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调整二极管(包含TVS)检测

发布时间:2024-05-27 17:49:26 - 更新时间:2024年06月29日 15:22

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军工检测 其他检测

IEC 60747-3-2:1986 半导体器件 分立器件 第3部分:信号(括开关)及 第2节:电压和电压基准(不括温度补偿精密基准)空白详细规范

Applicable to quality assessment for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision reference

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section Two: Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision reference d

IEC 60747-3:1985 半导体器件 分立器件 第3部分:信号(括开关)及

Deals with terminology and letter symbols, essential ratings and characteristics, measuring methods, acceptance and reliability, completing

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes.

GB/T 6589-2002 半导体器件 分立器件 第3-2部分;信号(括开关)和电压和电压基准(不括温度补偿精密基准)空白详细规范

本空白详细规范是半导体器件的一系列空白详细规范之一,并应与下列国家标准和IEC标准一起使用。 GB/T12560--1999半导体器件分立器件分规范(idt IEC 60747—11:1985) IEC 60747—10(QC 700000):1991 半导体器件第l0部分分立器件和

Semiconductor devices discrete devices Part 3-2: Signal (including switching) and regulator diodes blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)

IEC 60747-3/AMD1:1991 半导体器件 分立器件 第3部分:信号(括开关)及 修改1

Replaces the existing sub-clauses: 2.4.3 (on page 17), 1.3 and 1.4 (on page 23), 1.2 (on page 25), 1.3 (on page 27) and 4.1 (on page 51

Semiconductor devices; discrete devices; part 3: signal (including switching) and regulator diodes; amendment 1

IEC 60747-3/AMD2:1993 半导体器件 分立器件 第3部分:信号(括开关)及 修改2

Replaces clause 2 (Terms related to ratings and characteristics) and subclause 3.4.3 (Forward recovery time), amends the table in subclause 3.3

Semiconductor devices; discrete devices; part 3: signal (including switching) and regulator diodes; amendment 2

BS IEC 60747-3:2013 半导体器件.分立器件:信号、开关

Semiconductor devices. Discrete devices: Signal, switching and regulator diodes

IEC 60747-3-1:1986 半导体器件 分立器件 第3部分:信号(括开关)及 第1节:信号、开关和可控雪崩空白详细规范

Applicable to quality assessment for signal diodes, switching diodes and controlled avalanche diodes. Gives specific requirements (included in QC

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section One: Blank detail specification for signal diodes, switching diodes and controlled-avalanche diodes

IEC 60747-3:2013 半导体器件.第3部分:分立器件:信号、开关

This part of IEC 60747 gives the requirements for the following devices: ?C signal diodes (excluding diodes designed to operate at frequencies above

Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes

GB/T 16894-1997 大于100A,环境和壳额定的(括雪崩)空白详细规范

国际电工委员会电子器件质量评定体系遵循国际电工委员会的章程,在国际电工委员会授权下开展工作。评定体系的目的是以这样一种方式确定质量评定程序,即一个成员国按照符合适用范围要求所放行的电子器件在其他成员国内需再试验同样为合格。 本空白详细规范是半导体器件-系列空白详细规范的一个,应该和

Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100A

GB/T 6588-2000 半导体器件 分立器件 第3部分;信号(括开关)和 第一篇 信号、开关和可控雪崩空白详细规范

本空白详细规范是半导体器件的一系列空白详细规范之一,并应与下列国家标准一起使用。 GB/T 4589.1-1989 半导体器件 分立器件和集成电路总规范(idt IEC 747-10:1984) GB/T 12560-1999 半导体器件 分立器件分规范(idt IEC

Semiconductor devices Discrete devices Part 3: Signal(including switching) and regulator diodes Section One--Blank detail specification for signal diodes,switching diodes and controlled-avalanche diodes

GB/T 6571-1995 半导体器件 分立器件 第3部分:信号(括开关)和

本标准等同采用国际标准IEC 747-3-1985《半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管》及其第1次修订(1991

Semiconductor devices--Discrete devices. Part 3: Signal(including switching)and regulator diodes

GB/T 6351-1998 半导体器件 分立器件 第2部分; 第一篇 100A以下环境或壳额定(括雪崩)空白详细规范

本空白详细规范规定了制定环境或管壳额定整流二极管(包括雪崩整流二极管)详细规范的基本原则,制定该范围内的所有详细规范应尽可能与本空白详细规范相一致

Semiconductor devices--Discrete devices. Part 2: Rectifier diodes. Section One--Blank detail specification for rectifier diodes(including avalanche rectifier diodes), ambient and case-rated, up to 100A

TIS 1597-1999 半导体器件.分立器件.第3部分:信号(括开关)和

Semiconductor devices.discrete devices.part 3: signal (including switching) and regulator diodes

JB/T 7624-2013 测试方法

本标准规定了整流二极管(以下简称整流管)的一般测试要求,电特性测量、热特性测量、额定值检验和热循环负载试验方法。本标准适用于普通整流管、快恢复整流管、机动车用整流管、高压整流堆、雪崩整流管和可控雪崩整流管,半导体整流模块和半导体整流组件也可参照使用

Testing methods for rectifier diodes

KS C IEC 60747-3-1:2006 半导体器件.分立器件.第3部分:信号(括开关)和.第1节:信号、开关和受控雪崩空白详细规范

이 규격은 신호 다이오드, 스위칭 다이오드 및 제어 애벌란시 다이오드의 개별 규격 지침에

Semiconductor devices-Discrete devices-Part 3:Signal (including switching) and regulator diodes-Section one:Blank detail specification for signal diodes, switching diodes and controlled-avalanche diodes

IEC 60747-3-2:1986 半导体器件 分立器件 第3部分:信号(括开关)及 第2节:电压和电压基准(不括温度补偿精密基准)空白详细规范

Applicable to quality assessment for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision reference

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section Two: Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision reference d

IEC 60747-3:1985 半导体器件 分立器件 第3部分:信号(括开关)及

Deals with terminology and letter symbols, essential ratings and characteristics, measuring methods, acceptance and reliability, completing

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes.

