GB/T 18334-2001 有贯穿连接的挠性多层印制板规范
本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的挠性多层印制板规范，与其制造方法关，目的是作为供需求双方签定协议的基础。 本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆
Specification for flexible multilayer printed boards with through conections
TCVN 6611-9-2000 印制板.第9部分:有贯穿连接的挠性多层印制板规范
Printed boards.Part 9.Specification for flexible multilayer printed boards with through connections
TIS 2075-2001 印制板.第9部分:有贯穿连接的挠性多层印制板规范
Printed boards.part 9: specification for fiexible multilayer printed boards with through connections
IEC 60326-9:1991 印制电路板 第9部分:有贯穿连接的挠性多层印制板规范
Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions
Printed boards; part 9: specification for flexible multilayer printed boards with through connections
KS C IEC 60326-9:2003 印制电路板.第9部分:有贯穿连接的挠性多层印制板规范
이 규격은 제조 방법에 관계 없이, 관통 접속하는 연성 다층 인쇄 회로기판에 적용 가능
Printed boards-Part 9:Specification for flexible multilayer printedboards with through connections
DS/IEC 326-11:1992 印制电路板．第11部分：有贯穿连接的挠性多层印制板规范
Printed boards. Part 11: Specification for flex rigid multilayer printed boards with through connections
KS C IEC 60326-9:2013 印制电路板 第9部分：有贯穿连接的挠性多层印制板规范
Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections
GB/T 18335-2001 有贯穿连接的刚挠多层印制板规范
本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的刚挠多层印制板，与其制造方法关，目的是作为供需双方签定协议的基础。本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆
Specification for flex-rigid multilayer printed boards with through connections
TCVN 6611-11-2000 印制板.第11部分:有贯穿连接的刚挠多层印制板规范
Printed boards.Part 11.Specification for flexrigid multilayer printed boards with through connections
TIS 2104-2001 印制板.第11部分:有贯穿连接的刚挠多层印制板规范
Printed boards.part 11: specification for flex-rigid multilayer printed boards with through connections
BS 6221-9:1991 印制电路板.第9部分:贯穿连接的挠性多层板规范
Relates to boards irrespective of their method of manufacture. It is intended as a basis on which agreements between purchaser and vendor can be made.
Printed wiring boards - Specification for flexible multilayer boards with through connections
IEC 60326-11:1991 印制电路板 第11部分:有贯穿连接的刚-挠多层印制电路板规范
Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions
Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections
GB/T 14515-1993 有贯穿连接的单、双面挠性印制板技术条件
本标准规定了有贯穿连接的单、双面挠性印制板（不考虑其制造方法）在安装元器件前的基本性能和附加性能要求及其测试方法。 本标准中的贯穿连接可以是以金属化孔或以空心铆钉进行的电气连接。 本标准适用于有贯穿连接的单、双面挠性印制板，不适用于扁平电缆。 本标准是供需双方之间制订协议的
Specification for single and double sided flexible printed boards with through connections
BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范
Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods
Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections
GB/T 4588.10-1995 印制板 第10部分;有贯穿连接的刚挠双面印制板规范
本标准涉及有贯穿连接的刚挠双面印制板，而与它的制造方法关。本标准将作为供需双方签订合同的基础。本标准规定了应评定的性能和试验方法，并建立了鉴定性能和尺寸的统一要求。本标准所用的“有关规范”术语即指这些协议。本标准不适用于扁平电缆
Printed boards. Part 10: Specification for flex-rigid double-sided printed boards with through connections
GB/T 18334-2001 有贯穿连接的挠性多层印制板规范
本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的挠性多层印制板规范，与其制造方法关，目的是作为供需求双方签定协议的基础。 本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆
Specification for flexible multilayer printed boards with through conections
TCVN 6611-9-2000 印制板.第9部分:有贯穿连接的挠性多层印制板规范
Printed boards.Part 9.Specification for flexible multilayer printed boards with through connections
TIS 2075-2001 印制板.第9部分:有贯穿连接的挠性多层印制板规范
Printed boards.part 9: specification for fiexible multilayer printed boards with through connections
IEC 60326-9:1991 印制电路板 第9部分:有贯穿连接的挠性多层印制板规范
Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions
Printed boards; part 9: specification for flexible multilayer printed boards with through connections
KS C IEC 60326-9:2003 印制电路板.第9部分:有贯穿连接的挠性多层印制板规范
이 규격은 제조 방법에 관계 없이, 관통 접속하는 연성 다층 인쇄 회로기판에 적용 가능
Printed boards-Part 9:Specification for flexible multilayer printedboards with through connections
DS/IEC 326-11:1992 印制电路板．第11部分：有贯穿连接的挠性多层印制板规范
Printed boards. Part 11: Specification for flex rigid multilayer printed boards with through connections
KS C IEC 60326-9:2013 印制电路板 第9部分：有贯穿连接的挠性多层印制板规范
Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections
GB/T 18335-2001 有贯穿连接的刚挠多层印制板规范
本标准规定了被评定的性能、使用的测试方法，并制定了诸性能和尺寸的统一要求。 本标准适用于有贯穿连接的刚挠多层印制板，与其制造方法关，目的是作为供需双方签定协议的基础。本标准中使用的“有关规范”术语就是指这样的一种协议。本标准不适用于扁平电缆
Specification for flex-rigid multilayer printed boards with through connections
TCVN 6611-11-2000 印制板.第11部分:有贯穿连接的刚挠多层印制板规范
Printed boards.Part 11.Specification for flexrigid multilayer printed boards with through connections
TIS 2104-2001 印制板.第11部分:有贯穿连接的刚挠多层印制板规范
Printed boards.part 11: specification for flex-rigid multilayer printed boards with through connections
BS 6221-9:1991 印制电路板.第9部分:贯穿连接的挠性多层板规范
Relates to boards irrespective of their method of manufacture. It is intended as a basis on which agreements between purchaser and vendor can be made.
Printed wiring boards - Specification for flexible multilayer boards with through connections
IEC 60326-11:1991 印制电路板 第11部分:有贯穿连接的刚-挠多层印制电路板规范
Defines the characteristics to be assessed and the test methods to be used. Establishes uniform requirements for judging properties and dimensions
Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections
GB/T 14515-1993 有贯穿连接的单、双面挠性印制板技术条件
本标准规定了有贯穿连接的单、双面挠性印制板（不考虑其制造方法）在安装元器件前的基本性能和附加性能要求及其测试方法。 本标准中的贯穿连接可以是以金属化孔或以空心铆钉进行的电气连接。 本标准适用于有贯穿连接的单、双面挠性印制板，不适用于扁平电缆。 本标准是供需双方之间制订协议的
Specification for single and double sided flexible printed boards with through connections
BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范
Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods
Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections
GB/T 4588.10-1995 印制板 第10部分;有贯穿连接的刚挠双面印制板规范
本标准涉及有贯穿连接的刚挠双面印制板，而与它的制造方法关。本标准将作为供需双方签订合同的基础。本标准规定了应评定的性能和试验方法，并建立了鉴定性能和尺寸的统一要求。本标准所用的“有关规范”术语即指这些协议。本标准不适用于扁平电缆
Printed boards. Part 10: Specification for flex-rigid double-sided printed boards with through connections
编辑：北检院编辑部
