NONFERROUS METALS

NAVY MIL-C-82594-1971 非铁金属的防蚀剂和表面密封剂

This specification covers a solvent-dispersed compound which penetrates metal poresand forms a microthin,clear,protective coating, and sealtoprevent

CORROSION PREVENTIVE COMPOUND AND SURFACE SEALER FOR NONFERROUS METALS

KS C IEC 62339-1-2014(2019 表面贴装流体分配组件的模块化部件接口 - 第1部分:弹性密封件

Modular component interfaces for surface-mount fluid distribution components — Part 1: Elastomeric seals

DLA A-A-59532 B-2007 表面安装非密封熔线片 常规

This commercial item description (CID) covers the general requirements for SM inclused link fuses and fuse assemblies

FUSE, INCLOSED LINK, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR

JEDEC J-STD-020C-2004 非密封固态表面贴装器件湿度／再流焊敏感度分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

KS C IEC PAS 62182-2003(2008 在进行可靠性测试之前对非密封表面贴装器件进行预处理

Preconditioning of nonhermetic surface mount devices prior to reliability testing

IPC SMC-WP-003-1993 芯片贴装技术(CMT)

The purpose of this paper is to investigate emerging chip attachment methods and define and classify the attachment methods for electronic systems

Chip Mounting Technology (CMT)

ANSI/EIA-944-2013 表面安装贴片磁珠鉴定规格

Surface Mount Chip Bead Qualification Specification

ECA SP 4984-2005 带聚合物阴极的表面贴装铝电解电容器芯片 发表为ANSI/EIA/ECA-955

This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program

Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode To be published as ANSI/EIA/ECA-955

DLA A-A-59702 A-2006 交流350瓦特 表面安装 非密封的熔断线

This commercial item description (CID) covers the general requirements for 350 volts ac surface mount inclosed link fuses. Fuses covered by this CID

FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 350 V AC

IEC PAS 62190:2000 非密封固态表面安装装置的潮湿敏感分级

Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices

ECA EIA-944-2002 表面贴装铁氧体片磁珠合格规范

This specification defines the qualification program for surface mount ferrite chip beads. The qualification program is defined in Table 1

Surface Mount Ferrite Chip Bead Qualification Specification

INTERN CEMS GT-20-2009 表面密封

Surface Sealing

GB/T 33836-2017 热能装置用平面密封垫片

Plane sealing gaskets for heat energy device

GM 9984834-1991 表面元件非导电密封底漆粉末

Only the latest approved standards are applicable unless otherwise specified

Primer, Powder, Nonconductive Porosity Sealing for SMC

NAVY MIL-C-82594 NOTICE 1-1996 非铁金属的防蚀剂和表面密封剂

This notice should be filed in front of MIL-C-82594, dated 15 September 1971

CORROSION PREVENTIVE COMPOUND AND SURFACE SEALER FOR NONFERROUS METALS

NAVY MIL-C-82594-1971 非铁金属的防蚀剂和表面密封剂

This specification covers a solvent-dispersed compound which penetrates metal poresand forms a microthin,clear,protective coating, and sealtoprevent

CORROSION PREVENTIVE COMPOUND AND SURFACE SEALER FOR NONFERROUS METALS

KS C IEC 62339-1-2014(2019 表面贴装流体分配组件的模块化部件接口 - 第1部分:弹性密封件

Modular component interfaces for surface-mount fluid distribution components — Part 1: Elastomeric seals