发布时间:2023-05-25 08:51:48
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本规范规定了军用半导体集成电路外壳(以下简称外壳)生产和交付的一般要求,以及外壳应满足的质量和可靠性保证要求。 本规范适用于半导体集成电路用的多层陶瓷外壳。外壳一般指底座
General specification for packages of semiconductor integrated circuits
Blank detail specification of packages for semiconductor integrated circuits
本规范规定了半导体集成电路金属菱形外壳(K型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of metal rhomb package for semiconductor integrated circuits
本规范规定了半导体集成电路陶瓷扁平外壳(F型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of ceramic flat package for semiconductor integrated circuits
本标准规定了半导体集成电路封装结到外壳热阻的测试方法。 本标准适用于半导体集成电路陶瓷、金属、塑料封装结到外壳热阻的测量
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
Detail specification of type D ceramic DIP for semiconductor integrated circuits
本规范规定了半导体集成电路陶瓷熔封扁平外壳(H型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of frit-seal ceramic flat package for semiconductor integrated circuits
Detail specification of ceramic PGA for semiconductor integrated circuits
Detail specification of Type F ceramic FP for semiconductor integrated circuits
本规范规定了半导体集成电路多层陶瓷双列直插外壳(D型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of multilayer ceramic dual in-line package for semiconductor integrated circuits
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
本规范规定了军用半导体集成电路外壳(以下简称外壳)生产和交付的一般要求,以及外壳应满足的质量和可靠性保证要求。 本规范适用于半导体集成电路用的多层陶瓷外壳。外壳一般指底座
General specification for packages of semiconductor integrated circuits
Blank detail specification of packages for semiconductor integrated circuits
本规范规定了半导体集成电路金属菱形外壳(K型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of metal rhomb package for semiconductor integrated circuits
本规范规定了半导体集成电路陶瓷扁平外壳(F型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of ceramic flat package for semiconductor integrated circuits
本标准规定了半导体集成电路封装结到外壳热阻的测试方法。 本标准适用于半导体集成电路陶瓷、金属、塑料封装结到外壳热阻的测量
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
Detail specification of type D ceramic DIP for semiconductor integrated circuits
本规范规定了半导体集成电路陶瓷熔封扁平外壳(H型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of frit-seal ceramic flat package for semiconductor integrated circuits
Detail specification of ceramic PGA for semiconductor integrated circuits
Detail specification of Type F ceramic FP for semiconductor integrated circuits
本规范规定了半导体集成电路多层陶瓷双列直插外壳(D型)质量评定的全部内容。 本规范符合GB 6649《半导体集成电路外壳总规范》的要求
Detail specification of multilayer ceramic dual in-line package for semiconductor integrated circuits
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits