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本标准规定了半导体集成电路封装在生产制造、工程应用和产品交验等方面使用的基本术语。 本标准适用于与半导体集成电路封装相关的生产、科研、教学和贸易等方面的应用
Terminology of packages for semiconductor integrated circuits
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
Gives the requirements for certain categories or subcategories of interface integrated circuits. To be read in conjunction with BS 6493-1.1:1984, BS
Semiconductor devices. Integrated circuits. Interface integrated circuits
This part of IEC 60748 is applicable for the following categories or subcategories of devices: - combinatorial and sequential digital circuits
Semiconductor devices - Integrated circuits - Digital integrated circuits
Semiconductor devices. Integrated circuits. Digital integrated circuits
本文件规定了半导体集成电路塑料小外形封装冲制型引线框架的术语与定义、技术要求、试验方法、检验规则、标志、包装、运输与贮存
Punched lead frame for plastic small outline packaging of semiconductor integrated circuits
本规范规定了半导体集成电路塑料双列封装冲制型引线框架（以下简称引线框架）的技术要求及检验规则。 本规范适用于双列（DIP）冲制型引线框架，单列冲制型引线框架亦可参照使用
Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP
本标准规定了半导体集成电路塑料有引线片式载体(PLCC)封装引线框架(以下简称引线框架)的技术要求及检验规则。本标准适用于半导体集成电路塑料有引线片式载体(PLCC)封装引线框架的研制、生产和采购
Semiconductor integrated circuits.Specification of leadframes for plastic leaded chip carrier package
本标准规了下列集成电路（IC）分类体系树（见图1）中有关半定制集成电路子类的标准
Semiconductor devices. Integrated circuits. Part 5: Semicustom integrated circuits
Semiconductor devices — Integrated circuits
本标准规定了半导体集成电路塑料四面引线扁平封装引线框架(以下简称引线框架)的技术要求及检验规则。 本标准适用于半导体集成电路塑料四面引线扁平封装冲制型引线框架。塑料四面引线扁平封装刻蚀引线框架也可参照使用
Semiconductor integrated circuits.Specification of leadframes for plastic quad flat package
本标准规定了半导体集成电路塑料双列封装冲制型引线框架(以下简称引线框架)的技术要求及检验规则。 本标准适用于双列(DIP)冲制型引线框架。单列冲制型引线框架亦可参照使用
Semiconductor integrated circuits.Specification for stamped leadframes of plastic DIP
本分规范适用于已封装的半导体集成电路，包括多片集成电路，但不包括混合电路
Semiconductor devices. Integrated circuits. Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
本标准规定了半导体集成电路封装在生产制造、工程应用和产品交验等方面使用的基本术语。 本标准适用于与半导体集成电路封装相关的生产、科研、教学和贸易等方面的应用
Terminology of packages for semiconductor integrated circuits
Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, test and measurement procedures for encapsulated
Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
Gives the requirements for certain categories or subcategories of interface integrated circuits. To be read in conjunction with BS 6493-1.1:1984, BS
Semiconductor devices. Integrated circuits. Interface integrated circuits
This part of IEC 60748 is applicable for the following categories or subcategories of devices: - combinatorial and sequential digital circuits
Semiconductor devices - Integrated circuits - Digital integrated circuits
Semiconductor devices. Integrated circuits. Digital integrated circuits
本文件规定了半导体集成电路塑料小外形封装冲制型引线框架的术语与定义、技术要求、试验方法、检验规则、标志、包装、运输与贮存
Punched lead frame for plastic small outline packaging of semiconductor integrated circuits
本规范规定了半导体集成电路塑料双列封装冲制型引线框架（以下简称引线框架）的技术要求及检验规则。 本规范适用于双列（DIP）冲制型引线框架，单列冲制型引线框架亦可参照使用
Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP
本标准规定了半导体集成电路塑料有引线片式载体(PLCC)封装引线框架(以下简称引线框架)的技术要求及检验规则。本标准适用于半导体集成电路塑料有引线片式载体(PLCC)封装引线框架的研制、生产和采购
Semiconductor integrated circuits.Specification of leadframes for plastic leaded chip carrier package
本标准规了下列集成电路（IC）分类体系树（见图1）中有关半定制集成电路子类的标准
Semiconductor devices. Integrated circuits. Part 5: Semicustom integrated circuits
Semiconductor devices — Integrated circuits
本标准规定了半导体集成电路塑料四面引线扁平封装引线框架(以下简称引线框架)的技术要求及检验规则。 本标准适用于半导体集成电路塑料四面引线扁平封装冲制型引线框架。塑料四面引线扁平封装刻蚀引线框架也可参照使用
Semiconductor integrated circuits.Specification of leadframes for plastic quad flat package
本标准规定了半导体集成电路塑料双列封装冲制型引线框架(以下简称引线框架)的技术要求及检验规则。 本标准适用于双列(DIP)冲制型引线框架。单列冲制型引线框架亦可参照使用
Semiconductor integrated circuits.Specification for stamped leadframes of plastic DIP
本分规范适用于已封装的半导体集成电路，包括多片集成电路，但不包括混合电路
Semiconductor devices. Integrated circuits. Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
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