印制电路板/印制板组件检测

KS C IEC 61188-1-2:2003 印制电路板和印制电路板组件.设计和使用.第1.2部分:总要求.控制阻抗

이 규격은 회로 설계자, 포장 기술자, 인쇄 회로기판 제조자 및 공급 업자들이 사용함으

Printed boards and printed board assemblies－Design and use－Part 1－2：Generic requirements－Controlled impedance

DIN EN 61188-1-2:1999 印制电路板和印制电路板组件.设计和使用.第1-2部分:总要求.控制阻抗

The document is intended to be used by circuit designers, packaging engineers, printed board manufacturers and procurement personnel so that all may

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998

BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

KS C IEC 61188-1-2-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-2部分:一般要求 - 受控阻抗

IEC 61188-1-2:1998 印制电路板和印制电路板组件 设计和使用 第1-2部分:一般要求 控制阻抗

This part of IEC 61188 is intended to be used by circuit designers, packaging engineers, printed board manufacturers and procurement personnel so

Printed boards and printed boards assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

BS EN 61188-5-1:2003 印制电路板和印制电路板组件.设计和使用.连接方法(地面/共同的)考虑.总要求

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Attachment (land/joint) considerations - Generic requirements

BS EN 61188-5-1:2002 印制电路板和印制电路板组件 设计和使用 连接方法（地面/共同的）考虑 总要求

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent

Printed circuit board and printed circuit board assembly design and use of connection methods (ground/common) taking into account general requirements

KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况

이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여

Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies

KS C IEC 61188-5-1:2007 印制电路板和印制电路板组件.设计和使用.第5.1部分:附属物(所有的/共同的)要求

이 규격은 전자 구성품의 표면 부착을 위해 사용되는 랜드 패턴 구조에 관한 정보를 제공한다

Printed boards and printed board assemblies－Design and use－Part 5－1：Attachment(land/joint) considerations－Generic requirements

KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑

IEC 61188-1-1:1997 印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

DIN EN 61188-5-2:2004 印制电路板和印制电路板组件.设计和使用.第5-2部分:焊接(焊接区/接缝)条件.分立元件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003

BS EN 61188-5-8:2008 印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array

Printed boards and printed board assemblies — Design and use — Part 5-8: Attachment (land/joint) considerations — Area array components (BGA, FBGA, CGA, LGA)

DIN EN 61188-5-1:2003 印制电路板和印制电路板组件.设计和使用.第5-1部分:焊接(焊接区/接缝)考虑.总要求

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002

KS C IEC 61188-1-2:2003 印制电路板和印制电路板组件.设计和使用.第1.2部分:总要求.控制阻抗

이 규격은 회로 설계자, 포장 기술자, 인쇄 회로기판 제조자 및 공급 업자들이 사용함으

Printed boards and printed board assemblies－Design and use－Part 1－2：Generic requirements－Controlled impedance

DIN EN 61188-1-2:1999 印制电路板和印制电路板组件.设计和使用.第1-2部分:总要求.控制阻抗

The document is intended to be used by circuit designers, packaging engineers, printed board manufacturers and procurement personnel so that all may

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998

BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries.

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

KS C IEC 61188-1-2-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-2部分:一般要求 - 受控阻抗

IEC 61188-1-2:1998 印制电路板和印制电路板组件 设计和使用 第1-2部分:一般要求 控制阻抗

This part of IEC 61188 is intended to be used by circuit designers, packaging engineers, printed board manufacturers and procurement personnel so

Printed boards and printed boards assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

BS EN 61188-5-1:2003 印制电路板和印制电路板组件.设计和使用.连接方法(地面/共同的)考虑.总要求

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Attachment (land/joint) considerations - Generic requirements

BS EN 61188-5-1:2002 印制电路板和印制电路板组件 设计和使用 连接方法（地面/共同的）考虑 总要求

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent

Printed circuit board and printed circuit board assembly design and use of connection methods (ground/common) taking into account general requirements

KS C IEC 61188-1-1:2003 印制电路板和印制电路板组件.设计和使用.第1.1部分:总要求.电子组件的平整度情况

이 규격은 경질 인쇄 회로기판 및 그 조립의 편평도를 제어하는 몇 가지 요소에 대하여

Printed boards and printed board assemblies－Design and use－Part 1－1：Generic requirements－Flatness considerations for electronic assemblies

KS C IEC 61188-5-1:2007 印制电路板和印制电路板组件.设计和使用.第5.1部分:附属物(所有的/共同的)要求

이 규격은 전자 구성품의 표면 부착을 위해 사용되는 랜드 패턴 구조에 관한 정보를 제공한다

Printed boards and printed board assemblies－Design and use－Part 5－1：Attachment(land/joint) considerations－Generic requirements

KS C IEC 61188-1-1-2003(2019 印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑

IEC 61188-1-1:1997 印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

DIN EN 61188-5-2:2004 印制电路板和印制电路板组件.设计和使用.第5-2部分:焊接(焊接区/接缝)条件.分立元件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003

BS EN 61188-5-8:2008 印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array

Printed boards and printed board assemblies — Design and use — Part 5-8: Attachment (land/joint) considerations — Area array components (BGA, FBGA, CGA, LGA)

DIN EN 61188-5-1:2003 印制电路板和印制电路板组件.设计和使用.第5-1部分:焊接(焊接区/接缝)考虑.总要求

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002