SJ/T 11028-2015 电子器件用金铜钎料的分析方法 EDTA容量法测定铜
本标准规定了测定电子器件用金铜钎料中铜的EDTA容量法。 本标准适用于电子器件用金铜钎料中铜含量的测定。测定范围(质量分数)：18%～22
Analytical methods for gold copper brazing for electron device Determination of copper by EDTA volumetry
SJ/T 11028-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定铜
Methods of analysis for gold-copper brazing for electronic components - Determination of copper (Volumetric-EDTA method)
SJ/T 11029-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定镍
Methods of analysis for gold-copper brazing for electronic components - Determination of nickel (Volumetric-EDTA method)
SJ/T 11030-2015 电子器件用金铜及金镍钎料中杂质铅、锌、磷的ICP-AES测定方法
本标准规定了用ICP-AES测定铅、磷、锌的测试方法。 本标准适用于电子器件用金铜及金镍钎料中铅、锌、磷的测定，测定范围(质量分数)：铅0.0005 %～0.006%,磷0.0002% ～0.002%，锌0.001 % ～0.008
Test method for lead, phosphorus and zinc in gold copper and gold nickel brazing for electron device by ICP-AES
SJ/T 11030-1996 电子器件用金铜及金镍钎焊料的分析方法 双硫腙分光光度法测定铅
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of lead (spectrophotometric dithizone method)
SJ/T 11032-1996 电子器件用金铜及金镍钎焊料的分析方法 原子吸收分光光度法测定锌
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of zinc (spectrophotometric atomic absorption method)
SJ/T 11031-1996 电子器件用金铜及金镍钎焊料的分析方法 磷钼蓝分光光度法测定磷
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of phosphorus (spectrophotometric phosphomolybdate method)
SJ/T 10753-1996 电子器件用金、银及其合金钎焊料
Gold, silver and their alloy brazing for electronic devices
SJ/T 11020-1996 电子器件用银铜钎焊料的分析方法 碘量法测定铜
Methods of analysis for silver-copper brazing for electronic components - Determination of copper (iodimetric method)
ASTM F106-06 电子器件钎焊填料金属标准规范
1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices
Standard Specification for Brazing Filler Metals for Electron Devices
ASTM F106-12(2017 电子器件钎焊填料金属标准规范
1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices
Standard Specification for Brazing Filler Metals for Electron Devices
SJ/T 11025-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铅
Methods of analysis for silver brazing for electronic components - Determination of lead (spectrophotometric-atomic absorption method)
SJ/T 11023-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋
Methods of analysis for silver brazing for electronic components - Determination of bismuth (spectrophotometric-atomic absorption method)
EN 61190-1-3:2007 电子组件用连接材料.第1-3部分:电子钎焊用电子级钎料合金及助熔和不助熔固体钎料的要求
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
EN 61190-1-3:2002 电子组件用连接材料.第1-3部分:电子钎焊用电子级钎料合金及助熔和不助熔固体钎料的要求
Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
SJ/T 11028-2015 电子器件用金铜钎料的分析方法 EDTA容量法测定铜
本标准规定了测定电子器件用金铜钎料中铜的EDTA容量法。 本标准适用于电子器件用金铜钎料中铜含量的测定。测定范围(质量分数)：18%～22
Analytical methods for gold copper brazing for electron device Determination of copper by EDTA volumetry
SJ/T 11028-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定铜
Methods of analysis for gold-copper brazing for electronic components - Determination of copper (Volumetric-EDTA method)
SJ/T 11029-1996 电子器件用金铜钎焊料的分析方法 EDTA容量法测定镍
Methods of analysis for gold-copper brazing for electronic components - Determination of nickel (Volumetric-EDTA method)
SJ/T 11030-2015 电子器件用金铜及金镍钎料中杂质铅、锌、磷的ICP-AES测定方法
本标准规定了用ICP-AES测定铅、磷、锌的测试方法。 本标准适用于电子器件用金铜及金镍钎料中铅、锌、磷的测定，测定范围(质量分数)：铅0.0005 %～0.006%,磷0.0002% ～0.002%，锌0.001 % ～0.008
Test method for lead, phosphorus and zinc in gold copper and gold nickel brazing for electron device by ICP-AES
SJ/T 11030-1996 电子器件用金铜及金镍钎焊料的分析方法 双硫腙分光光度法测定铅
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of lead (spectrophotometric dithizone method)
SJ/T 11032-1996 电子器件用金铜及金镍钎焊料的分析方法 原子吸收分光光度法测定锌
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of zinc (spectrophotometric atomic absorption method)
SJ/T 11031-1996 电子器件用金铜及金镍钎焊料的分析方法 磷钼蓝分光光度法测定磷
Methods of analysis for gold-copper and gold-nickel brazing for electronic components - Determination of phosphorus (spectrophotometric phosphomolybdate method)
SJ/T 10753-1996 电子器件用金、银及其合金钎焊料
Gold, silver and their alloy brazing for electronic devices
SJ/T 11020-1996 电子器件用银铜钎焊料的分析方法 碘量法测定铜
Methods of analysis for silver-copper brazing for electronic components - Determination of copper (iodimetric method)
ASTM F106-06 电子器件钎焊填料金属标准规范
1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices
Standard Specification for Brazing Filler Metals for Electron Devices
ASTM F106-12(2017 电子器件钎焊填料金属标准规范
1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices
Standard Specification for Brazing Filler Metals for Electron Devices
SJ/T 11025-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铅
Methods of analysis for silver brazing for electronic components - Determination of lead (spectrophotometric-atomic absorption method)
SJ/T 11023-1996 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋
Methods of analysis for silver brazing for electronic components - Determination of bismuth (spectrophotometric-atomic absorption method)
EN 61190-1-3:2007 电子组件用连接材料.第1-3部分:电子钎焊用电子级钎料合金及助熔和不助熔固体钎料的要求
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
EN 61190-1-3:2002 电子组件用连接材料.第1-3部分:电子钎焊用电子级钎料合金及助熔和不助熔固体钎料的要求
Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
编辑：北检院编辑部