GB/T 6589-2002 半导体器件 分立器件 第3-2部分;信号(括开关)和电压和电压基准(不括温度补偿精密基准)空白详细规范

本空白详细规范是半导体器件的一系列空白详细规范之一,并应与下列国家标准和IEC标准一起使用。 GB/T12560--1999半导体器件分立器件分规范(idt IEC 60747—11:1985) IEC 60747—10(QC 700000):1991 半导体器件第l0部分分立器件和

Semiconductor devices discrete devices Part 3-2: Signal (including switching) and regulator diodes blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)

IEC 60747-3/AMD1:1991 半导体器件 分立器件 第3部分:信号(括开关)及 修改1

Replaces the existing sub-clauses: 2.4.3 (on page 17), 1.3 and 1.4 (on page 23), 1.2 (on page 25), 1.3 (on page 27) and 4.1 (on page 51

Semiconductor devices; discrete devices; part 3: signal (including switching) and regulator diodes; amendment 1

IEC 60747-3/AMD2:1993 半导体器件 分立器件 第3部分:信号(括开关)及 修改2

Replaces clause 2 (Terms related to ratings and characteristics) and subclause 3.4.3 (Forward recovery time), amends the table in subclause 3.3

Semiconductor devices; discrete devices; part 3: signal (including switching) and regulator diodes; amendment 2

BS IEC 60747-3:2013 半导体器件.分立器件:信号、开关

Semiconductor devices. Discrete devices: Signal, switching and regulator diodes

IEC 60747-3-1:1986 半导体器件 分立器件 第3部分:信号(括开关)及 第1节:信号、开关和可控雪崩空白详细规范

Applicable to quality assessment for signal diodes, switching diodes and controlled avalanche diodes. Gives specific requirements (included in QC

Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section One: Blank detail specification for signal diodes, switching diodes and controlled-avalanche diodes

IEC 60747-3:2013 半导体器件.第3部分:分立器件:信号、开关

This part of IEC 60747 gives the requirements for the following devices: ?C signal diodes (excluding diodes designed to operate at frequencies above

Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes

GB/T 16894-1997 大于100A,环境和壳额定的(括雪崩)空白详细规范

国际电工委员会电子器件质量评定体系遵循国际电工委员会的章程,在国际电工委员会授权下开展工作。评定体系的目的是以这样一种方式确定质量评定程序,即一个成员国按照符合适用范围要求所放行的电子器件在其他成员国内需再试验同样为合格。 本空白详细规范是半导体器件-系列空白详细规范的一个,应该和

Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100A

GB/T 6588-2000 半导体器件 分立器件 第3部分;信号(括开关)和 第一篇 信号、开关和可控雪崩空白详细规范

本空白详细规范是半导体器件的一系列空白详细规范之一,并应与下列国家标准一起使用。 GB/T 4589.1-1989 半导体器件 分立器件和集成电路总规范(idt IEC 747-10:1984) GB/T 12560-1999 半导体器件 分立器件分规范(idt IEC

Semiconductor devices Discrete devices Part 3: Signal(including switching) and regulator diodes Section One--Blank detail specification for signal diodes,switching diodes and controlled-avalanche diodes

GB/T 6571-1995 半导体器件 分立器件 第3部分:信号(括开关)和

本标准等同采用国际标准IEC 747-3-1985《半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管》及其第1次修订(1991

Semiconductor devices--Discrete devices. Part 3: Signal(including switching)and regulator diodes

GB/T 6351-1998 半导体器件 分立器件 第2部分; 第一篇 100A以下环境或壳额定(括雪崩)空白详细规范

本空白详细规范规定了制定环境或管壳额定整流二极管(包括雪崩整流二极管)详细规范的基本原则,制定该范围内的所有详细规范应尽可能与本空白详细规范相一致

Semiconductor devices--Discrete devices. Part 2: Rectifier diodes. Section One--Blank detail specification for rectifier diodes(including avalanche rectifier diodes), ambient and case-rated, up to 100A

TIS 1597-1999 半导体器件.分立器件.第3部分:信号(括开关)和

Semiconductor devices.discrete devices.part 3: signal (including switching) and regulator diodes

JB/T 7624-2013 测试方法

本标准规定了整流二极管(以下简称整流管)的一般测试要求,电特性测量、热特性测量、额定值检验和热循环负载试验方法。本标准适用于普通整流管、快恢复整流管、机动车用整流管、高压整流堆、雪崩整流管和可控雪崩整流管,半导体整流模块和半导体整流组件也可参照使用

Testing methods for rectifier diodes

KS C IEC 60747-3-1:2006 半导体器件.分立器件.第3部分:信号(括开关)和.第1节:信号、开关和受控雪崩空白详细规范

이 규격은 신호 다이오드, 스위칭 다이오드 및 제어 애벌란시 다이오드의 개별 규격 지침에

Semiconductor devices-Discrete devices-Part 3:Signal (including switching) and regulator diodes-Section one:Blank detail specification for signal diodes, switching diodes and controlled-avalanche diodes

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