QJ 2152-1991 挠性印制电路板技术条件
Specifications for flexible printed circuit boards
ANSI/IPC FA-251-1992 单面和双面挠性印制电路板装配指南.注:1991-09-09批准
This document is intended to provide the designer and manufacturing engineer the key issues related to flexible printed circuits assembly techniques
Assembly Guidelines for Single- and Double-Sided Flexible Printed Circuits / Note: Approved 1991-09-09.
T/CPCA 6302-2021 挠性及刚挠印制电路板
本文件规定了挠性及刚挠印制电路板的分类、材料、性能要求、试验方法、检验规则、标识、包装、运输和贮存。 本文件适用于成品单面、双面、多层挠性及刚挠印制电路板
Flexible and rigid-flexible printed circuit board
BS EN 123500:1990 电子元器件质量评定协调体系.分规范:带贯通连接的挠性印制电路板
Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection
Specification for harmonized system of quality assessment for electronic components - Sectional specification: flexible printed boards with through connections
BS EN 123400-800:1991 电子元器件质量评定协调体系.性能详细规范:贯通连接的挠性印制电路板
Relates to boards made with specified materials and surface finishes. To be read in conjunction with BS CECC 23000 and BS CECC 2340
Harmonized system of quality assessment for electronic components - Capability detail specification: flexible printed boards without through-connections
BS EN 123500-800:1991 电子元器件质量评定协调体系.性能详细规范:有贯通连接的挠性印制电路板
Relates to boards made with specified materials and surface finishes. To be read in conjunction with BS CECC 23000 and BS CECC 2350
Harmonized system of quality assessment for electronic components - Capability detail specification: flexible printed boards with through-connections
BS DD IEC/PAS 61249-3-1:2007 印制板和其他互连结构用材料.挠性印制电路板用覆铜层压板(粘合剂型和非粘合剂型)
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types
Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
0 电子元器件用质量评定协调体系规范.容量详细规范:直通连接件的挠性印制电路板
Relates to double-sided flexible printed boards. To be read in conjunction with BS EN 123500
0 电子元器件用质量评估协调体系规范.容量详细规范:直通连接件的挠性印制电路板
Relates to single and double-sided flexible printed boards. To be read in conjunction with BS EN 123400
DIN EN 123800:1997 分规范.带贯通连接的挠性多层印制电路板
The document establishes uniform requirements, the characteristics to be assessed and the test methods for flexible multilayer printed boards
Sectional specification - Flexible multilayer printed boards with through connection; German version EN 123800:1996
DIN EN 123400:1992 分规范.挠性连续连接印制电路板
This sectional specification is applicable to flexible printed boards without through connections
Sectional specification: flexible printed boards without through connections; german version EN 123400:1992
DIN EN 123500:1992 分规范.挠性带连续连接印制电路板
This secitonal specification is applicable to flexible printed boards with through connections
Sectional specification: flexible printed boards with through connections; german version EN 123500:1992
GB/T 13556-2017 挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits
BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范
Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods
Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections
BS 6221-10:1991 印制电路板.第10部分:贯穿连接的挠性-刚性双面印制电路板规范
Defines characteristics to be assessed, test methods to be used and establishes uniform requirements for judging properties and dimensions. The term
Printed wiring boards - Specification for flex-rigid double-sided printed boards with through connections
QJ 2152-1991 挠性印制电路板技术条件
Specifications for flexible printed circuit boards
ANSI/IPC FA-251-1992 单面和双面挠性印制电路板装配指南.注:1991-09-09批准
This document is intended to provide the designer and manufacturing engineer the key issues related to flexible printed circuits assembly techniques
Assembly Guidelines for Single- and Double-Sided Flexible Printed Circuits / Note: Approved 1991-09-09.
T/CPCA 6302-2021 挠性及刚挠印制电路板
本文件规定了挠性及刚挠印制电路板的分类、材料、性能要求、试验方法、检验规则、标识、包装、运输和贮存。 本文件适用于成品单面、双面、多层挠性及刚挠印制电路板
Flexible and rigid-flexible printed circuit board
BS EN 123500:1990 电子元器件质量评定协调体系.分规范:带贯通连接的挠性印制电路板
Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection
Specification for harmonized system of quality assessment for electronic components - Sectional specification: flexible printed boards with through connections
BS EN 123400-800:1991 电子元器件质量评定协调体系.性能详细规范:贯通连接的挠性印制电路板
Relates to boards made with specified materials and surface finishes. To be read in conjunction with BS CECC 23000 and BS CECC 2340
Harmonized system of quality assessment for electronic components - Capability detail specification: flexible printed boards without through-connections
BS EN 123500-800:1991 电子元器件质量评定协调体系.性能详细规范:有贯通连接的挠性印制电路板
Relates to boards made with specified materials and surface finishes. To be read in conjunction with BS CECC 23000 and BS CECC 2350
Harmonized system of quality assessment for electronic components - Capability detail specification: flexible printed boards with through-connections
BS DD IEC/PAS 61249-3-1:2007 印制板和其他互连结构用材料.挠性印制电路板用覆铜层压板(粘合剂型和非粘合剂型)
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types
Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
0 电子元器件用质量评定协调体系规范.容量详细规范:直通连接件的挠性印制电路板
Relates to double-sided flexible printed boards. To be read in conjunction with BS EN 123500
0 电子元器件用质量评估协调体系规范.容量详细规范:直通连接件的挠性印制电路板
Relates to single and double-sided flexible printed boards. To be read in conjunction with BS EN 123400
DIN EN 123800:1997 分规范.带贯通连接的挠性多层印制电路板
The document establishes uniform requirements, the characteristics to be assessed and the test methods for flexible multilayer printed boards
Sectional specification - Flexible multilayer printed boards with through connection; German version EN 123800:1996
DIN EN 123400:1992 分规范.挠性连续连接印制电路板
This sectional specification is applicable to flexible printed boards without through connections
Sectional specification: flexible printed boards without through connections; german version EN 123400:1992
DIN EN 123500:1992 分规范.挠性带连续连接印制电路板
This secitonal specification is applicable to flexible printed boards with through connections
Sectional specification: flexible printed boards with through connections; german version EN 123500:1992
GB/T 13556-2017 挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits
BS 6221-11:1991 印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范
Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods
Printed wiring boards - Specification for flex-rigid multilayer printed boards with through connections
BS 6221-10:1991 印制电路板.第10部分:贯穿连接的挠性-刚性双面印制电路板规范
Defines characteristics to be assessed, test methods to be used and establishes uniform requirements for judging properties and dimensions. The term
Printed wiring boards - Specification for flex-rigid double-sided printed boards with through connections
编辑：北检院编辑部
