组装印刷电路板检测

IEC 60194-2:2017 印制板设计、制造和装配. 词汇. 第2部分:电子技术以及印刷电路板和电子组装技术的常用

This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

BS EN 61182-2-2:2012 印刷电路板组装产品. 制造描述数据和传输方法. 印刷电路板制造数据描述实施的分要求

Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description

IPC HDBK-850-2012 用于电子印刷电路板组装的灌封材料和封装工艺的设计 选择和应用指南

For the purpose of this document potting can be thought of as the ????liquid material'' and encapsulation can be interpreted as the application

Guidelines for Design@ Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

BS CECC 200025:1998 电子元器件用质量评估协调体系.过程评估一览表:印刷电路板组装设备

This PAS specifies the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant

Harmonized system of quality assessment for electronic components - Process assessment schedule: printed board assembly facilities

NF C93-791-2-2*NF EN 61182-2-2:2012 印刷电路板组装产品 制造描述数据和传输方法 第2-2部分：印刷电路板制造数据描述实施的分要求

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2 : sectional requirements for implementation of printed board fabrication data description

IPC WP/TR-584-2003 印刷电路板和组装中对于卤素材料应用的IPC白皮书和技术报告

The data reproduced in this report is published for informational purposes only. It is based on data voluntarily contributed by members of the IPC

IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies

DLA MIL-DTL-55302/154 C VALID NOTICE 1-2009 连接器、印刷电路组件和配件 印刷线路板安装硬件

Connectors, Printed Circuit Subassembly and Accessories. Mounting Hardware for Printed Wiring Boards

NF C93-722:1980 电子元件.印刷板配线.印刷电路板组件的返工

Electronic components. Printed wiring. Rework of printed boards assemblies.

DLA MIL-DTL-55302/155 B VALID NOTICE 1-2009 连接器、印刷电路组件和配件、印刷线路板罩

Connectors, Printed Circuit Subassembly and Accessories, Hood for Printed Wiring Boards

IPC 2546-2005 印刷电路板组装车间设备通信信息(CAMX)分段要求,修订2:配药设备科回流焊设备科最后的组装和包装修正案2

Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Assembly XML Schema

Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly Amendment 2: Dispensing Equipment Section Reflow Equipment Section Final Assembly and Packaging Section Amendment 2

DLA QML-31032-18 NOTICE 1-2008 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA MIL PRF 31032B SUPP 1-2010 印刷电路板/印刷线路板，通用规范

PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR

DLA QML-31032-QPD-2011 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA QML-31032-2011 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA QML-31032-QPD-2012 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

IEC 60194-2:2017 印制板设计、制造和装配. 词汇. 第2部分:电子技术以及印刷电路板和电子组装技术的常用

This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

BS EN 61182-2-2:2012 印刷电路板组装产品. 制造描述数据和传输方法. 印刷电路板制造数据描述实施的分要求

Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description

IPC HDBK-850-2012 用于电子印刷电路板组装的灌封材料和封装工艺的设计 选择和应用指南

For the purpose of this document potting can be thought of as the ????liquid material'' and encapsulation can be interpreted as the application

Guidelines for Design@ Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

BS CECC 200025:1998 电子元器件用质量评估协调体系.过程评估一览表:印刷电路板组装设备

This PAS specifies the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant

Harmonized system of quality assessment for electronic components - Process assessment schedule: printed board assembly facilities

NF C93-791-2-2*NF EN 61182-2-2:2012 印刷电路板组装产品 制造描述数据和传输方法 第2-2部分：印刷电路板制造数据描述实施的分要求

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2 : sectional requirements for implementation of printed board fabrication data description

IPC WP/TR-584-2003 印刷电路板和组装中对于卤素材料应用的IPC白皮书和技术报告

The data reproduced in this report is published for informational purposes only. It is based on data voluntarily contributed by members of the IPC

IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies

DLA MIL-DTL-55302/154 C VALID NOTICE 1-2009 连接器、印刷电路组件和配件 印刷线路板安装硬件

Connectors, Printed Circuit Subassembly and Accessories. Mounting Hardware for Printed Wiring Boards

NF C93-722:1980 电子元件.印刷板配线.印刷电路板组件的返工

Electronic components. Printed wiring. Rework of printed boards assemblies.

DLA MIL-DTL-55302/155 B VALID NOTICE 1-2009 连接器、印刷电路组件和配件、印刷线路板罩

Connectors, Printed Circuit Subassembly and Accessories, Hood for Printed Wiring Boards

IPC 2546-2005 印刷电路板组装车间设备通信信息(CAMX)分段要求,修订2:配药设备科回流焊设备科最后的组装和包装修正案2

Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Assembly XML Schema

Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly Amendment 2: Dispensing Equipment Section Reflow Equipment Section Final Assembly and Packaging Section Amendment 2

DLA QML-31032-18 NOTICE 1-2008 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA MIL PRF 31032B SUPP 1-2010 印刷电路板/印刷线路板，通用规范

PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR

DLA QML-31032-QPD-2011 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA QML-31032-2011 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for

DLA QML-31032-QPD-2012 印刷电路板/印刷线路板，通用规范

Printed Circuit Board/Printed Wiring Board, General Specification for